← Back to Patent Explorer
US4923652A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of removing binder from powder molded products

Assignee: Mitsui Toatsu Chemicals Inc
•
Filing: 1987-07-01
•
Granted: 1990-05-08
•
Expires: 2007-07-01
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method of vaporizing and removing a binder from a powder-molded product containing the binder, which method comprises: coating the greater part of the surface of said powder-molded product with a thin resin film having air-tightness thereby leasing an exposed surface portion; pressurizing the thus-coated surface portion of the pressure-molded product hydrostatically; vaporizing the binder in the power-molded product under said hydrostatic pressurization; and removing the vaporized binder to the exterior of the power-molded product through said exposed surface portion not coated with the thin film.

Inventors

  • 👤 Norihiro Murakawa
  • 👤 Hisashi Isomura
  • 👤 Kazukiyo Miura
  • 👤 Shinichi Aoki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 03:15
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/622; C04B35/64; C04B35/626; C04B35/63; C04B35/638

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 87 words
A method of vaporizing and removing a binder from a powder-molded product containing a binder, which method comprises: coating all but 0.5% to 20% of the total surface area of said powder-molded product with an airtight thin resin film thereby leaving an exposed surface portion hydrostatically pressurizing the thus-coated surface portion of the pressure molded product; vaporizing the binder in the powder-molded product under said hydrostatic pressurization; and removing the vaporizing binder from the powder-molded product through said exposed surface portion not coated with the thin film.
Claim 2
Independent Claim 87 words
A method of vaporizing and removing a binder from a powder-molded product containing a binder, which method comprises: coating all but 0.5% to 20% of the total surface area of said powder-molded product with an airtight thin resin film thereby leaving an exposed surface portion hydrostatically pressurizing the thus-coated surface portion of the pressure molded product; vaporizing the binder in the powder-molded product under said hydrostatic pressurization; and removing the vaporizing binder from the powder-molded product through said exposed surface portion not coated with the thin film.
Claim 3
Dependent Claim 38 words
A method as set forth in claim 1 wherein said vaporization of the binder of the powder-molded product occurs by heating the powder-molded product and removing said vaporized binder from the powder-molded product through said exposed surface portion.
Claim 4
Dependent Claim 37 words
A method as set forth in claim 1, wherein the powder-molded product is subjected to vacuum suction-deaeration through said exposed surface portion to vaporize and remove said binder from the powder-molded product through said exposed surface portion.
Claim 5
Dependent Claim 43 words
A method as set forth in claim 1, wherein the powder-molded product is heated and at the same time subjected to vacuum suction-deaeration through said exposed surface portion to vaporize and remove said binder from the powder-molded product through said exposed surface portion.
Claim 6
Dependent Claim 17 words
A method as set forth in claim 1, wherein the powder-molded product is formed by injection molding.
Claim 7
Dependent Claim 17 words
A method as set forth in claim 1, wherein the powder-molded product is formed by slip casting.
Claim 8
Dependent Claim 15 words
A method as set forth in claim 1, wherein the powder is a ceramic powder.
Claim 9
Independent Claim 30 words
A method as set forth in any one of claims 1 to 7, wherein the powder-molded product after removal of the binder is subsequently ignited into a sintered ceramic product.
Claim 10
Dependent Claim 36 words
A method as set forth in claim 1 wherein said exposed surface portion of said powdered-molded product, uncovered with said thin resin film, represents 1% to 10% of the total surface area of said powder-molded product.

References Cited (Backward Citations)

US4248813A Cited
US4248813B1 Cited
JPS59198105A Cited
US4612146A Cited
US4647414A Cited
US4696777A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-05-07 1993-11-06 1994-05-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-05-07 1997-11-06 1998-05-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-05-07 2001-11-06 2002-05-08 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag