US4908571A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Contact probe assembly with fine positioning means
Assignee: International Business Machines Corp
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Filing: 1988-04-19
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Granted: 1990-03-13
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Expires: 2008-04-19
Abstract
Abstract A contact probe assembly is described comprising a motor-driven fine positioning means. The fine positioning means permits the contact probe assembly to move in two directions X and Y which are perpendicular to each other. For positioning several contact probe assemblies, provided with fine positioning means, closely adjacent to each other, the longitudinal axis of each fine positioning means extends perpendicularly to the plane defined by the X and the Y direction. An electromotor is provided for either direction of movement. In one embodiment, fine positioning in either direction is effected by a perpendicularly arranged hollow shaft, the lower end of which is eccentrically shaped, reciprocally moving a carrier slide which is permanently connected to the contact probe assembly. The hollow shaft for moving the contact probe assembly in the Y direction is arranged inside the hollow shaft for movement in the X direction. The travel performed is detected by sensors. In a second embodiment, the contact probe assembly is fine positioned by means of wedges, two of which connected to each other by a seesaw, rest on opposite surfaces of a quadrangular pyramid frustrum which is permanently connected to the contact probe assembly. The up and down movement of the wedges fine positions the contact probe assembly in the X and the Y direction, respectively.
Inventors
- 👤 Roland R. Stoehr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:21
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07314; G01R1/07392
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
168 words
In a system for the testing of the electrical characteristics of semiconductor devices wherein a contact probe assembly with a head comprising a maxtrix of test probe leads of millimeter diameter, electrically conductive wires which are arranged to contact the connector pads on said semiconductor device, the improvement to said contact probe assembly comprising: (a) a fine positioning means for aligning said wires to within a range of +/- 2 wire diameters to said pads, said positioning means having a motor-driven means which permits moving the contact probe assembly in two directions which are perpendicular to each other with the longitudinal axis of the positioning means being perpendicular to the plane defined by the two directions of movement with said fine positioning in the two directions which are perpendicular to each other being effected by a hollow shaft with a lower eccentrically shaped end such that upon rotation of said shaft, a follower slide, permanently connected to the contact probe assembly, is reciprocally moved, transferring its movement thereto.
Claim 2
Dependent Claim
168 words
In a system for the testing of the electrical characteristics of semiconductor devices wherein a contact probe assembly with a head comprising a maxtrix of test probe leads of millimeter diameter, electrically conductive wires which are arranged to contact the connector pads on said semiconductor device, the improvement to said contact probe assembly comprising: (a) a fine positioning means for aligning said wires to within a range of +/- 2 wire diameters to said pads, said positioning means having a motor-driven means which permits moving the contact probe assembly in two directions which are perpendicular to each other with the longitudinal axis of the positioning means being perpendicular to the plane defined by the two directions of movement with said fine positioning in the two directions which are perpendicular to each other being effected by a hollow shaft with a lower eccentrically shaped end such that upon rotation of said shaft, a follower slide, permanently connected to the contact probe assembly, is reciprocally moved, transferring its movement thereto.
Claim 3
Dependent Claim
28 words
Contact probe assembly according to claim 1 wherein the hollow shaft for the second direction of movement extends inside the hollow shaft for the first direction of movement.
Claim 4
Dependent Claim
36 words
Contact probe assembly according to claim 2 wherein the position reached by the contact probe assembly in response to the rotation of the hollow shafts is determined by a sensor operating as an inductive displacement transducer.
Claim 5
Dependent Claim
188 words
In a system for the testing of the electrical characteristics of semiconductor devices including a contact probe assembly with a head comprising a matrix of test probe leads of millimeter diameter, and electrically conductive wires which are arranged to contact the connector pads on said semiconductor device, the improvement to said contact probe assembly comprising: a fine positioning means for aligning said wires to within a range of +/-2 wire diameters to said pads, said positioning means having a motor-driven means which permits moving the contact probe assembly in two directions which are perpendicular to each other with the longitudinal axis of the positioning means being perpendicular to the plane defined by the two directions of movement, wherein said fine positioning in either of the two perpendicular directions is effected by first wedges and by second wedges resting on side faces of a quadrangular pyramid frustrum permanently connected to the contact probe assembly, said first wedges, upon being raised and lowered, shifting the contact probe assembly to the right or left, and said second wedges, upon being raised and lowered, shifting the contact probe assembly forwards and backwards.
Claim 6
Dependent Claim
188 words
In a system for the testing of the electrical characteristics of semiconductor devices including a contact probe assembly with a head comprising a matrix of test probe leads of millimeter diameter, and electrically conductive wires which are arranged to contact the connector pads on said semiconductor device, the improvement to said contact probe assembly comprising: a fine positioning means for aligning said wires to within a range of +/-2 wire diameters to said pads, said positioning means having a motor-driven means which permits moving the contact probe assembly in two directions which are perpendicular to each other with the longitudinal axis of the positioning means being perpendicular to the plane defined by the two directions of movement, wherein said fine positioning in either of the two perpendicular directions is effected by first wedges and by second wedges resting on side faces of a quadrangular pyramid frustrum permanently connected to the contact probe assembly, said first wedges, upon being raised and lowered, shifting the contact probe assembly to the right or left, and said second wedges, upon being raised and lowered, shifting the contact probe assembly forwards and backwards.
Claim 7
Dependent Claim
57 words
Contact probe assembly according to claim 5 wherein the first or second wedges associated with one of the two directions of movement are interconnected by a seesaw one arm of which engages the recess of a fork-shaped element having one wedge positioned at its lower end and the other arm of which is connected to another wedge.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-12 | 1993-09-11 | 1994-03-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-12 | 1997-09-11 | 1998-03-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-12 | 2001-09-11 | 2002-03-13 | $7700.00 | Window Closed / Lapsed |