Integrated scanning tunneling microscope

Claim 2

An integrated scanning tunneling microscope comprising: a substrate; a piezoelectric bimorph cantilever attached to said substrate at one end and with the other end having a protruding, conductive tip formed thereon, said tip terminating in a point, said bimorph further comprising two layers of piezoelectric material sandwiched between multiple pairs of electrodes in such a manner that three axis movement of said bimorph is caused by applying suitable potentials to said multiple pairs of electrodes; a conductive surface; means for holding said conductive surface such that the movement of said bimorph is sufficient to bring said tip within tunneling range of said conductive surface; bias means for applying a bias potential between said tip and said conductive surface sufficient to cause tunneling current to flow between said tip and said conductive surface; control means coupled to said bias means and coupled to said multiple pairs of electrodes for sensing the magnitude of the tunneling current flow and for adjusting the potentials applied between the appropriate pair or pairs of said electrodes so as to move said tip in a manner to stabilize said tunneling current.

Claim 3

An integrated scanning tunneling microscope comprising: a substrate; a piezoelectric bimorph cantilever attached to said substrate at one end and with the other end having a protruding, conductive tip formed thereon, said tip terminating in a point, said bimorph further comprising two layers of piezoelectric material sandwiched between multiple pairs of electrodes in such a manner that three axis movement of said bimorph is caused by applying suitable potentials to said multiple pairs of electrodes; a conducive surface; means for holding said conductive surface within the region of spatial overlap of the probability density function for the electrons of the atoms in said tip and the electrons of the atoms of said conductive surface; bias means for applying a bias potential between said tip and said conductive surface sufficient to cause tunneling current to flow between said tip and said conductive surface; control means coupled to said bias means and coupled to said multiple pairs of electrodes for sensing the magnitude of the tunneling current flow and for adjusting the potentials applied between the appropriate pair or pairs of said electrodes so as to move said tip in a manner to stabilize said tunneling current; wherein said means for holding said conductive surface close to said tip is a second substrate having a cavity formed therein and having said conductive surface in said cavity, said second substrate attached to said substrate so as to place said cavity over said bimorph such that said bimorph has room to move in all three axes and such that said conductive surface is held close to said tip such that the motion of the said bimorph is sufficient to bring said tip within tunneling range of the said conducting surface.

Claim 4

An integrated scanning tunneling microscope comprising: a substrate; a piezoelectric bimorph cantilever attached to said substrate at one end and with the other end having a protruding, conductive tip formed thereon, said tip terminating in a point, said bimorph further comprising two layers of piezoelectric material sandwiched between multiple pairs of electrodes in such a manner that three axis movement of said bimorph is caused by applying suitable potentials to said multiple pairs of electrodes; a conducive surface; means for holding said conductive surface within the region of spatial overlap of the probability density function for the electrons of the atoms in said tip and the electrons of the atoms of said conductive surface; bias means for applying a bias potential between said tip and said conductive surface sufficient to cause tunneling current to flow between said tip and said conductive surface; control means coupled to said bias means and coupled to said multiple pairs of electrodes for sensing the magnitude of the tunneling current flow and for adjusting the potentials applied between the appropriate pair or pairs of said electrodes so as to move said tip in a manner to stabilize said tunneling current; wherein said means for holding said conductive surface close to said tip is a second substrate having a cavity formed therein and having said conductive surface in said cavity, said second substrate attached to said substrate so as to place said cavity over said bimorph such that said bimorph has room to move in all three axes and such that said conductive surface is held close to said tip such that the motion of the said bimorph is sufficient to bring said tip within tunneling range of the said conducting surface.

Claim 5

The apparatus of claim 2 wherein said control means is integrated circuitry formed on said substrate.

Claim 6

The apparatus of claim 1 wherein said bimorph comprises: a first conductive layer patterned into a plurality of electrodes including means for applying different electrical potentials; a first layer of piezoelectric material formed over said first conductive layer; a second conductive layer formed over said first layer of piezoelectric material, a second layer of piezoelectric material formed over said second conductive layer; and a third conductive layer formed over said second layer of piezoelectric layer patterned into a plurality of electrodes aligned with said plurality electrodes patterned in said first conductive layer.

Claim 7

The apparatus of claim 4 wherein said first and second layers of piezoelectric material are zinc oxide lead zirconate titanate.

Claim 8

The apparatus of claim 1 wherein said bimorph comprises: a first conductive layer formed into at least tow independent electrodes including means for charging each electrode independently of any other with an electric potential; a first piezoelectric layer formed over said first conductive layer; a second conductive layer; a second piezoelectric layer formed over said second conductive layer; and a third conductive layer formed over said second piezoelectric layer and formed into at least two independent electrodes including means for charging each electrode with an electric potential.

Claim 9

The apparatus of claim 6 wherein said bimorph cantilever is comprised of two bimorph cantilevers which are attached to said substrate at separate points and which extend out over the substrate at right angles to each other from the respective points of attachment and which are joined at the location of said point.

Claim 10

The apparatus of claim 1 where said means for holding holds said conductive surface within approximately 10 angstroms of said tip.

Claim 11

An integrated apparatus comprising: a semiconductor substrate; an integrated bimorph cantilever having first and second ends, said first end attached to said substrate and having a tip at each second end, said tip having a point, said bimorph comprising: a first conductive layer patterned into a plurality of electrodes including means for charging each electrode with different electrical potentials; a first layer of piezoelectric material formed over said first conductive layer; a second conductive layer formed over said first layer of piezoelectric material to form a center electrode; a second layer of piezoelectric material formed over said second conductive layer; and a third conductive layer formed over said second layer of piezoelectric layer patterned into a plurality of electrodes aligned with said plurality electrodes patterned in said first conductive layer; a conductive surface; means coupled to said substrate for holding said conductive surface within a region such that the movement of said bimorph is sufficient to bring the tip within tunneling range of said conducting surface; control means integrated on said substrate and coupled to said tip, said conductive surface and said electrodes of said bimorph cantilever for providing a bias voltage between said tip and said conductive surface, and for measuring the current flowing between said tip and said conductive surface, and for causing the appropriate voltages to be applied between the appropriate pairs of electrodes to cause said tip to move in an appropriate manner so as to maintain a desired tunneling bias current.

Claim 12

An integrated apparatus comprising: a semiconductor substrate; an integrated bimorph cantilever having first and second ends, said first end attached to said substrate and having a tip at each second end, said tip having a point, said bimorph comprising: a first conductive layer patterned into a plurality of electrodes including means for charging each electrode with different electrical potentials; a first layer of piezoelectric material formed over said first conductive layer; a second conductive layer formed over said first layer of piezoelectric material to form a center electrode; a second layer of piezoelectric material formed over said second conductive layer; and a third conductive layer formed over said second layer of piezoelectric layer patterned into a plurality of electrodes aligned with said plurality electrodes patterned in said first conductive layer; a conductive surface; means coupled to said substrate for holding said conductive surface within a region such that the movement of said bimorph is sufficient to bring the tip within tunneling range of said conducting surface; control means integrated on said substrate and coupled to said tip, said conductive surface and said electrodes of said bimorph cantilever for providing a bias voltage between said tip and said conductive surface, and for measuring the current flowing between said tip and said conductive surface, and for causing the appropriate voltages to be applied between the appropriate pairs of electrodes to cause said tip to move in an appropriate manner so as to maintain a desired tunneling bias current.

Claim 13

The apparatus of claim 9 wherein said piezoelectric material is zinc oxide or lead zirconate titanate and wherein said electrodes are aluminum.

Claim 14

The apparatus of claim 10 wherein said tip is tantalum.

Claim 15

The apparatus of claim 10 wherein said tip is niobium.

Claim 16

The apparatus of claim 10 wherein said tip is made of aluminum coated with a noble metal.

Claim 17

The apparatus of claim 10 wherein said tip is a noble metal.

Claim 18

The apparatus of claim 10 wherein said tip is an electrical conductor.

Claim 19

An integrated scanning tunneling microscope comprising: a substrate; a piezoelectric bimorph motion transducer attached to said substrate, and having an end cantilevered in free space and having a protruding, conductive tip formed thereon, said tip terminating in a point where said tip has the physical shape, orientation and size characteristic of an integrated tip structure formed by evaporation of conductive material through a shadow mask formed of mask material having an aperture aligned over said cantilevered end using integrated circuit manufacturing techniques, said motion transducer including a plurality of pairs of electrodes for receiving signals to cause said motion transducer to move; a conductive surface; means for holding said conductive surface such that the movement of said motion transducer is sufficient to bring said tip within tunneling range of said conductive surface; bias means for applying a bias potential between said tip and said conductive surface sufficient to cause tunneling current to flow between said tip and said conductive surface; control means coupled to said bias means and coupled to said plurality of pairs of electrodes, for sensing the magnitude of the tunneling current flow and for adjusting the potentials applied between an appropriate pair or pairs of said electrodes so as to move said tip in a manner to adjust said tunneling current to a desired level.

Claim 20

An integrated scanning tunneling microscope comprising: a substrate; a piezoelectric bimorph motion transducer attached to said substrate, and having an end cantilevered in free space and having a protruding, conductive tip formed thereon, said tip terminating in a point where said tip has the physical shape, orientation and size characteristic of an integrated tip structure formed by evaporation of conductive material through a shadow mask formed of mask material having an aperture aligned over said cantilevered end using integrated circuit manufacturing techniques, said motion transducer including a plurality of pairs of electrodes for receiving signals to cause said motion transducer to move; a conductive surface; means for holding said conductive surface such that the movement of said motion transducer is sufficient to bring said tip within tunneling range of said conductive surface; bias means for applying a bias potential between said tip and said conductive surface sufficient to cause tunneling current to flow between said tip and said conductive surface; control means coupled to said bias means and coupled to said plurality of pairs of electrodes, for sensing the magnitude of the tunneling current flow and for adjusting the potentials applied between an appropriate pair or pairs of said electrodes so as to move said tip in a manner to adjust said tunneling current to a desired level.

Claim 21

The apparatus of claim 16 further comprising a conductive surface to be scanned integrally attached to said substrate located so that the said motion transducer is able to bring said tip within tunneling distance from said conductive surface.

Claim 22

The apparatus of claim 16 wherein said motion transducer comprises: a first piezoelectric bimorph having first and second ends and attached to said substrate at said first end and having said second end extending into free space away from said substrate; a second piezoelectric bimorph having first and second ends, said first end attached to said substrate and said second end extending into free space away from said substrate and attached to said second end of said first bimorph.

Claim 23

The apparatus of claim 18 wherein said first and second bimorphs each comprise a first film of piezoelectric material having first and second parallel surfaces sandwiched between film conductors which contact said parallel surfaces of said first film of piezoelectric material and a second film of piezoelectric material having first and second parallel surfaces sandwiched between film conductors which contact said parallel surfaces of said second film of piezoelectric material.

Claim 24

The apparatus of claim 19 further comprising a plurality of layers of silicon dioxide or silicon nitride insulating each said film conductor from all said piezoelectric material.

Claim 25

The apparatus of claim 16 wherein said motion transducer comprises: a piezoelectric bimorph transducer having a first end attached to said substrate and having a second end cantilevered in free space, comprised of at least two layers of piezoelectric film and a plurality of electrodes, with said plurality of electrodes arranged so as to sandwich said two layers of piezoelectric film and arranged relative to said two layers of piezoelectric film such that three dimensional movement of said second end is caused by the application of suitable voltage differences between groups of said electrodes.

Claim 26

The apparatus of claim 21 wherein said bimorph transducer is comprised of a first film of piezoelectric material having first and second parallel surfaces and having two or more film conductive electrodes formed so as to contact said first surface and having another film conductive electrode formed so as to contact said second surface, and further comprising a second thin film of piezoelectric material having first and second parallel surfaces, said first surface of said second piezoelectric film formed so as to contact said electrode which contacts said second surface of said first piezoelectric layer, and having at least one electrode formed so as to contact said second surface.

Claim 27

The apparatus of claim 22 further comprising a plurality of layers of silicon dioxide or silicon nitride insulating all said electrodes from adjacent layers of piezoelectric material.