Process for making high performance pressure sensitive adhesive tapes

Claim 2

A process for coating curable pressure sensitive adhesive material onto a backing film, said process comprising: introducing into an extruder through a feed unit a pressure sensitive adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and solvent for the pressure sensitive adhesive matrix, said solvent being present in the composition in an amount of from about 20% to about 60% by volume of the composition; conveying the adhesive composition through the extruder; heating the adhesive composition to a temperature of from about 80° C. to about 160° C. as it is conveyed through the extruder; reducing the pressure in at least one section of the extruder sufficiently to evaporate at least a portion of the solvent in the pressure sensitive adhesive composition conveyed through that section; removing the evaporated solvent from the extruder; and extruding solvent-reduced curable pressure sensitive adhesive material onto a backing film to thereby provide a uniform coating of pressure sensitive adhesive on the backing film.

Claim 3

A process as claimed in claim 1, wherein substantially all of the solvent is removed from the adhesive composition so that a solvent-free pressure sensitive adhesive material is extruded.

Claim 4

A process as claimed in claim 2 wherein the extruded adhesive material has residual free-monomer concentration of less than about 0.1% by weight.

Claim 5

A process as claimed in claim 1 wherein the extruded adhesive material is essentially free of bubbles.

Claim 6

A process as claimed in claim 1, wherein the pressure is reduced in at least two sections of the extruder sufficiently to evaporate at least a portion of the solvent in the adhesive composition conveyed through each section.

Claim 7

A process as claimed in claim 1 further comprising electron beam curing the extruded adhesive material.

Claim 8

A process for producing sheets of curable pressure sensitive adhesive material, said process comprising: providing a twin screw extruder having at least one upstream feed unit and at least one downstream solvent removal unit, said solvent removal unit comprising a barrel section having a large vent opening, a vacuum pump, and a duct surrounding the vent opening and extending from the barrel section to the vacuum pump whereby the vacuum pump can be activated to reduce the pressure within the barrel section, vent opening and duct; introducing into the feed unit of the extruder an adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and a solvent for the pressure sensitive adhesive polymer matrix, said solvent being present in an amount of from about 20% to about 60% by volume of the adhesive composition; conveying the composition through the extruder; heating the adhesive composition to a temperature of from about 8° C. to about 160° C. as it is conveyed through the extruder; section; and activating the vacuum pump to reduce the pressure in the barrel section of the solvent removal unit sufficientyl to evaporate at least a portion of the solvent in the adhesive composition conveyed through that section; and extruding curable pressure sensitive adhesive material through a sheet die onto a backing film to provide a uniform coating of pressure sensitive adhesive on the backing film.

Claim 9

A process for producing sheets of curable pressure sensitive adhesive material, said process comprising: providing a twin screw extruder having at least one upstream feed unit and at least one downstream solvent removal unit, said solvent removal unit comprising a barrel section having a large vent opening, a vacuum pump, and a duct surrounding the vent opening and extending from the barrel section to the vacuum pump whereby the vacuum pump can be activated to reduce the pressure within the barrel section, vent opening and duct; introducing into the feed unit of the extruder an adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and a solvent for the pressure sensitive adhesive polymer matrix, said solvent being present in an amount of from about 20% to about 60% by volume of the adhesive composition; conveying the composition through the extruder; heating the adhesive composition to a temperature of from about 8° C. to about 160° C. as it is conveyed through the extruder; section; and activating the vacuum pump to reduce the pressure in the barrel section of the solvent removal unit sufficientyl to evaporate at least a portion of the solvent in the adhesive composition conveyed through that section; and extruding curable pressure sensitive adhesive material through a sheet die onto a backing film to provide a uniform coating of pressure sensitive adhesive on the backing film.

Claim 10

A process as claimed in claim 7, wherein the extruder comprises three solvent removal units.

Claim 11

A process as claimed in claim 7, wherein the extruded curable pressure sensitive adhesive material is solvent-free.

Claim 12

A process as claimed in claim 9, wherein the residual free-monomer concentration of the extruded curable pressure sensitive adhesive material is less than about 0.1% by weight.

Claim 13

A process as claimed in claim 7, wherein the pressure sensitive adhesive composition is heated to a temperature of from about 100° to about 160° C. as it is conveyed through the extruder and the pressure in the solvent removal units is reduced from about 150 to about 100 torr.

Claim 14

A process as claimed in claim 7 wherein the adhesive composition comprises at least one filler and wherein the solid filler is introduced into the extruder separately from the curable pressure sensitive adhesive polymer matrix and solvent.

Claim 15

A process as claimed in claim 12 wherein the filler is selected from the group consisting of hollow microspheres, solid microspheres, pigments, fumed silica and mixtures thereof.

Claim 16

A process as claimed in claim 12 wherein the extruder comprises a downstream feed unit and the curable pressure sensitive adhesive polymer matrix and solvent is introduced into the upstream unit and the filler is introduced in the downstream feed unit.

Claim 17

A process as claimed in claim 12 wherein the upstream feed unit comprises a first feed port on the lower side of the extruder and a second feed port on the upper side of the extruder and wherein the curable pressure sensitive adhesive polymer matrix and solvent is introduced into the extruder through the first feed port and the filler is introduced through the second feed port.

Claim 18

A process as claimed in claim 7 further comprising: providing a second twin screw extruder having at least one second feed unit and at least one second solvent removal unit, said second solvent removal unit comprising a barrel section having a large vent opening, a vacuum pump, and a duct surrounding the vent opening and extending from the barrel section to the vacuum pump whereby the vacuum pump can be activated to reduce the pressure within the barrel section, vent opening and duct; connecting the first and second extruders to that products from both extruders are extruded through a single sheet die; introducing into the feed unit of the second extruder a second adhesive composition comprising a curable adhesive polymer matrix and solvent for the adhesive polymer matrix, said solvent being present in an amount of from about 20% to about 60% by volume of the adhesive composition; conveying the second composition through the second extruder; activating the vacuum pump of the second solvent removal unit to reduce the pressure in the a barrel section of the second solvent removal unit sufficiently to evaporate at least a portion of the solvent in the second adhesive composition conveyed through that section; and co-extruding a sheet of curable adhesive having at least one layer of the first adhesive composition with reduced solvent content and at least one layer of the second adhesive composition having reduced solvent content onto a backing film.

Claim 19

A process as claimed in claim 16 wherein the sheet of curable adhesive is solvent free.

Claim 20

A process as claimed in claim 17 wherein the sheet of curable adhesive has a residual monomer concentration of less than about 0.1% by weight.

Claim 21

A process as claimed in claim 16 wherein the sheet of curable adhesive comprises a middle layer of the first adhesive composition with reduced solvent content and two skin layers of the second adhesive composition with reduced solvent content.

Claim 22

A process as claimed in claim 19 wherein the first adhesive composition comprises hollow microspheres and the second adhesive composition is essentially free of hollow microspheres.

Claim 23

A process as claimed in claim 16 further comprising electron beam curing the sheet of curable adhesive.

Claim 24

A process as claimed in claim 7 wherein the sheet die comprises spaced-apart upper and lower plates forming a chamber therebetween and wherein at least one of the upper and lower plates comprises one or more of holes extending from the outer surface of the plate into the chamber, said sheet die further comprising a manifold mounted on the exterior surface of at least one of the upper and lower plates in surrounding relation to the holes, and wherein the process further comprises: introducing into the manifold, the second adhesive composition; and co-extruding a sheet of curable adhesive material comprising a carrier layer of the first adhesive composition with reduced solvent content and strips of the second adhesive composition at the surface of the carrier layer.

Claim 25

A process as claimed in claim 22 wherein the strips are broken, forming patches of the second adhesive composition at the surface of the carrier layer.

Claim 26

A process for coating curable solution polymerized pressure sensitive adhesive material onto a backing film, said process comprising: introducing into an extruder through a feed unit a pressure sensitive adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and solvent for the pressure sensitive adhesive matrix, the solvent being present in the composition in an amount of from about 20% to about 60% by volume of the composition, said composition is at a temperature less than the boiling point of the solvent in the composition; conveying the adhesive composition through the extruder; heating the adhesive composition to a temperature of from about 80° C. to about 160° C. as it is conveyed through the extruder; reducing the pressure in at least one section of the extruder sufficiently to evaporate at least a portion of the solvent in the pressure sensitive adhesive composition conveyed through the section; removing the evaporated solvent from the extruder; and extruding a solvent-free curable adhesive material as a uniform coating onto a backing film.

Claim 27

A process for coating curable solution polymerized pressure sensitive adhesive material onto a backing film, said process comprising: introducing into an extruder through a feed unit a pressure sensitive adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and solvent for the pressure sensitive adhesive matrix, the solvent being present in the composition in an amount of from about 20% to about 60% by volume of the composition, said composition is at a temperature less than the boiling point of the solvent in the composition; conveying the adhesive composition through the extruder; heating the adhesive composition to a temperature of from about 80° C. to about 160° C. as it is conveyed through the extruder; reducing the pressure in at least one section of the extruder sufficiently to evaporate at least a portion of the solvent in the pressure sensitive adhesive composition conveyed through the section; removing the evaporated solvent from the extruder; and extruding a solvent-free curable adhesive material as a uniform coating onto a backing film.

Claim 28

A process for coating curable pressure sensitive adhesive material onto a backing film, said process comprising: introducing into an extruder through a feed unit a pressure sensitive adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and solvent for the pressure sensitive adhesive matrix, said solvent being present in the composition in an amount of from about 20% to about 60% by volume of the composition; conveying the adhesive composition through the extruder; heating the adhesive composition to a temperature of from about 80° C. to a temperature below the degradation temperature of the adhesive composition as it is conveyed through the extruder; reducing the pressure in at least one section of the extruder sufficiently to evaporate at least a portion of the solvent in the pressure sensitive adhesive composition conveyed through that section; removing the evaporated solvent from the extruder; and extruding solvent-reduced curable pressure sensitive adhesive material onto a backing film to thereby provide a uniform coating of pressure sensitive adhesive on the backing film.

Claim 29

A process for coating curable pressure sensitive adhesive material onto a backing film, said process comprising: introducing into an extruder through a feed unit a pressure sensitive adhesive composition comprising a curable pressure sensitive adhesive polymer matrix and solvent for the pressure sensitive adhesive matrix, said solvent being present in the composition in an amount of from about 20% to about 60% by volume of the composition; conveying the adhesive composition through the extruder; heating the adhesive composition to a temperature of from about 80° C. to a temperature below the degradation temperature of the adhesive composition as it is conveyed through the extruder; reducing the pressure in at least one section of the extruder sufficiently to evaporate at least a portion of the solvent in the pressure sensitive adhesive composition conveyed through that section; removing the evaporated solvent from the extruder; and extruding solvent-reduced curable pressure sensitive adhesive material onto a backing film to thereby provide a uniform coating of pressure sensitive adhesive on the backing film.

Claim 30

A process as claimed in claim 25 wherein the adhesive composition is heated to a temperature of from about 80° C. to about 190° C. as it is conveyed through the extruder.

Claim 31

A process as claimed in claim 25 wherein the adhesive composition is heated to a temperature of from about 80° C. to about 160° C. as it is conveyed through the extruder.