US4905021A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optical printer head with a light emitting diode array
Assignee: Hitachi Cable Ltd
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Filing: 1989-02-24
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Granted: 1990-02-27
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Expires: 2009-02-24
Abstract
Abstract An optical printer head with a light emitting diode array comprises means for setting a distance between a light emitting surface of a light emitting diode array chip and a rod lens array. The means is provided with two reference position levels at which the light emitting diode array chip and the rod lens array are held. Therefore, there is no necessity for adjusting the distance between the light emitting diode array chip and the rod lens array so that a productivity thereof is much improved.
Inventors
- 👤 Hisao Iizuka
- 👤 Shigetoshi Hiratsuka
- 👤 Kiyohiko Tanno
- 👤 Teruji Satou
- 👤 Norihiro Ashizuka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:11
CPC Classifications
G; G06; G06K; G06K15/00; G06K15/02; G06K15/12; G06K15/1238; G06K15/1242; G06K15/1247; B; B41; B41J; B41J2/00; B41J2/435; B41J2/447; B41J2/45; B41J2/451
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
104 words
A substrate with a light emitting diode array comprising: electric lead patterns provided on a ceramic substrate, a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said ceramic substrate, a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said ceramic substrate, and an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a third portion of said electric lead patterns provided on said ceramic substrate.
Claim 2
Dependent Claim
104 words
A substrate with a light emitting diode array comprising: electric lead patterns provided on a ceramic substrate, a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said ceramic substrate, a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said ceramic substrate, and an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a third portion of said electric lead patterns provided on said ceramic substrate.
Claim 3
Dependent Claim
31 words
A substrate with a light emitting diode array according to claim 1. wherein said electric conducting member is of coefficient of thermal expansion approximately equal to that of said ceramic substrate.
Claim 4
Dependent Claim
32 words
A substrate with a light emitting diode array according to claim 1, wherein said electric conducting member is of a composite metal member composed of three layers including copper, invar and copper.
Claim 5
Dependent Claim
28 words
A substrate with a light emitting diode array according to claim 1, wherein said composite metal member is soldered to said third portion of said electric lead patterns.
Claim 6
Dependent Claim
40 words
A substrate with a light emitting diode array according to claim 4, wherein said first portion of said electric lead patterns includes a common line pattern, and said second portion of said electric lead patterns includes a ground line pattern.
Claim 7
Dependent Claim
29 words
A substrate with a light emitting diode array according to claim 5, wherein said composite metal member is mounted on either one of said common and ground line patterns.
Claim 8
Dependent Claim
35 words
A substrate with a light emitting diode array according to claim 5, wherein said composite metal member includes two composite metal members which are mounted on both of said common and ground line patterns respectively.
Claim 9
Dependent Claim
119 words
A substrate with a light emitting diode array comprising, electric lead patterns provided on a first surface of a ceramic substrate, a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said first surface of said ceramic substrate, a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said first surface of said ceramic substrate, and an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a second surface of said ceramic substrate and connected through through-holes to said electric lead patterns.
Claim 10
Dependent Claim
119 words
A substrate with a light emitting diode array comprising, electric lead patterns provided on a first surface of a ceramic substrate, a light emitting diode array chip mounted on a first portion of said electric lead patterns provided on said first surface of said ceramic substrate, a driver integrated circuit for driving said light emitting diode array chip, said driver integrated circuit being mounted on a second portion of said electric lead patterns provided on said first surface of said ceramic substrate, and an electric conducting member for decreasing electric resistance of said electric lead patterns, said electric conducting member being mounted on a second surface of said ceramic substrate and connected through through-holes to said electric lead patterns.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-26 | 1993-08-28 | 1994-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-26 | 1997-08-28 | 1998-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-26 | 2001-08-28 | 2002-02-27 | $7700.00 | Window Closed / Lapsed |