US4902608A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Immersion development and rinse machine and process
Assignee: Texas Instruments Inc
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Filing: 1987-12-17
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Granted: 1990-02-20
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Expires: 2007-12-17
Abstract
Abstract A method of processing semiconductor wafers to develop photoresist patterns which includes mounting a semiconductor on a vacuum chuck, immersing and spinning the semiconductor wafer in a developer fluid, removing the semiconductor wafer from the semiconductor wafer from the developer fluid, lowering the semiconductor wafer into the rinse bath, then removing the semiconductor wafer from the rinse bath and spin drying it.
Inventors
- 👤 William E. Lamb
- 👤 Jerome L. Kowaleski
- 👤 Vojtech Haikl
- 👤 Alan R. Bittancourt
- 👤 Harvey S. Daugherty
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:33
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
110 words
A method of processing semiconductors in a two tank processing apparatus to develop photoresist patterns thereon, comprising the steps of; mounting a semiconductor on a vacuum chuck, immersing and spinning the semiconductor wafer upside down in a developer fluid in a first tank, circulating and filtering the developer in a controlled up-flow system, maintaining the developer solution at a constant developer strength, filling the space above the developer fluid with nitrogen while the wafer is being developed, removing the semiconductor wafer from the developer fluid, lowering the semiconductor wafer into a rinse bath in a second tank, then removing the semiconductor wafer from the rinse bath and spin drying it.
Claim 2
Independent Claim
110 words
A method of processing semiconductors in a two tank processing apparatus to develop photoresist patterns thereon, comprising the steps of; mounting a semiconductor on a vacuum chuck, immersing and spinning the semiconductor wafer upside down in a developer fluid in a first tank, circulating and filtering the developer in a controlled up-flow system, maintaining the developer solution at a constant developer strength, filling the space above the developer fluid with nitrogen while the wafer is being developed, removing the semiconductor wafer from the developer fluid, lowering the semiconductor wafer into a rinse bath in a second tank, then removing the semiconductor wafer from the rinse bath and spin drying it.
Claim 3
Dependent Claim
20 words
The method according to claim 1, including the step of heating and maintaining the developer fluid at a predetermined temperature.
Claim 4
Dependent Claim
18 words
The method according to claim 1, wherein the developer fluid is circulated in a temperature controlled up-flow system.
Claim 5
Dependent Claim
14 words
The method according to claim 1, wherein said rinse bath is circulated and filtered.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-19 | 1993-08-21 | 1994-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-19 | 1997-08-21 | 1998-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-19 | 2001-08-21 | 2002-02-20 | $7700.00 | Window Closed / Lapsed |