US4902556A — Multi-layer polynorbornene and epoxy laminates an…

Claim 1

Independent Claim 136 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one polynorbornene prepreg; (b) pretreating the surface of a conductive film with a solution of a silane compound effective to increase the bond strength between the substrate layer and the conductive film and laminating the conductive film to the substrate layer and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film; and (d) sandwiching and laminating an additional layer, formed of at least one epoxy prepreg, between the etched surface of the substrate and the surface of an additional conductive film, wherein the silane employed in step (b) is effective to increase the bond strength between the metal film and the polynorbornene layer, and the polynorbornene layer and the epoxy layer.

Claim 2

Dependent Claim 136 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one polynorbornene prepreg; (b) pretreating the surface of a conductive film with a solution of a silane compound effective to increase the bond strength between the substrate layer and the conductive film and laminating the conductive film to the substrate layer and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film; and (d) sandwiching and laminating an additional layer, formed of at least one epoxy prepreg, between the etched surface of the substrate and the surface of an additional conductive film, wherein the silane employed in step (b) is effective to increase the bond strength between the metal film and the polynorbornene layer, and the polynorbornene layer and the epoxy layer.

Claim 3

Dependent Claim 22 words

A process of claim 1 wherein the conductive film is copper and a surface of the copper film has a bronze coating.

Claim 4

Dependent Claim 16 words

A process of claim 2 wherein each surface of the copper film has a bronze coating.

Claim 5

Dependent Claim 24 words

A process of claim 1 wherein the polynorbornene polymer is unsaturated and is derived from a cycloolefin monomer selected from methyltetracyclododecene, vinyl-norbornene or dicyclopentadiene.

Claim 6

Dependent Claim 26 words

A process of claim 1 wherein the monomers of the polynorbornene polymer comprise in weight to weight ratio about 50-75 percent methyltetracyclododecene to 25-50 percent vinylnorbornene.

Claim 7

Dependent Claim 25 words

A process of claim 1 wherein the monomers of the polynorbornene polymer comprise in weight-to-weight ratio about 75-90 percent dicyclopentadiene to about 10-25 percent vinyl-norbornene.

Claim 8

Dependent Claim 30 words

A process of claim 1 wherein polynorbornene prepregs are prepared by immersing a glass cloth in a dipping solution comprising norbornene monomers and a curing agent which initiates radical crosslinking.

Claim 9

Dependent Claim 28 words

A process of claim 1 wherein the silane is selected from the group consisting of 3-methylacryloyloxypropyltrimethoxysilane, 3-(N-styrylmethyl-2aminoethylamino) propyltrimethoxysilane hydrochloride, 3-(N-allyl-2-aminoethylamino)-propyltrimethoxysilane hydrochloride, N-(styrylmethyl)-3-aminopropyltrimethoxysilane hydrochloride, N-2-aminoethyl-3-aminopropyltrimethoxysilane, and 3-(N-Benzyl-2-aminoethylamino)-propyltrimethoxy silane hydrochloride.

Claim 10

Dependent Claim 21 words

A process of claim 1 wherein the lamination is performed at a temperature above the glass transition temperature of the polynorbornene.

Claim 11

Dependent Claim 28 words

A process of claim 1 wherein the lamination is performed at temperatures between about ambient and about 250° C. and at a pressure of from about 500-1100 PSI.

Claim 12

Dependent Claim 35 words

A process of claim 2 further comprising placing one or more substrate layers in a stacking sequence with one or more epoxy layers and one or two copper layers at the outside of the stack.

Claim 13

Dependent Claim 21 words

A process of claim 7 wherein the cloth of each step is impregnated with from 30% to 80% by weight polymer.

Claim 14

Dependent Claim 25 words

A process of claim 1 wherein at least one of the copper film layers is imaged and completely etched prior to a subsequent laminating step.

Claim 15

Dependent Claim 23 words

A process of claim 13 wherein the copper pattern resulting from etching the image is subjected to oxidation prior to further lamination steps.

Claim 16

Dependent Claim 23 words

A process of claim 1 further comprising continuing steps (a) through (d) to produce a laminate of the sequence comprising copper/epoxy/etched copper/polynorbornene/etched copper/epoxy/copper.

Claim 17

Dependent Claim 23 words

A process of claim 1 wherein, between steps (c) and (d), the patterned substrate layer is further treated with a silane coupling agent.

Claim 18

Dependent Claim 37 words

A process of claim 1 further comprising the step of interposing a layer of film derived from a C 2 -C 4 polymer between the polynorbornene layer and the conductive film prior to curing the polynorbornene layer.

Claim 19

Dependent Claim 144 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one epoxy prepreg; (b) laminating a conductive film to a surface of said substrate and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film to produce a copper-patterned surface on the substrate; (d) providing an additional layer comprising a polynorbornene prepreg and pretreating the copper-patterned surface of the substrate layer with a silane solution effective to increase the bond strength between the copper-patterned surface and the polynorbornene layer; (e) pretreating the surface of an additional conductive film with a silane solution effective to increase the bond strength between the conductive film and the polynorbornene layer; and (f) sandwiching, laminating and curing the polynorbornene layer between the copper-patterned surface of the substrate and the silane-treated surface of the conductive film.

Claim 20

Dependent Claim 144 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one epoxy prepreg; (b) laminating a conductive film to a surface of said substrate and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film to produce a copper-patterned surface on the substrate; (d) providing an additional layer comprising a polynorbornene prepreg and pretreating the copper-patterned surface of the substrate layer with a silane solution effective to increase the bond strength between the copper-patterned surface and the polynorbornene layer; (e) pretreating the surface of an additional conductive film with a silane solution effective to increase the bond strength between the conductive film and the polynorbornene layer; and (f) sandwiching, laminating and curing the polynorbornene layer between the copper-patterned surface of the substrate and the silane-treated surface of the conductive film.

Claim 21

Dependent Claim 21 words

A process of claim 18 wherein the polynorbornene polymer is derived from a cycloolefin monomer selected from methyltetracyclododecene, vinylnorbornene or dicyclopentadiene.

Claim 22

Dependent Claim 27 words

A process of claim 18 wherein the monomers of the polynorbornene polymer comprise in a weight to weight ratio about 50-75 percent methyltetracyclododecene to 25-50 percent vinyl-norbornene.

Claim 23

Dependent Claim 26 words

A process of claim 18 wherein the monomers of the polynorbornene polymer comprise in weight-to-weight ratio of about 75-90 percent dicyclopentadiene to about 10-25 percent vinyl-norbornene.

Claim 24

Dependent Claim 30 words

A process of claim 18 wherein polynorbornene prepregs are prepared by immersing a glass cloth in a dipping solution comprising norbornene monomers and a curing agent which initiates radical crosslinking.

Claim 25

Dependent Claim 27 words

A process of claim 18 wherein the silane is selected from the group consisting of 3-methylacryloyloxypropyltrimethoxysilane, 3-(N-styrylmethyl-2-aminoethylamino)propyltrimethoxysilane hydrochloride, 3-(N-allyl-2-aminoethylamino)-propyltrimethoxysilane hydrochloride, N-(styrylmethyl)-3-aminopropyltrimethoxysilane hydrochloride, N-2-aminoethyl-3-aminopropyltrimethoxysilane, and 3-(N-Benzyl-2-aminoethylamino)-propyltrimethoxy silane hydrochloride.

Claim 26

Dependent Claim 21 words

A process of claim 18 wherein the lamination is performed at a temperature above the glass transition temperature of the polynorbornene.

Claim 27

Dependent Claim 28 words

A process of claim 18 wherein the lamination is performed at temperatures between about ambient and about 250° C. and at a pressure of from about 500-1100 PSI.

Claim 28

Dependent Claim 35 words

A process of claim 18 further comprising placing one or more substrate layers in a stacking sequence with two or more polynorbornene layers and two or more copper layers at the outside of the stack.

Claim 29

Dependent Claim 21 words

A process of claim 18 wherein the cloth of each step is impregnated with from 30% to 80% by weight polymer.

Claim 30

Dependent Claim 25 words

A process of claim 18 wherein at least one of the copper film layers is imaged and completely etched prior to a subsequent laminating step.

Claim 31

Dependent Claim 23 words

A process of claim 28 wherein the copper pattern resulting from etching the image is subjected to oxidation prior to further lamination steps.

Claim 32

Dependent Claim 23 words

A process of claim 18 further comprising continuing steps (a) through (d) to produce a laminate of the sequence comprising copper/polynorbornene/etched copper/epoxy/etched copper/polynorbornene/copper.

Claim 33

Dependent Claim 23 words

A process of claim 18 wherein, between steps (c) and (d), the patterned substrate layer is further treated with a silane coupling agent.

Claim 34

Dependent Claim 41 words

A process of claim 17 further comprising the step of interposing a layer of polyolefin film derived from a C 2 -C 4 polymer between the polynorbornene layer and the conductive film prior to the lamination and cure of step (f).

Claim 35

Dependent Claim 90 words

A process of producing a laminate, comprising the steps of: (a) providing a polynorbornene solution comprising polynorbornene polymers dissolved within a solvent; (b) impregnating a non-cellulosic cloth with the solution and drying the impregnated cloth to remove a substantial portion of solvent to form a substrate layer; (c) pretreating a surface of a sheet comprising at least partially-cured epoxy resin with a solution of a silane compound effective to increase the bond strength between the substrate layer and epoxy layer; and (d) laminating the epoxy layer to the substrate layer.

Claim 36

Dependent Claim 90 words

A process of producing a laminate, comprising the steps of: (a) providing a polynorbornene solution comprising polynorbornene polymers dissolved within a solvent; (b) impregnating a non-cellulosic cloth with the solution and drying the impregnated cloth to remove a substantial portion of solvent to form a substrate layer; (c) pretreating a surface of a sheet comprising at least partially-cured epoxy resin with a solution of a silane compound effective to increase the bond strength between the substrate layer and epoxy layer; and (d) laminating the epoxy layer to the substrate layer.

Claim 37

Dependent Claim 12 words

A printed circuit wiring board produced by a process of claim 1.

Claim 38

Dependent Claim 12 words

A printed circuit wiring board produced by a process of claim 18.

Claim 39

Dependent Claim 28 words

A laminate comprising at least one layer comprising at least one epoxy prepreg layer laminated to at least one polynorbornene prepreg layer comprising at least one polynorbornene prepreg.

Claim 40

Dependent Claim 28 words

A laminate comprising at least one layer comprising at least one epoxy prepreg layer laminated to at least one polynorbornene prepreg layer comprising at least one polynorbornene prepreg.

Claim 41

Dependent Claim 65 words

A multi-layer printed circuit wiring board comprising at least one epoxy layer laminated to at least one polynorbornene layer, an etched conductive metal pattern between the epoxy layer and the polynorbornene layer and a conductive metal film on at least one major surface of the laminate; said epoxy layer comprising at least one epoxy prepreg and said polynorbornene layer comprising at least one polynorbornene prepreg.

Claim 42

Dependent Claim 65 words

A multi-layer printed circuit wiring board comprising at least one epoxy layer laminated to at least one polynorbornene layer, an etched conductive metal pattern between the epoxy layer and the polynorbornene layer and a conductive metal film on at least one major surface of the laminate; said epoxy layer comprising at least one epoxy prepreg and said polynorbornene layer comprising at least one polynorbornene prepreg.

Claim 43

Dependent Claim 48 words

A printed circuit wiring board of claim 37 wherein the epoxy layer has a dielectric constant of 4.8 or less and a dissipation factor of 0.02 or less, and the polynorbornene layer has a dielectric constant of 3.1 or less and a dissipation factor of 0.002 or less.

Claim 44

Dependent Claim 20 words

A printed circuit wiring board of claim 38 wherein the polynorbornene layer has a dielectric constant of 2.8 or less.

Claim 45

Dependent Claim 35 words

A printed circuit wiring board of claim 39 capable of withstanding immersion in a molten solder bath which is at a temperature of at least 260° C., for a period of at least 20 seconds.

Claim 46

Dependent Claim 47 words

A multilayer wire board of claim 37 comprising at least one layer of polynorbornene adhered to at least one layer of conductive film and wherein a sheet of film derived from a C 2 -C 4 polymer is interposed between the polynorbornene layer and the conductive film.

Claim 47

Dependent Claim 130 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one polynorbornene prepreg; (b) pretreating the surface of a conductive film with a solution of a silane compound effective to increase the bond strength between the substrate layer and the conductive film and laminating the conductive film to the substrate layer and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film; and (d) laminating an additional layer, formed of at least one epoxy prepreg, to the etched surface of the substrate and curing the assembly, wherein the silane employed in step (b) is effective to increase the bond strength between the metal film and the polynorbornene layer, and the polynorbornene layer and the epoxy layer.

Claim 48

Dependent Claim 130 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one polynorbornene prepreg; (b) pretreating the surface of a conductive film with a solution of a silane compound effective to increase the bond strength between the substrate layer and the conductive film and laminating the conductive film to the substrate layer and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film; and (d) laminating an additional layer, formed of at least one epoxy prepreg, to the etched surface of the substrate and curing the assembly, wherein the silane employed in step (b) is effective to increase the bond strength between the metal film and the polynorbornene layer, and the polynorbornene layer and the epoxy layer.

Claim 49

Dependent Claim 108 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one epoxy prepreg; (b) laminating a conductive film to a surface of said substrate and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film to produce a copper-patterned surface on the substrate; (d) providing an additional layer comprising a polynorbornene prepreg and pretreating the copper-patterned surface of the substrate layer with a silane solution effective to increase the bond strength between the copper-patterned surface and the polynorbornene layer; and (e) laminating and curing the polynorbornene layer to the copper-patterned surface of the substrate.

Claim 50

Dependent Claim 108 words

A process of producing a laminate comprising the steps of: (a) providing a substrate layer comprising at least one epoxy prepreg; (b) laminating a conductive film to a surface of said substrate and curing said substrate; (c) photo-resist imaging and etching at least a portion of the conductive film to produce a copper-patterned surface on the substrate; (d) providing an additional layer comprising a polynorbornene prepreg and pretreating the copper-patterned surface of the substrate layer with a silane solution effective to increase the bond strength between the copper-patterned surface and the polynorbornene layer; and (e) laminating and curing the polynorbornene layer to the copper-patterned surface of the substrate.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1993-02-19	1993-08-21	1994-02-20	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1997-02-19	1997-08-21	1998-02-20	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2001-02-19	2001-08-21	2002-02-20	$7700.00	Window Closed / Lapsed

Multi-layer polynorbornene and epoxy laminates and process for making the same

Abstract

Inventors

Bibliographic Details

Claims Analysis

References Cited (Backward Citations)

USPTO Annuity & Maintenance Windows

Assigned Categories & Tags

Assign Category Tag