US4900283A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for arranging chips each having an array of semiconductor light emitting elements
Assignee: Intel Corp
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Filing: 1987-07-30
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Granted: 1990-02-13
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Expires: 2007-07-30
Abstract
Abstract A multiple chip LED linear array including 2048 elements is achieved by a unique wafer dicing technique which allows LEDs in abutting chips to be separated by the same distance as adjacent elements on a single chip. The linear array is employed in photocopy apparatus to discharge a linear segment of a photosensitive drum.
Inventors
- 👤 Kensuke Fukae
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:51
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/435; B41J2/447; B41J2/45; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49826; Y10T29/49904
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
191 words
A method of forming a linear array of semiconductor chips having semiconductor light emitting elements disposed thereon for use in connection with a photosensitive element for the formation of images, comprising the steps of: placing first and second cutting wheels in juxtaposition against first and second surfaces on opposite sides of a semiconductor wafer, said first and second cutting wheels each having a two-sided bevel cutting edges, bringing said first and second cutting wheels into contact with said first and second surfaces thereby cutting said semiconductor wafer into chips with a two-sided bevel at at least one end, each of said chips having a linear array of semiconductor light emitting elements disposed thereon, each of said semiconductor light emitting elements being characterized by a dimension X and being separated from each other by a separation distance S along said linear array, and positioning said cut chips along a common axis with their two-sided bevels abutting each other so that a semiconductor light emitting element at an end of one chip is separated by said separation distance S from a semiconductor light emitting element at an adjoining end of an adjoining chip.
Claim 2
Independent Claim
191 words
A method of forming a linear array of semiconductor chips having semiconductor light emitting elements disposed thereon for use in connection with a photosensitive element for the formation of images, comprising the steps of: placing first and second cutting wheels in juxtaposition against first and second surfaces on opposite sides of a semiconductor wafer, said first and second cutting wheels each having a two-sided bevel cutting edges, bringing said first and second cutting wheels into contact with said first and second surfaces thereby cutting said semiconductor wafer into chips with a two-sided bevel at at least one end, each of said chips having a linear array of semiconductor light emitting elements disposed thereon, each of said semiconductor light emitting elements being characterized by a dimension X and being separated from each other by a separation distance S along said linear array, and positioning said cut chips along a common axis with their two-sided bevels abutting each other so that a semiconductor light emitting element at an end of one chip is separated by said separation distance S from a semiconductor light emitting element at an adjoining end of an adjoining chip.
Claim 3
Dependent Claim
18 words
The method of claim 1 wherein said cutting step is carried out in the presence of a slurry.
Claim 4
Dependent Claim
23 words
The method of claim 1 wherein said first and second cutting wheels are brought into contact with said first and second surfaces simultaneously.
Claim 5
Dependent Claim
15 words
The method of claim 1 wherein said common axis is positioned opposite a photosensitive element.
Claim 6
Dependent Claim
11 words
The method of claim 1 wherein X is greater than S.
Claim 7
Dependent Claim
12 words
The method of claim 1, wherein S is less than 50 microns.
Claim 8
Dependent Claim
11 words
The method of claim 1 wherein S is approximately 30 microns.
References Cited (Backward Citations)
GB604494A
Cited
US2886748A
Cited
US3615047A
Cited
SU473683A1
Cited
US4217689A
Cited
JPS54109375A
Cited
US4451972A
Cited
US4435064A
Cited
US4553148A
Cited
US4447126A
Cited
US4549784A
Cited
JPH06142932A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-12 | 1993-08-14 | 1994-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-12 | 1997-08-14 | 1998-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-12 | 2001-08-14 | 2002-02-13 | $7700.00 | Window Closed / Lapsed |