Glass-ceramics for electronic packaging

Abstract

Abstract This invention relates to the production of glass-ceramic materials particularly suitable for use as substrates in integrated circuit packaging. The inventive glass-ceramics can be prepared from thermally crystallizable glass capable of being concurrently sintered and crystallized in situ at temperatures between about 850 DEG -1000 DEG C. to bodies exhibiting dielectric constants less than about 6, linear coefficients of thermal expansion between about 12-60x10-7/ DEG C. and containing cordierite solid solution as essentially the sole crystal phase. The glass-ceramics are essentially free from Li2O and Na2O and consist essentially, expressed in terms of weight percent on the oxide basis of 10-25% MgO+ZnO consisting of 2-18% MgO+0-21% ZnO, 20-38% Al2O3, 40-52% SiO2, and 2-15% total of at least one oxide in the indicated proportion selected from the group consisting of up to 8% of an alkali metal oxide selected from the group consisting of K2O, Rb2O, and Cs2O, up to 10% of a divalent metal oxide selected from the group consisting of CaO, SrO, BaO, and PbO, and up to 5% B 2O3.

Inventors

• 👤 Louis M. Holleran
• 👤 John F. MacDowell
• 👤 Francis W. Martin

Bibliographic Details