Method of manufacturing semiconductor device

Claim 1

A method of manufacturing a semiconductor device comprising: implanting ions of an impurity in a compound semiconductor substrate and forming a first ion-implanting layer of a first conductivity type on a major surface layer of said substrate; forming a first insulating film on the major surface of said substrate; forming a second insulating film having an opening portion on said first insulating film; forming an opening portion in said first insulating film by selective etching using said second insulating film as a mask; implanting ions of an impurity in said first ion-implantation layer through said opening portion of said second insulating film and forming a second ion-implantation layer of a second conductivity type in a surface layer thereof; forming, on the major surface of said structure, while said second insulating film remains, conductor layers in which at least a layer thereof contacting said semiconductor substrate is either a refractory metal layer or a layer containing a refractory metal; removing said second insulating film to remove said conductor layer portion formed thereon, thereby forming an electrode so that only said conductor layer portion exposed in said opening portion of said second insulating film and formed on said substrate remains; implanting impurity ions of the second conductivity type in said first ion-implantation layer using said electrode and said first insulating film as masks; and annealing said structure to activate said first and second ion-implantation layers.

Claim 2

A method of manufacturing a semiconductor device comprising: implanting ions of an impurity in a compound semiconductor substrate and forming a first ion-implanting layer of a first conductivity type on a major surface layer of said substrate; forming a first insulating film on the major surface of said substrate; forming a second insulating film having an opening portion on said first insulating film; forming an opening portion in said first insulating film by selective etching using said second insulating film as a mask; implanting ions of an impurity in said first ion-implantation layer through said opening portion of said second insulating film and forming a second ion-implantation layer of a second conductivity type in a surface layer thereof; forming, on the major surface of said structure, while said second insulating film remains, conductor layers in which at least a layer thereof contacting said semiconductor substrate is either a refractory metal layer or a layer containing a refractory metal; removing said second insulating film to remove said conductor layer portion formed thereon, thereby forming an electrode so that only said conductor layer portion exposed in said opening portion of said second insulating film and formed on said substrate remains; implanting impurity ions of the second conductivity type in said first ion-implantation layer using said electrode and said first insulating film as masks; and annealing said structure to activate said first and second ion-implantation layers.