US4894704A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame having projections for resin molding
Assignee: Motorola Solutions Japan Ltd
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Filing: 1988-12-12
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Granted: 1990-01-16
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Expires: 2008-12-12
Abstract
Abstract A lead frame comprising an inner lead part to be electrically connected to an internal device and contained within a mold cavity for being resin molded, and an outer lead part connected to the inner lead part, the inner lead part having a projection with which a resin flow having passed through a mold gate collides. Because the resin flowing through the mold gate collides with the projection near a cavity inlet and disperses, the molding resin can reach corners near the cavity inlet, and air can be purged off from the corners to obtain a no-void, satisfactory appearance of semiconductor package.
Inventors
- 👤 Kazuyuki Endo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:41
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/40; H10W70/421
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
76 words
A lead frame comprising: an inner lead part electrically connected to an internal device and contained within a mold cavity together with the internal device for being resin molded; and an outer lead part connected to the inner lead part; characterized in that said inner lead part has at least one projection with which a flow of resin for molding passed through a gate of the mold is collided thereby eliminating voids throughout said molding resin.
Claim 2
Dependent Claim
76 words
A lead frame comprising: an inner lead part electrically connected to an internal device and contained within a mold cavity together with the internal device for being resin molded; and an outer lead part connected to the inner lead part; characterized in that said inner lead part has at least one projection with which a flow of resin for molding passed through a gate of the mold is collided thereby eliminating voids throughout said molding resin.
Claim 3
Dependent Claim
18 words
The lead frame as defined in claim 1, wherein said internal device is a semiconductor integrated circuit chip.
Claim 4
Dependent Claim
27 words
The lead frame as defined in claim 1 wherein the inner lead part includes four projections, one being disposed on each corner of said inner lead part.
Claim 5
Dependent Claim
42 words
A lead frame comprising an inner lead part having at least one projection for colliding with a resin flow during encapsulation to eliminate voids in said resin, said at least one projection being disposed on a corner of said inner lead part.
Claim 6
Dependent Claim
42 words
A lead frame comprising an inner lead part having at least one projection for colliding with a resin flow during encapsulation to eliminate voids in said resin, said at least one projection being disposed on a corner of said inner lead part.
Claim 7
Dependent Claim
25 words
The lead frame of claim 4 wherein the inner lead part includes four projections, one being disposed on each corner of said inner lead part.
References Cited (Backward Citations)
US4575748A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-15 | 1993-07-17 | 1994-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-15 | 1997-07-17 | 1998-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-15 | 2001-07-17 | 2002-01-16 | $7700.00 | Window Closed / Lapsed |