US4891014A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming contact bumps in contact pads
Assignee: Rogers Corp
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Filing: 1989-03-03
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Granted: 1990-01-02
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Expires: 2009-03-03
Abstract
Abstract A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate that includes the steps of removing a portion of the substrate underlying the contact pad to form an aperture and expose a portion of the bottom surface of the pad; upwardly deforming the pad by applying force to its exposed bottom surface to form the bump; and filling the aperture behind the bump with a supporting substance.
Inventors
- 👤 Scott S. Simpson
- 👤 Bruce G. Kosa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 22:31
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H01; H01R; H01R12/00; H01R12/70; H01R12/77; H01R12/79; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0187; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/0382; H05K2201/0388; H05K2201/0394; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49204; Y10T29/49208; Y10T29/49222
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
80 words
A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate comprising the steps of removing a portion of said substrate underlying said contact pad to form an aperture and thereby expose a portion of the bottom surface of said pad; upwardly deforming said pad by applying force to its exposed bottom surface to form said bump; and filling said aperture behind said bump with a supporting substance.
Claim 2
Dependent Claim
80 words
A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate comprising the steps of removing a portion of said substrate underlying said contact pad to form an aperture and thereby expose a portion of the bottom surface of said pad; upwardly deforming said pad by applying force to its exposed bottom surface to form said bump; and filling said aperture behind said bump with a supporting substance.
Claim 3
Dependent Claim
17 words
The process of claim 1 comprising removing said portion of said substrate by ablating with a laser.
Claim 4
Dependent Claim
26 words
The process of claim 1 wherein said deforming step comprises stamping the exposed bottom surface of said pad with a stamping die to form said bump.
Claim 5
Dependent Claim
31 words
The process of claim 1 wherein said filling step comprises dropping an adhesive dielectric material in said aperture in a manner to cause said adhesive dielectric material to fill said aperture.
Claim 6
Dependent Claim
31 words
The process of claim 1 wherein said filling step comprises dropping a non-adhesive dielectric material in said aperture in a manner to cause said non-adhesive dielectric material to fill said aperture.
Claim 7
Dependent Claim
41 words
The process of claim 1 wherein said aperture is large relative to the size of said contact pad, extends through the entire thickness of said substrate on either side of said pad, and is sufficient to accommodate an impact forming tool.
Claim 8
Dependent Claim
32 words
The process of claim 1 wherein said filling step comprises laminating an adhesive-coated cover film to said substrate into or over said aperture and causing said adhesive to flow into said aperture.
Claim 9
Dependent Claim
22 words
The process of claim 1 further comprising providing a patterned mask layer underneath said substrate for determining the location of said aperture.
Claim 10
Dependent Claim
74 words
A contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate prepared by removing a portion of said substrate underlying said contact pad to form an aperture and thereby expose a portion of the bottom surface of said pad; upwardly deforming said pad by applying force to its exposed bottom surface to form said bump; and filling said aperture behind said bump with a supporting substance.
Claim 11
Dependent Claim
74 words
A contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate prepared by removing a portion of said substrate underlying said contact pad to form an aperture and thereby expose a portion of the bottom surface of said pad; upwardly deforming said pad by applying force to its exposed bottom surface to form said bump; and filling said aperture behind said bump with a supporting substance.
Claim 12
Dependent Claim
113 words
A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate comprising the steps of removing by ablating with a laser a portion of said substrate underlying said contact pad to form an aperture and thereby expose a portion of the bottom surface of said pad, the difference in interaction between said substrate being removed and the substance of said pad enabling said ablation to leave said pad intact despite exposure to said laser; upwardly deforming said pad by applying force to its exposed bottom surface to form said bump; and filling said aperture behind said bump with a supporting substance.
Claim 13
Dependent Claim
113 words
A process for forming a contact bump in an electrically conductive contact pad having top and bottom surfaces supported on a dielectric substrate comprising the steps of removing by ablating with a laser a portion of said substrate underlying said contact pad to form an aperture and thereby expose a portion of the bottom surface of said pad, the difference in interaction between said substrate being removed and the substance of said pad enabling said ablation to leave said pad intact despite exposure to said laser; upwardly deforming said pad by applying force to its exposed bottom surface to form said bump; and filling said aperture behind said bump with a supporting substance.
Claim 14
Dependent Claim
71 words
A printed circuit comprising at least one printed circuit trace terminating in a metal pad supported upon a preformed substrate, in an intermediate portion of the pad said substrate defining an aperture over which said pad bridges, said pad having an outwardly extending bump form, and a supporting substance disposed within said aperture and adhered to the underside of said bump form-pad and the walls of the substrate bounding said aperture.
Claim 15
Dependent Claim
71 words
A printed circuit comprising at least one printed circuit trace terminating in a metal pad supported upon a preformed substrate, in an intermediate portion of the pad said substrate defining an aperture over which said pad bridges, said pad having an outwardly extending bump form, and a supporting substance disposed within said aperture and adhered to the underside of said bump form-pad and the walls of the substrate bounding said aperture.
Claim 16
Dependent Claim
39 words
The printed circuit of claim 11 having a plurality of said pads, a single aperture in said substrate extending under said pads, and said supporting substance extending continuously under said pads, in supporting relationship to said plurality of bumps.
Claim 17
Dependent Claim
14 words
The printed circuit of claim Il wherein said circuit is a flexible printed circuit.
Claim 18
Dependent Claim
14 words
The printed circuit of claim 12 wherein said circuit is a flexible printed circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-01 | 1993-07-03 | 1994-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-01 | 1997-07-03 | 1998-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-01 | 2001-07-03 | 2002-01-02 | $7700.00 | Window Closed / Lapsed |