Abstract A multiprobe tip assembly, and method of making same, for quality control testing of an integrated circuit wafer characterized by the precision control of the assembly in the z-axis. The assembly includes a probe tip mounting support member having at least one electrically conductive path disposed thereon, an electrically conductive probe tip member affixed thereto, and means for electrically coupling the probe tip member to the electrically conductive path. The improvement in combination with this assembly comprises the probe tip mounting support member being substantially composed of a high resistance piezoelectric material electrically responsive to mechanical pressure, means for subjecting the mounting support member to mechanical pressure caused of by probe tip member contact with the intergrated circuit wafer so that a piezoelectric voltage is produced therein, and at least one means for electrically coupling a voltage detection means to the support member for detecting the mechanically induced piezoelectric voltage so that z-axis control is precisely maintained relative to piezoelectric voltage amplitude.
A probe assembly for quality control testing of an integrated circuit wafer, characterized by the precision control of said assembly in the z-axis whereby probe tip breakage, excessive over travel, damaged circuit wafers and machine downtime is substantially reduced, said assembly including: (a) a probe tip mounting support member consisting essentially of a unitary high resistance piezoelectric material electrically responsive to mechanical pressure thereon; (b) an electrically conductive probe tip secured to said mounting support and extending outwardly therefrom for subjecting said mounting support member to the mechanical pressure caused by the contact of said probe tip member with an integrated circuit wafer so that a piezoelectric voltage is produced across said support member; (c) electrically conductive means coupled to the probe tip and secured to and extending along said support member; (d) means coupled to said probe tip through said electrically conductive means for providing to or receiving therefrom a signal; and (e) voltage detection means coupled to said support member for detecting the mechanically induced piezoelectric voltage so the z-axis control is precisely maintained.
Claim 2
Dependent Claim
176 words
A probe assembly for quality control testing of an integrated circuit wafer, characterized by the precision control of said assembly in the z-axis whereby probe tip breakage, excessive over travel, damaged circuit wafers and machine downtime is substantially reduced, said assembly including: (a) a probe tip mounting support member consisting essentially of a unitary high resistance piezoelectric material electrically responsive to mechanical pressure thereon; (b) an electrically conductive probe tip secured to said mounting support and extending outwardly therefrom for subjecting said mounting support member to the mechanical pressure caused by the contact of said probe tip member with an integrated circuit wafer so that a piezoelectric voltage is produced across said support member; (c) electrically conductive means coupled to the probe tip and secured to and extending along said support member; (d) means coupled to said probe tip through said electrically conductive means for providing to or receiving therefrom a signal; and (e) voltage detection means coupled to said support member for detecting the mechanically induced piezoelectric voltage so the z-axis control is precisely maintained.
Claim 3
Dependent Claim
23 words
A probe assembly as set forth in claim 1 wherein said support member is generally shaped in the form of a modified L.
Claim 4
Dependent Claim
17 words
A probe assembly as set forth in claim 1 wherein said electrically conductive path includes deposited metal.
Claim 5
Dependent Claim
20 words
A probe assembly as set forth in claim 1 wherein said electrically conductive path includes at least one discrete wire.
Claim 6
Dependent Claim
29 words
A probe assembly as set forth in claim 1 wherein said voltage detection means includes electrical connection means located on the opposite longitudinal surfaces of said mounting support member.
Claim 7
Dependent Claim
17 words
A probe assembly as set forth in claim 5 wherein said electrical connection means comprises deposited metal.