Abstract A storable semiconductor cleaning solution consists essentially of sulphuric acid at a concentration of from 30% to 70% and hydrogen peroxide at a concentration of from 1% to 20% preferably also containing a pentavalent phosphorus sequestrant and tin ions. The solution is produced by diluting concentrated sulphuric acid, aging the diluted acid until it reaches a temperature below 30° C. and introducing the hydrogen peroxide, preferably having a concentration of at least 70% by weight, into the aged acid and equilibrating the resulting solution. The cleaning solutions can be stored for an extended period at ambient temperature and can be used to clean semiconductors, and with suitable precautions aluminized semiconductors, at temperatures below 100° C.
A storable permonosulphuric acid-containing semiconductor cleaning solution, consisting essentially of; an initial solution of water; from 30 percent to 76 percent by weight sulphuric acid; and from 1 percent to 20 percent by weight hydrogen peroxide; stabilized by a stabilizer combination consisting essentially of (a) from 0.1 percent to 0.4 percent by weight of the solution of a organic pentavalent phosphorus-containing sequestrant; and (b) 0.5 to 4 parts per million of a soluble tin compound, calculated as tin by weight of the initial hydrogen peroxide.
Claim 2
Dependent Claim
85 words
A storable permonosulphuric acid-containing semiconductor cleaning solution, consisting essentially of; an initial solution of water; from 30 percent to 76 percent by weight sulphuric acid; and from 1 percent to 20 percent by weight hydrogen peroxide; stabilized by a stabilizer combination consisting essentially of (a) from 0.1 percent to 0.4 percent by weight of the solution of a organic pentavalent phosphorus-containing sequestrant; and (b) 0.5 to 4 parts per million of a soluble tin compound, calculated as tin by weight of the initial hydrogen peroxide.
Claim 3
Dependent Claim
21 words
A cleaning solution as claimed in claim 1 wherein the sulphuric acid is present at not more than 65% by weight.
Claim 4
Dependent Claim
21 words
A cleaning solution as claimed in claim 1 wherein the hydrogen peroxide is present at not more than 17% by weight.
Claim 5
Dependent Claim
22 words
A cleaning solution as claimed in claim 1 containing not more than 0.2 ppm of a soluble tin compound expressed as Sn.
Claim 6
Dependent Claim
15 words
A cleaning solution of claim 1 wherein the ingredients are of an electronic purity grade.