Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material

Claim 1

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of deformable material on one side of a printed circuit board having holes therein; B. deforming said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process fluid; D. processing the printed circuit board; and, thereafter, E. detaching the deformed sheet material from the printed circuit board.

Claim 2

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of deformable material on one side of a printed circuit board having holes therein; B. deforming said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process fluid; D. processing the printed circuit board; and, thereafter, E. detaching the deformed sheet material from the printed circuit board.

Claim 6

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. deforming said thermodeformable sheet material at least in part by applying heat to the thermodeformable sheet material for sufficient time so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process fluid; D. processing the printed circuit board; and, thereafter, E. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 7

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. deforming said thermodeformable sheet material at least in part by applying heat to the thermodeformable sheet material for sufficient time so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process fluid; D. processing the printed circuit board; and, thereafter, E. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 9

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process liquid; D. processing the printed circuit board; and, thereafter, E. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 10

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process liquid; D. processing the printed circuit board; and, thereafter, E. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 12

The method of claims 7 or 8 wherein step (B) is performed in an inert environment.

Claim 13

The method of claims 7 or 8 further comprising the step of applying a release agent to the side of said sheet of thermodeformable material in contact with said printed circuit board or the surface of the printed circuit board itself before placing the sheet of thermodeformable material thereon.

Claim 14

The method of claims 7 or 8 wherein said sheet of thermodeformable material comprises a sheet of thermodeformable plastic and further comprising the step of raising the temperature of said sheet of thermodeformable plastic to at least its Vicat softening temperature.

Claim 18

The method of claims 7 or 8 further comprising the step of creating said force by establishing a pressure differential between pressures on opposite sides of the thermodeformable sheet material.

Claim 20

The method of claims 7 or 8 wherein the thermodeformable sheet material is deformed so that each one of said protectively sealing plugs has a volumetric configuration corresponding to the volumetric configuration of the corresponding hole.

Claim 21

The method of claims 7 or 8 wherein each one of said protectively sealing plugs is hollow.

Claim 22

The method of claims 7 or 8 wherein the sheet of thermodeformable material is deformed so that each one of said protectively sealing plugs has a planar surface that is coplanar with the surface of the other side of said printed circuit board.

Claim 23

The method of claims 7 or 8 further comprising the steps of adhesively securing a relatively stiff sheet material to the thermodeformable sheet material to provide a backing support after Step B and prior to step (C) and detaching in Step E both the deformed sheet of thermodeformable material and the relatively stiff sheet material backing support from the printed circuit board.

Claim 24

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. coating the other side of the printed circuit board with a process liquid; E. processing the printed circuit board; and, thereafter, F. detaching the first component deformed sheet of thermodeformable material from the printed circuit board.

Claim 25

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. coating the other side of the printed circuit board with a process liquid; E. processing the printed circuit board; and, thereafter, F. detaching the first component deformed sheet of thermodeformable material from the printed circuit board.

Claim 27

The method of claims 21 or 22 further comprising the step of applying a release agent to the side of said first component sheet of thermodeformable material in contact with said printed circuit board or the surface of the printed circuit board itself before placing the sheet of thermodeformable material thereon.

Claim 28

The method of claims 21 or 22 wherein said first component sheet of thermodeformable material comprises a sheet of thermodeformable plastic and further comprising the step of raising the temperature of said sheet of thermodeformable plastic to at least its Vicat softening temperature.

Claim 32

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. coating the other side of the printed circuit board with a process liquid; G. processing the printed circuit board; and, thereafter, H. detaching the second component deformed sheet of thermodeformable material from the printed circuit board.

Claim 33

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. coating the other side of the printed circuit board with a process liquid; G. processing the printed circuit board; and, thereafter, H. detaching the second component deformed sheet of thermodeformable material from the printed circuit board.

Claim 35

The method of claims 28 or 29 wherein said second component sheet of thermodeformable material comprises a sheet of thermodeformable plastic and further comprising the step of raising the temperature of said sheet of thermodeformable plastic to at least its Vicat softening temperature.

Claim 39

The method of claims 28 or 29 further comprising the step of applying a release agent to the side of said second component sheet of thermodeformable material in contact with said printed circuit board or the surface of the printed circuit board itself before placing the sheet of thermodeformable material thereon.

Claim 40

The method of claims 28 or 29 wherein the sandwich is formed with a third component comprising a flexible, thermally conductive sheet material having a melting point higher than the melting point of the second component thermally deformable sheet material, said third component sheet material being placed in sandwiched relation between the first component sheet material and said second component thermally deformable sheet material so that when the vacuum is drawn in Step B, the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with the third component thermally conductive sheet material which in turn is forced into thermally conductive contact with said second component thermally deformable sheet material, the second component thermodeformable sheet material is forced against the printed circuit board and the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate.

Claim 46

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component flexible sheet material; (ii) a second componet sheet of pressure-deformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of pressure-deformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component pressure-deformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible sheet material and said vacuum table so that: (i) the first component flexible sheet material is forced into contact with said second component pressure-deformable sheet material; (ii) the second component pressure-deformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate whereby the second component pressure-deformable sheet material deforms under the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein. C. terminating the vacuum established in Step B; D. removing said compressible porous release sheet from the other side of the printed circuit board; E. coating the other side of the printed circuit board with a process liquid; F. processing the printed circuit board; and, thereafter, G. detaching the second component deformed sheet of pressure-deformable material from the printed circuit board.

Claim 47

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component flexible sheet material; (ii) a second componet sheet of pressure-deformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of pressure-deformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component pressure-deformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible sheet material and said vacuum table so that: (i) the first component flexible sheet material is forced into contact with said second component pressure-deformable sheet material; (ii) the second component pressure-deformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate whereby the second component pressure-deformable sheet material deforms under the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein. C. terminating the vacuum established in Step B; D. removing said compressible porous release sheet from the other side of the printed circuit board; E. coating the other side of the printed circuit board with a process liquid; F. processing the printed circuit board; and, thereafter, G. detaching the second component deformed sheet of pressure-deformable material from the printed circuit board.

Claim 49

The method of claims 41 or 42 wherein the sandwhich is formed with a third component comprising a flexible sheet material, said third component flexible sheet material being placed in sandwiched relation between the first component flexible sheet material and said second component pressure-deformable sheet material so that when the vacuum is drawn in Step B, the first component flexible, sheet material is forced into contact with the third component flexible sheet material which in turn is forced into contact with said second component pressure-deformable sheet material, the second component pressure-deformable sheet material is forced against the printed circuit board and the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate.

Claim 52

The method of claims 1, 2, 41 or 42 further comprisng the step of applying a release agent to the side of said sheet of deformable material in contact with said printed circuit board or the surface of the printed circuit board itself before placing the sheet of deformable material thereon.

Claim 53

The method of claims 2 or 8 further comprising the step of using said printed circuit board again during the repetition of said steps.

Claim 54

The method of claims 2 or 8 further comprising the step of using another printed circuit board during the repetition of said steps.

Claim 55

The method of claims 1, 2, 3, 4, 5, 6, 7, 8, 21, 22, 28, 29, 37, 38, 39, 40, 41, 42, or 46 further comprising the step of appying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating.

Claim 61

The method of claims 1, 2, 3, 4, 5, 6, 7, 8, 21, 22, 28, 29, 37, 38, 39, 40, 41, 42, or 46 further comprising the step of flattening the printed circuit board by placing the deformed thermodeformable material side of the printed circuit board in contact with a flat vacuum table and applying a vacuum thereto before coating the other side of the printed circuit board with said process liquid.

Claim 62

The method of claims 28 or 41 wherein the compressible porous release sheet comprises a sheet of paper that is positioned between the printed circuit board and the flat, porous plate of the vacuum table.

Claim 65

A method for temporarily sealing a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable plastic on one side of a printed circuit board; B. applying sufficient heat and force to said thermodeformable plastic sheet to raise the temperature of the plastic sheet to at least its VICAT softening temperature for sufficient time to deform said plastic sheet so that it conforms to the surface topography of the printed circuit board with said thermodeformable plastic sheet distributing the heat to the printed circuit board and regulating the rate of the heat transfer thereto; C. processing the printed circuit board; and, thereafter, D. detaching the deformed sheet of thermodeformable plastic from the printed circuit board.

Claim 66

A method for temporarily sealing a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable plastic on one side of a printed circuit board; B. applying sufficient heat and force to said thermodeformable plastic sheet to raise the temperature of the plastic sheet to at least its VICAT softening temperature for sufficient time to deform said plastic sheet so that it conforms to the surface topography of the printed circuit board with said thermodeformable plastic sheet distributing the heat to the printed circuit board and regulating the rate of the heat transfer thereto; C. processing the printed circuit board; and, thereafter, D. detaching the deformed sheet of thermodeformable plastic from the printed circuit board.

Claim 68

The method of claims 59 or 60 wherein step (B) is performed in an inert environment.

Claim 69

The method of claims 59 or 60 further comprising the step of applying a release agent to the side of said sheet of thermodeformable plastic in contact with said printed circuit board or the surface of the printed circuit board itself before placing the sheet of thermodeformable plastic thereon.

Claim 70

The method of claims 59 or 60 wherein said sheet of thermodeformable plastic comprises a low density polyethylene.

Claim 71

The method of claims 59 or 60 wherein said sheet of thermodeformable plastic comprises a high density polyethylene.

Claim 72

The method of claims 59 or 60 wherein said sheet of thermodeformable plastic comprises a polypropylene.

Claim 73

The method of claims 59 or 60 further comprising the step of creating said force by establishing a pressure differential between pressures on opposite sides of the thermodeformable sheet material.

Claim 75

The method of claims 59 or 60 further comprising the step of using said printed circuit board again during the repetition of said steps.

Claim 76

The method of claims 59 or 60 further comprising the step of using another printed circuit board during the repetition of said steps.

Claim 77

The method of claims 59 or 60 further comprising the step of flattening the printed circuit board by placing the deformed thermodeformable material side of the printed circuit board in contact with a flat vacuum table and applying a vacuum thereto before processing the other side of the printed circuit board.

Claim 84

The method of claims 8, 22 or 29 wherein the deformed sheet of thermodeformable material of steps (E), (F) and (H), respectively, is placed on said one side of the printed circuit board with the sealing plugs facing said one side.

Claim 86

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board; said method comprising the steps of: A. placing a sheet of deformable material on one side of a printed circuit board having holes therein; B. deforming said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process liquid; D. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; E. solidifying the process liquid coating; F. detaching the deformed sheet material from the printed circuit board; G. placing a sheet of deformable material on the solidified process liquid coated side of the printed circuit board having holes therein; H. deforming the sheet of deformable material so that the material extends into each hole to form a protectively sealing plug therein; I. coating the non-process liquid coated other side of the printed circuit board with a process liquid; J. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; K. solidifying the process liquid coating; and, L. detaching the deformed sheet material from the printed circuit board.

Claim 87

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board; said method comprising the steps of: A. placing a sheet of deformable material on one side of a printed circuit board having holes therein; B. deforming said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process liquid; D. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; E. solidifying the process liquid coating; F. detaching the deformed sheet material from the printed circuit board; G. placing a sheet of deformable material on the solidified process liquid coated side of the printed circuit board having holes therein; H. deforming the sheet of deformable material so that the material extends into each hole to form a protectively sealing plug therein; I. coating the non-process liquid coated other side of the printed circuit board with a process liquid; J. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; K. solidifying the process liquid coating; and, L. detaching the deformed sheet material from the printed circuit board.

Claim 88

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process liquid; D. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; E. solidifying the process liquid coating; F. detaching the deformed sheet of thermodeformable material from the printed circuit board; G. placing a sheet of thermodeformable material on the solidified process liquid coated side of the printed circuit board having holes therein; H. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; I. coating the non-process liquid coated other side of the printed circuit board with a process liquid; J. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; K. solidifying the process liquid coating; and, L. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 89

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. coating the other side of the printed circuit board with a process liquid; D. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; E. solidifying the process liquid coating; F. detaching the deformed sheet of thermodeformable material from the printed circuit board; G. placing a sheet of thermodeformable material on the solidified process liquid coated side of the printed circuit board having holes therein; H. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; I. coating the non-process liquid coated other side of the printed circuit board with a process liquid; J. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; K. solidifying the process liquid coating; and, L. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 90

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component flexible sheet material; (ii) a second component sheet of pressure-deformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of pressure-deformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component pressure-deformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible sheet material and said vacuum table so that: (i) the first component flexible sheet material is forced into contact with said second component pressure-deformable sheet material; (ii) the second component pressure-deformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate whereby the second component pressure-deformable sheet material deforms under the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein. C. terminating the vacuum established in Step B; D. removing said compressible porous release sheet from the other side of the printed circuit board; E. coating the other side of the printed circuit board with a process liquid; F. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; G. solidifying the process liquid coating; H. detaching the second component deformed sheet of pressure-deformable material from the printed circuit board; I. forming another sandwich comprising: (i) a first component flexible sheet material; (ii) a second component sheet of pressure-deformable material; (iii) the printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of pressure-deformable material in contact with the solidified process liquid coated side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the non-process liquid coated other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component pressure-deformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; J. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said another sandwich first component, flexible sheet material and said vacuum table so that: (i) the first component flexible sheet material is forced into contact with said second component pressure-deformable sheet material; (ii) the second component pressure-deformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate whereby the second component pressure-deformable sheet material deforms under the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein; K. terminating the vacuum established in Step J; L. removing said compressible porous release sheet from the non-process liquid coated other side of the printed circuit board; M. coating the non-process liquid coated other side of the printed circuit board with a process liquid; N. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; O. solidifying the process liquid coating; and, P. detaching the second component deformed sheet of pressure-deformable material from the printed circuit board.

Claim 91

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component flexible sheet material; (ii) a second component sheet of pressure-deformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of pressure-deformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component pressure-deformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible sheet material and said vacuum table so that: (i) the first component flexible sheet material is forced into contact with said second component pressure-deformable sheet material; (ii) the second component pressure-deformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate whereby the second component pressure-deformable sheet material deforms under the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein. C. terminating the vacuum established in Step B; D. removing said compressible porous release sheet from the other side of the printed circuit board; E. coating the other side of the printed circuit board with a process liquid; F. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; G. solidifying the process liquid coating; H. detaching the second component deformed sheet of pressure-deformable material from the printed circuit board; I. forming another sandwich comprising: (i) a first component flexible sheet material; (ii) a second component sheet of pressure-deformable material; (iii) the printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of pressure-deformable material in contact with the solidified process liquid coated side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the non-process liquid coated other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component pressure-deformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; J. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said another sandwich first component, flexible sheet material and said vacuum table so that: (i) the first component flexible sheet material is forced into contact with said second component pressure-deformable sheet material; (ii) the second component pressure-deformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate whereby the second component pressure-deformable sheet material deforms under the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein; K. terminating the vacuum established in Step J; L. removing said compressible porous release sheet from the non-process liquid coated other side of the printed circuit board; M. coating the non-process liquid coated other side of the printed circuit board with a process liquid; N. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; O. solidifying the process liquid coating; and, P. detaching the second component deformed sheet of pressure-deformable material from the printed circuit board.

Claim 92

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. coating the other side of the printed circuit board with a process liquid; E. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; F. soldifying the process liquid coating; G. detaching the first component deformed sheet of thermodeformable material from the printed circuit board; H. placing another sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on the solidified process liquid coated side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with the solidified process liquid coated side of the printed circuit board; I. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; J. reducing the temperature of the third component below the third melting point; K. coating the non-process liquid coated other side of the printed circuit board with a process liquid; L. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; M. solidifying the process liquid coating; and, N. detaching the first component deformed sheet of thermodeformable material from the printed circuit board.

Claim 93

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. coating the other side of the printed circuit board with a process liquid; E. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; F. soldifying the process liquid coating; G. detaching the first component deformed sheet of thermodeformable material from the printed circuit board; H. placing another sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on the solidified process liquid coated side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with the solidified process liquid coated side of the printed circuit board; I. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; J. reducing the temperature of the third component below the third melting point; K. coating the non-process liquid coated other side of the printed circuit board with a process liquid; L. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; M. solidifying the process liquid coating; and, N. detaching the first component deformed sheet of thermodeformable material from the printed circuit board.

Claim 94

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. coating the other side of the printed circuit board with a process liquid; G. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; H. solidifying the process liquid coating; I. detaching the second component deformed sheet of thermodeformable material from the printed circuit board; J. forming another sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with the solidified process liquid coated side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the non- process liquid coated other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; K. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said another sandwich first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; L. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each on of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; M. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step K; N. removing said compressible porous release sheet from the non-process liquid coated other side of the printed circuit board; O. coating the non-process liquid coated other side of the printed circuit board with a process liquid; P. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; Q. solidifying the process liquid coating; and, R. detaching the second component deformed sheet of thermodeformable material from the printed circuit board.

Claim 95

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. coating the other side of the printed circuit board with a process liquid; G. applying a vacuum to the process liquid coated side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; H. solidifying the process liquid coating; I. detaching the second component deformed sheet of thermodeformable material from the printed circuit board; J. forming another sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with the solidified process liquid coated side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the non- process liquid coated other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; K. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said another sandwich first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; L. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each on of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; M. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step K; N. removing said compressible porous release sheet from the non-process liquid coated other side of the printed circuit board; O. coating the non-process liquid coated other side of the printed circuit board with a process liquid; P. applying a vacuum to the now process liquid coated other side of the printed circuit board to remove any gas entrapped in or under the process liquid coating; Q. solidifying the process liquid coating; and, R. detaching the second component deformed sheet of thermodeformable material from the printed circuit board.

Claim 96

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. deforming said thermodeformable sheet material at least in part by applying heat to the thermodeformable sheet material for sufficient time so that the material extends into each hole to form a protectively sealing plug therein; C. processing the printed circuit board; and, thereafter, D. detaching the deformed sheet of thermodeformable material from the printed circuit board

Claim 97

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. deforming said thermodeformable sheet material at least in part by applying heat to the thermodeformable sheet material for sufficient time so that the material extends into each hole to form a protectively sealing plug therein; C. processing the printed circuit board; and, thereafter, D. detaching the deformed sheet of thermodeformable material from the printed circuit board

Claim 98

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. processing the printed circuit board; and, thereafter, D. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 99

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. processing the printed circuit board; and, thereafter, D. detaching the deformed sheet of thermodeformable material from the printed circuit board.

Claim 101

A method for temporarily sealing holes in a printed circuit board during procesing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. processing the printed circuit board; and, thereafter, E. detaching the first component deformed sheet of thermodeformable material from the printed circuit board.

Claim 102

A method for temporarily sealing holes in a printed circuit board during procesing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. processing the printed circuit board; and, thereafter, E. detaching the first component deformed sheet of thermodeformable material from the printed circuit board.

Claim 104

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. processing the printed circuit board; and, thereafter, G. detaching the second component deformed sheet of thermodeformable material from the printed circuit board.

Claim 105

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. processing the printed circuit board; and, thereafter, G. detaching the second component deformed sheet of thermodeformable material from the printed circuit board.

Claim 107

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of deformable material on one side of a printed circuit board having holes therein; B. deforming said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. detaching the deformed sheet material from the printed circuit board; and thereafter, D. utilizing said deformed sheet material as a three dimensional replica of said printed circuit board.

Claim 108

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of deformable material on one side of a printed circuit board having holes therein; B. deforming said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. detaching the deformed sheet material from the printed circuit board; and thereafter, D. utilizing said deformed sheet material as a three dimensional replica of said printed circuit board.

Claim 110

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. deforming said thermodeformable sheet material at least in part by applying heat to the thermodeformable sheet material for sufficient time so that the material extends into each hole to form a protectively sealing plug therein; C. detaching the deformed sheet of thermodeformable material from the printed circuit board; and, thereafter, D. utilizing said deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 111

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. deforming said thermodeformable sheet material at least in part by applying heat to the thermodeformable sheet material for sufficient time so that the material extends into each hole to form a protectively sealing plug therein; C. detaching the deformed sheet of thermodeformable material from the printed circuit board; and, thereafter, D. utilizing said deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 113

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. detaching the deformed sheet of thermodeformable material from the printed circuit board; and, thereafter; D. utilizing said deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 114

A method for temporarily sealing holes in a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable material on one side of a printed circuit board having holes therein; B. applying heat and force to said thermodeformable sheet material for sufficient time to deform said sheet material so that the material extends into each hole to form a protectively sealing plug therein; C. detaching the deformed sheet of thermodeformable material from the printed circuit board; and, thereafter; D. utilizing said deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 116

A method for temporarily sealing holes in a printed circuit board during procesing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. detaching the first component deformed sheet of thermodeformable material from the printed circuit board; and thereafter, E. utilizing said first component deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 117

A method for temporarily sealing holes in a printed circuit board during procesing of the printed circuit board, said method comprising the steps of: A. placing a sandwich comprising: (i) a first component having a first melting point, said first component comprising a sheet of thermodeformable material; (ii) a second component having a second melting point, said second component comprising a thermally conductive sheet material of substantially the same size and shape as said sheet of thermodeformable material and being secured thereto around the periphery thereof whereby said first and second components define a sealed cavity therebetween; (iii) a third component having a third melting point, said third component occupying at least a portion of the sealed cavity and constituting a heat transfer medium between said first and second components with said third component having the lowest melting point and the second component having the highest melting point and the first component having a melting point in between said second and third melting points; on one side of the printed circuit board having holes therein with the first component sheet of thermodeformable material in contact with said one side of the printed circuit board; B. applying sufficient heat and force to the second component sheet material to raise the temperature of the third component to the third melting point whereby the heat and force are transferred to said first component thermodeformable sheet material for sufficient time to deform the material so that the material extends into each hole to form a protective sealing plug therein; C. reducing the temperature of the third component below the third melting point; D. detaching the first component deformed sheet of thermodeformable material from the printed circuit board; and thereafter, E. utilizing said first component deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 119

A method for temporarily sealing holes in a printed circuit board during procesing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. detaching the second component deformed sheet of thermodeformable material from the printed circuit board; and, thereafter; G. utilizing said second component deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 120

A method for temporarily sealing holes in a printed circuit board during procesing of the printed circuit board, said method comprising the steps of: A. forming a sandwich comprising: (i) a first component having a melting point, said first component comprising a flexible, thermally conductive sheet material; (ii) a second component having a melting point that is lower than the melting point of said first component, said second component comprising a sheet of thermodeformable material; (iii) a printed circuit board having holes therein, said printed circuit board being positioned with the second component sheet of thermodeformable material in contact with one side of the printed circuit board and covering at least some of said holes; (iv) a compressible porous release sheet positioned in contact with the other side of the printed circuit board; (v) a flat, porous plate positioned in contact with said porous release sheet, and with said first component flexible thermally conductive sheet material being sealed around the periphery thereof to a vacuum table to define a chamber within which are located in sandwiched relation the second component thermodeformable sheet material, the printed circuit board, the compressible porous release sheet and the flat, porous plate with said flat, porous plate being fixed with respect to said vacuum table; B. drawing a vacuum through the flat, porous plate to evacuate the chamber defined by said first component, flexible thermally conductive sheet material and said vacuum table so that: (i) the first component flexible, thermally conductive sheet material is forced into thermally conductive contact with said second component thermally deformable sheet material; (ii) the second component thermodeformable sheet material is forced against the printed circuit board; and, (iii) the printed circuit board is forced against and compresses said compressible porous release sheet against the flat, porous plate; C. applying sufficient heat to the first component thermally conductive sheet material to raise the temperature of the second component thermodeformable sheet material so that it deforms under the heat and the vacuum created force and extends into each one of said at least some holes to form a protective sealing plug therein with the deformation occurring without thermally stressing the printed circuit board; D. reducing the temperature of the second component thermodeformable sheet material and terminating the vacuum established in Step B; E. removing said compressible porous release sheet from the other side of the printed circuit board; F. detaching the second component deformed sheet of thermodeformable material from the printed circuit board; and, thereafter; G. utilizing said second component deformed sheet of thermodeformable material as a three dimensional replica of said printed circuit board.

Claim 122

A method for temporarily sealing a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable plastic on one side of a printed circuit board; B. applying sufficient heat and force to said thermodeformable plastic sheet to raise the temperature of the plastic sheet to at least its VICAT softening temperature for sufficient time to deform said plastic sheet so that it conforms to the surface topography of the printed circuit board; C. detaching the deformed sheet of thermodeformable plastic from the printed circuit board; and, thereafter D. utilizing said deformed sheet of thermodeformable plastic as a three dimensional replica of said printed circuit board.

Claim 123

A method for temporarily sealing a printed circuit board during processing of the printed circuit board, said method comprising the steps of: A. placing a sheet of thermodeformable plastic on one side of a printed circuit board; B. applying sufficient heat and force to said thermodeformable plastic sheet to raise the temperature of the plastic sheet to at least its VICAT softening temperature for sufficient time to deform said plastic sheet so that it conforms to the surface topography of the printed circuit board; C. detaching the deformed sheet of thermodeformable plastic from the printed circuit board; and, thereafter D. utilizing said deformed sheet of thermodeformable plastic as a three dimensional replica of said printed circuit board.