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US4882216A Expired / Lapsed US ⏱️ 0.0 years remaining

Epoxy resin film covered with metal foil and flexible printed wiring board

Assignee: KASHIMA INDUSTRIES COMPANY 1 OH-AZA SUNAYAMA HASAKI-MACHI KASHIMA-GUN IBARAKI JAPAN
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Filing: 1988-08-09
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Granted: 1989-11-21
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Expires: 2008-08-09
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Abstract

Abstract A film comprising a metal foil and a flexible epoxy resin layer covered therewith, wherein the flexible epoxy resin layer is formed from a flexible epoxy resin composition containing one or more polythiol compounds as a hardener, and a flexible printed wiring board produced therefrom.

Inventors

  • 👤 Hideo Takimoto
  • 👤 Katsuji Tokuda
  • 👤 Koji Yamamoto

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 11:21
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0326; C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/66; C08L; C08L63/00; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31511; Y10T428/31529; Y10T428/31678

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 66 words
A film comprising an electrically conductive metal foil and a flexible epoxy resin layer covered therewith, characterized in that the flexible epoxy resin layer is formed from a flexible epoxy resin composition containing 100 parts by weight of epoxy resins, 10 to 150 parts by weight of an ester of a mercaptocarboxylic acid with a polyhydric alcohol, and 0.01 to 20 parts by weight of amine.
Claim 2
Dependent Claim 66 words
A film comprising an electrically conductive metal foil and a flexible epoxy resin layer covered therewith, characterized in that the flexible epoxy resin layer is formed from a flexible epoxy resin composition containing 100 parts by weight of epoxy resins, 10 to 150 parts by weight of an ester of a mercaptocarboxylic acid with a polyhydric alcohol, and 0.01 to 20 parts by weight of amine.
Claim 3
Dependent Claim 66 words
A flexible printed wiring board comprising a flexible epoxy resin substrate and a conductive wiring pattern, characterized in that the flexible epoxy resin substrate is formed from a flexible epoxy resin composition containing 100 parts by weight of epoxy resins, 10 to 150 parts by weight of an ester of a mercaptocarboxylic acid with a polyhydric alcohol, and 0.01 to 20 parts by weight of amine.
Claim 4
Dependent Claim 66 words
A flexible printed wiring board comprising a flexible epoxy resin substrate and a conductive wiring pattern, characterized in that the flexible epoxy resin substrate is formed from a flexible epoxy resin composition containing 100 parts by weight of epoxy resins, 10 to 150 parts by weight of an ester of a mercaptocarboxylic acid with a polyhydric alcohol, and 0.01 to 20 parts by weight of amine.

References Cited (Backward Citations)

US4555450A Cited
JPS5723295A Cited
JPS5840890A Cited
US4663401A Cited
US4721701A Cited
US4757119A Cited
JPH06226147A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-11-20 1993-05-22 1993-11-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-11-20 1997-05-22 1997-11-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-11-20 2001-05-22 2001-11-21 $7700.00 Window Closed / Lapsed

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