US4881906A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for obtaining electrical interconnect using a solderable mechanical fastener
Assignee: HEWLETT-PACKARD JAMES K KOCH A CA CORP
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Filing: 1988-02-25
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Granted: 1989-11-21
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Expires: 2008-02-25
Abstract
Abstract A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet extends through a hole in the PCB. The top of the PCB has a first conductive layer. Around the hole the first conductive layer is shaped such that a conductive pad is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad to the rest of the first conductive layer. The eyelet is crimped such that crimped fingers or tabs of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom of the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.
Inventors
- 👤 James C. Mackanic
- 👤 Dawn M. Lelko
- 👤 Steven A. Shugart
- 👤 James K. Koch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 23:16
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H01R12/526; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4046; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10401; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
157 words
A method forproviding an electrical connection between a bottom and a top of a printed circuit board, the method comprsing the steps of: (a) isolating a first portion of conductive layer on top of the printed circuit board and around a hole in he printed circuit board, so that when soldering, heat may be conserved in the first portion; (b) inserting an eyelet through the hole; (c) crimping the eyelet so that tabs of the eyelet cause the eyelet to be mechanically retained in the hole, so that capillary solder paths to the copper pad are formed, and so that the eyelet is crimped with such a tension that under its own weight the eyelet is able to non-resiliently move slightly in and out of the hole and the eyelet is able to move slightly in a horizontal motion across the first portion of the conductive layer; (d) wave soldering the bottom of the printed circuit board.
Claim 2
Independent Claim
157 words
A method forproviding an electrical connection between a bottom and a top of a printed circuit board, the method comprsing the steps of: (a) isolating a first portion of conductive layer on top of the printed circuit board and around a hole in he printed circuit board, so that when soldering, heat may be conserved in the first portion; (b) inserting an eyelet through the hole; (c) crimping the eyelet so that tabs of the eyelet cause the eyelet to be mechanically retained in the hole, so that capillary solder paths to the copper pad are formed, and so that the eyelet is crimped with such a tension that under its own weight the eyelet is able to non-resiliently move slightly in and out of the hole and the eyelet is able to move slightly in a horizontal motion across the first portion of the conductive layer; (d) wave soldering the bottom of the printed circuit board.
Claim 3
Dependent Claim
50 words
A method as in claim 1 wherin step (a) comprises the substep: (a1) removing sections of the conductive layer around the first portion of the conductive layer, so that the first portion of the conductive layer is coupled to the rest of the conductive layer through a plurality of spokes.
Claim 4
Dependent Claim
37 words
A method as in claim 1 wherein in step (c) the eyelet is crimped such that the tabs are curved and the tabs engage but do not lie flat upon the first portion of the conductive layer.
Claim 5
Dependent Claim
39 words
A method as in claim 1 wherein the eyelet is able to move a maximum of 0.25 millimeters across the first portion of the conductive layer and a maximum of 0.25 millimeters vertically, in and out of the hole.
Claim 6
Independent Claim
148 words
A method for providing an electrical connection between a bottom and a top of a printed circuit board, the method comprising the steps of: (a) creating a hole in the printed circuit board; (b) inserting an eyelet through the hole; (c) crimping the eyelet so that tabs of the eyelet cause the eyeelt to be mechanically retained in the hole, so that the tabs are curved, so that the tabs engage but tdo not lie flat upon a conductive layer on the bottom of the printed circuit board and so that the eyelet is crimped with such a tension that under the eyelet's own weight the eyelet is able to non-resiliently make slight vertical motion in and out of the hole, and the eyelet is able to move slightly in a horizontal motion across the conductive layer; and, (d) wave soldering th bottom of the printed circuit board.
Claim 7
Independent Claim
148 words
A method for providing an electrical connection between a bottom and a top of a printed circuit board, the method comprising the steps of: (a) creating a hole in the printed circuit board; (b) inserting an eyelet through the hole; (c) crimping the eyelet so that tabs of the eyelet cause the eyeelt to be mechanically retained in the hole, so that the tabs are curved, so that the tabs engage but tdo not lie flat upon a conductive layer on the bottom of the printed circuit board and so that the eyelet is crimped with such a tension that under the eyelet's own weight the eyelet is able to non-resiliently make slight vertical motion in and out of the hole, and the eyelet is able to move slightly in a horizontal motion across the conductive layer; and, (d) wave soldering th bottom of the printed circuit board.
Claim 8
Dependent Claim
35 words
A method as in claim 6 wherein the eyelet is able to move a maximum of 0.25 millimeters across the conductive layer and a maximum of 0.25 millimeters vertically, in and out of the hole.
References Cited (Backward Citations)
US3103547A
Cited
US2756485A
Cited
US3061911A
Cited
US3621116A
Cited
US3601750A
Cited
US3825999A
Cited
US4181385A
Cited
US4413309A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-11-20 | 1993-05-22 | 1993-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-11-20 | 1997-05-22 | 1997-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-11-20 | 2001-05-22 | 2001-11-21 | $7700.00 | Window Closed / Lapsed |