Thin-film microwave filter

Claim 2

A thin-film filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming one or more electrically interconnected capacitive pi networks and spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein each capacitive pi network includes two pads of the first metal layer separated by a gap, and includes an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer, wherein each pad provides an electrical connection to the capacitive pi network; and wherein each spiral inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection to the inductor.

Claim 3

A filter as recited in claim 1 wherein the overlying region of each capacitive pi network is electrically isolated from both corresponding pads.

Claim 4

A filter as recited in claim 1 wherein the overlying region of each capacitive pi network is electrically coupled to one corresponding pad and electrically isolated from the other pad.

Claim 5

A filter as recited in claim 1 wherein the second trace of each inductor is disposed parallel to a portion of the first trace of the inductor.

Claim 6

A thin-film bandpass filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a capacitive pi network electrically coupled to two spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein the capacitive pi network includes two pads of the first metal layer separated by a gap and includes an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer; and wherein one inductor is coupled between an input port of the filter and one pad of the capacitive pi network and the other inductor is coupled between the other pad of the capacitive pi network and an output port of the filter, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection between the inductor and either the capacitive pi network or a port of the filter.

Claim 7

A thin-film bandpass filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a capacitive pi network electrically coupled to two spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein the capacitive pi network includes two pads of the first metal layer separated by a gap and includes an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer; and wherein one inductor is coupled between an input port of the filter and one pad of the capacitive pi network and the other inductor is coupled between the other pad of the capacitive pi network and an output port of the filter, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection between the inductor and either the capacitive pi network or a port of the filter.

Claim 8

A thin-film bandpass filter comprising: a planar dielectric substrate having a plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a plurality of electrically interconnected capacitive pi networks and spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein each capacitive pi network includes two pads of the first metal layer separated by a gap and includes an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer, wherein each pad provides an electrical connection to the capacitive pi network; and wherein the spiral inductors number one more than the number of capacitive pi networks, wherein one inductor is coupled between an input port of the filter and one capacitive pi network, another inductor is coupled between another capacitive pi network and an output port of the filter, and each of the remaining inductors is coupled between two capacitive pi networks, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection between the inductor and either the capacitive pi network or a port of the filter.

Claim 9

A thin-film bandpass filter comprising: a planar dielectric substrate having a plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a plurality of electrically interconnected capacitive pi networks and spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein each capacitive pi network includes two pads of the first metal layer separated by a gap and includes an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer, wherein each pad provides an electrical connection to the capacitive pi network; and wherein the spiral inductors number one more than the number of capacitive pi networks, wherein one inductor is coupled between an input port of the filter and one capacitive pi network, another inductor is coupled between another capacitive pi network and an output port of the filter, and each of the remaining inductors is coupled between two capacitive pi networks, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection between the inductor and either the capacitive pi network or a port of the filter.

Claim 10

A thin-film low-pass filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a capacitive pi network electrically coupled to three spiral inductors, wherein the capacitive pi network and inductors are lumped elements; wherein the capacitive pi network has two pads of the first metal layer separated by a gap and has an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer; and wherein one inductor is coupled between an input port of the filter and one pad of the capacitive pi network, another inductor is coupled between the other pad of the capacitive pi network and an output port of the filter, and the remaining inductor is coupled in parallel with the capacitive pi network between the two pads thereof, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection to the inductor.

Claim 11

A thin-film low-pass filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a capacitive pi network electrically coupled to three spiral inductors, wherein the capacitive pi network and inductors are lumped elements; wherein the capacitive pi network has two pads of the first metal layer separated by a gap and has an overlying region of the second metal layer overlapping the two pads of the first metal layer and separated from at least one pad by the insulation layer; and wherein one inductor is coupled between an input port of the filter and one pad of the capacitive pi network, another inductor is coupled between the other pad of the capacitive pi network and an output port of the filter, and the remaining inductor is coupled in parallel with the capacitive pi network between the two pads thereof, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection to the inductor.

Claim 12

A thin-film low-pass filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a multi-stage capacitive pi network electrically coupled to a plurality of spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein the multi-stage capacitive pi network includes a plurality of pads of the first metal layer each separated from an adjacent pad by a gap and includes overlying regions of the second metal layer overlapping each two adjacent pads of the first metal layer and separated from at least one pad by the insulation layer; and wherein the number of spiral inductors is one more than the number of pads of the capacitive pi network, wherein one inductor is coupled between an input port of the filter and one pad of the capacitive pi network, another inductor is coupled between the another pad of the capacitive pi network and an output port of the filter, and each of the remaining inductors is coupled between two adjacent pads of the capacitive pi network, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection to the inductor.

Claim 13

A thin-film low-pass filter comprising: a planar dielectric substrate having a ground plane on one side thereof; and first and second thin-film metal layers and an insulation layer therebetween disposed on the side of the dielectric substrate opposite the ground plane and forming a multi-stage capacitive pi network electrically coupled to a plurality of spiral inductors, wherein the capacitive pi networks and inductors are lumped elements; wherein the multi-stage capacitive pi network includes a plurality of pads of the first metal layer each separated from an adjacent pad by a gap and includes overlying regions of the second metal layer overlapping each two adjacent pads of the first metal layer and separated from at least one pad by the insulation layer; and wherein the number of spiral inductors is one more than the number of pads of the capacitive pi network, wherein one inductor is coupled between an input port of the filter and one pad of the capacitive pi network, another inductor is coupled between the another pad of the capacitive pi network and an output port of the filter, and each of the remaining inductors is coupled between two adjacent pads of the capacitive pi network, wherein each inductor includes a first trace of the first metal layer looped into a coil and ending at an interior end, includes a second trace of the first metal layer disposed adjacent to the first trace, and includes a connecting bridge of the second metal layer contacting the interior end of the first trace and the second trace while bridging over an intermediate portion of the first trace and separated therefrom by the insulation layer, wherein each trace provides an electrical connection to the inductor.