US4880893A
Expired / Lapsed
US
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Novel thermosetting compositions and molding method
Assignee: Plastics Engineering Co
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Filing: 1988-12-28
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Granted: 1989-11-14
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Expires: 2008-12-28
Abstract
Abstract A thermosetting resin containing composition can be heated to reduce its viscosity and used as a liquid in a liquid injection molding method. It has a phenolic resin content of about 80% to about 90% solids by weight, and contains about 5% to about 40% of a polyglycol. The composition may also contain resorcinol as a compatibilizing agent and a polyalkylene gylcol as the polyglycol agent. In a novel method the resin containing composition is heated to reduce its viscosity and introduced into a heated mold in a liquid injection molding method.
Inventors
- 👤 Phillip A. Waitkus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 10:15
CPC Classifications
C; C08; C08G; C08G8/00; C08G8/04; C08G8/08; C08G8/10; C08G8/24; C08J; C08J5/00; C08J5/04; C08J5/0405; C08J5/043; C08J5/10; C08J5/24; C08J5/241; C08J5/244; C08J5/249; C08L; C08L61/00; C08L61/04; C08J2361/00; C08J2361/04; C08J2361/06
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
35 words
A thermosetting resin composition useful in liquid injection molding processes comprises a high solids content phenolic resin and an effective amount of a polyglycol to improve clarity and to prevent voids in the cured product.
Claim 2
Dependent Claim
35 words
A thermosetting resin composition useful in liquid injection molding processes comprises a high solids content phenolic resin and an effective amount of a polyglycol to improve clarity and to prevent voids in the cured product.
Claim 3
Dependent Claim
55 words
A thermosetting phenolic resin composition, which can be liquified with heating for use in liquid injection molding processes, contains about 80% to about 90% solids by weight of a phenolic resin and about 5% to about 40% by weight of a polyglycol which improves the clarity of the final cured product made from the composition.
Claim 4
Dependent Claim
55 words
A thermosetting phenolic resin composition, which can be liquified with heating for use in liquid injection molding processes, contains about 80% to about 90% solids by weight of a phenolic resin and about 5% to about 40% by weight of a polyglycol which improves the clarity of the final cured product made from the composition.
Claim 5
Dependent Claim
10 words
A composition of claim 2 which also contains a catalyst.
Claim 6
Dependent Claim
19 words
A composition of claim 2 which also contains a compatibilizing agent which reduces the amount of acidic catalyst required.
Claim 7
Dependent Claim
15 words
A composition of claim 4 in which the compatibilizing agent is an active phenol derivative.
Claim 8
Dependent Claim
16 words
A composition of claim 2 which contains an effective amount of sodium hydroxide as a catalyst.
Claim 9
Independent Claim
42 words
A method of preparing a molded object from a high solids content phenolic resin containing composition which comprises heating said composition to reduce its viscosity, introducing the lowered viscosity composition into a heated mold, then removing the molded object from the mold.
Claim 10
Independent Claim
42 words
A method of preparing a molded object from a high solids content phenolic resin containing composition which comprises heating said composition to reduce its viscosity, introducing the lowered viscosity composition into a heated mold, then removing the molded object from the mold.
Claim 11
Dependent Claim
33 words
The method of claim 7 in which the high solids content resin containing composition also contains about 5% to about 25% by weight of a compatibilizing agent which is a reactive phenol derivative.
Claim 12
Dependent Claim
12 words
The method of claim 8 in which the compatibilizing agent is resorcinol.
Claim 13
Dependent Claim
24 words
The method of claim 7 in which the high solids content resin contains about 5% to about 40% by weight of a polyalkylene glycol.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-11-13 | 1993-05-15 | 1993-11-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-11-13 | 1997-05-15 | 1997-11-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-11-13 | 2001-05-15 | 2001-11-14 | $7700.00 | Window Closed / Lapsed |