Two-phase cooling apparatus for electronic equipment and the like

Claim 2

A two-phase cooling device for transferring heat from an item to be cooled, said cooling device comprising: a sealed enclosure having a generally hollow interior defined at least in part by first and second thermally conductive walls spaced apart from one another and by side walls interconnecting said first and second thermally conductive walls, said first thermally conductive wall being adapted for interconnection with the item to be cooled in a thermally conductive relationship therewith; at least one partition extending through said interior of said enclosure to at least partially divide said interior into a heat intake chamber and a heat rejection chamber, said partition having at least one partition opening extending therethrough for providing fluid communication between said heat intake and rejection chamber; a wick structure disposed within said interior of said enclosure, said wick structure having a first wick portion disposed within said heat intake chamber and extending along at least a portion of said first thermally conductive wall in direct contact therewith for thermal conductivity therebetween, and a second wick portion protruding transversely from said wick portion, said second wick portion extending through both said heat intake chamber and said partition and extending into said heat rejection chamber, said second wick portion having a free end disposed in said heat rejection chamber; said first wick portion having a generally hollow recess in an opposite side thereof from said first thermally conductive wall, said hollow recess opening into said heat intake chamber; said second wick portion further being spaced apart from said side walls and having a wick opening extending therethrough at a location between said first wick portion and said partition for providing fluid communication between opposite sides of said second wick portion within said heat intake chamber; and a thermally conductive liquid disposed within said heat rejection chamber at a liquid level above said free end of said second wick portion, said liquid being capable of being transported through said second wick portion and into said first wick portion wherein said liquid is evaporated by heat from the item to be cooled and condensed on the surfaces defined by said hollow recess in said first wick portion and by said partition and on the surface of said liquid.

Claim 3

A cooling device according to claim 1, further including a plurality of said second wick portions spaced apart from one another and protruding transversely from said first wick portion, said thermally conductive liquid being disposed within said heat rejection chamber at a liquid level above said free ends of at least some of said second wick portions, and said first wick portion having at least one of said generally hollow recesses disposed between each adjacent spaced-apart pair of said second wick portions.

Claim 4

A cooling device according to claim 2, wherein said partition includes an opening between each adjacent spaced-apart pair of said second wick portions for said fluid communication between said heat intake and rejection chambers.

Claim 5

A cooling device according to claim 1, wherein said generally hollow recess in said first wick portion includes at least a second generally hollow recess therein in order to define a stepped recess configuration.

Claim 6

A cooling device according to claim 1, wherein said second thermally conductive wall includes at least one heat transfer fin protruding therefrom into said heat rejection chamber.

Claim 7

A cooling device according to claim 1, wherein said second thermally conductive wall is adapted for interconnection with a heat sink in a thermally conductive relationship therewith, said heat sink being at a temperature lower than that of said item to be cooled.

Claim 8

A cooling device according to claim 1, wherein said first wick portion is composed of a different material than that of said second wick portion.

Claim 9

A cooling device according to claim 7, wherein the material of said first wick portion has a lower thermal conductivity than that of the material of said second wick portion.

Claim 10

A cooling device according to claim 1, wherein at least a portion of said partition is spaced apart from at least one of said side walls in order to provide for said fluid communication between said heat intake and rejection chambers.

Claim 11

A cooling device according to claim 1, wherein the resistance to the flow of said evaporated liquid through said fist wick portion is greater than the resistance to the flow of said evaporated liquid through said hollow recess.

Claim 12

A cooling device according to claim 1, further including a second partition at least partially spaced apart from said first partition and sealingly interconnected therewith to define a sealed intermediate chamber between said heat intake and rejection chambers, said first and second partitions and said intermediate chamber being spaced away from at least one of said side walls in order to define said opening for providing said fluid communication between said heat intake and rejection chambers.

Claim 13

A cooling device according to claim 11, further including a second thermally conductive liquid therein, said second thermally conductive liquid having an evaporation temperature higher than that of said first thermally conductive liquid, said second thermally conductive liquid tending to stabilize the temperature of said first thermally conductive liquid within a predetermined temperature range during operation of said cooling device.

Claim 14

A cooling device according to claim 12, wherein said second partition is disposed between said first wick portion and said first partition, said second partition having at least a portion thereof sloped in a generally downward direction generally toward at least one of said side walls.

Claim 15

A cooling device according to claim 13, wherein said wick opening in said second wick portion is disposed between said first wick portion and said second partition.

Claim 16

A two-phase cooling device for transferring heat from an item to be cooled, said cooling device comprising: a sealed enclosure having a generally hollow interior defined at least in part by first and second thermally conductive walls spaced apart from one another and by side walls interconnecting said first and second thermally conductive walls, said first thermally conductive wall being adapted for interconnection with the item to be cooled in a thermally conductive relationship therewith; a wick structure disposed within said interior of said enclosure, said hollow interior and extending along at least a portion of said first thermally conductive wall in direct contact therewith for thermal conductivity therebetween, and a second wick portion protruding transversely from said wick portion, and extending through a substantial portion of said hollow interior, said second wick portion having a free end disposed generally adjacent said second thermally conductive wall; said first wick portion having a generally hollow recess in an opposite side thereof from said first thermally conductive wall, said hollow recess opening into said hollow interior; and a thermally conductive liquid disposed within said hollow interior at a level above said free end of said second wick portion, said liquid being capable of being transported through said second wick portion and into said first wick portion wherein said liquid is evaporated by heat from the item to be cooled and condensed on the surfaces defined by said hollow recess in first wick portion and on the surface of said liquid.

Claim 17

A two-phase cooling device for transferring heat from an item to be cooled, said cooling device comprising: a sealed enclosure having a generally hollow interior defined at least in part by first and second thermally conductive walls spaced apart from one another and by side walls interconnecting said first and second thermally conductive walls, said first thermally conductive wall being adapted for interconnection with the item to be cooled in a thermally conductive relationship therewith; a wick structure disposed within said interior of said enclosure, said hollow interior and extending along at least a portion of said first thermally conductive wall in direct contact therewith for thermal conductivity therebetween, and a second wick portion protruding transversely from said wick portion, and extending through a substantial portion of said hollow interior, said second wick portion having a free end disposed generally adjacent said second thermally conductive wall; said first wick portion having a generally hollow recess in an opposite side thereof from said first thermally conductive wall, said hollow recess opening into said hollow interior; and a thermally conductive liquid disposed within said hollow interior at a level above said free end of said second wick portion, said liquid being capable of being transported through said second wick portion and into said first wick portion wherein said liquid is evaporated by heat from the item to be cooled and condensed on the surfaces defined by said hollow recess in first wick portion and on the surface of said liquid.

Claim 18

A cooling device according to claim 15, wherein said cooling device further includes at least one partition extending through said interior of said enclosure to at least partially divide said interior into a heat intake chamber and a heat rejection chamber, said partition having at least one partition opening extending therethrough for providing fluid communication said heat intake and rejection chamber.

Claim 19

A cooling device according to claim 15, wherein said generally hollow recess in said first wick portion includes at least a second generally hollow recess therein in order to define a stepped recess configuration.

Claim 20

A cooling device according to claim 15, wherein said second wick portion is further spaced apart from said side walls and has a wick opening extending therethrough at a location between said first wick portion and said partition for providing fluid communication between opposite sides of said second wick portion within said heat intake chamber.

Claim 21

A cooling device according to claim 15, further including a plurality of said second wick portions spaced apart from one another and protruding transversely from said first wick portion, said thermally conductive liquid being disposed within said hollow interior at a liquid level above said free ends of at least some of said second wick portions, and said first wick portion having at least one of said generally hollow recesses disposed between each adjacent spaced-apart pair of said second wick portions.

Claim 22

A cooling device according to claim 15, wherein said second thermally conductive wall includes at least one heat transfer fin protruding therefrom into said heat rejection chamber.

Claim 23

A cooling device according to claim 15, wherein said second thermally conductive wall is adapted for interconnection with a heat sink in a thermally conductive relationship therewith, said heat sink being at a temperature lower than that of said item to be cooled.

Claim 24

A cooling device according to claim 15, wherein said first wick portion is composed of a different material than that of said second wick portion.

Claim 25

A cooling device according to claim 22, wherein the material of said first wick portion has a lower thermal conductivity than that of the material of said second wick portion.

Claim 26

A cooling device according to claim 15, wherein both of said wick portions are composed of a porous metallic material.

Claim 27

A cooling device according to claim 16, further including a second partition at least partially spaced apart from said first partition and sealingly interconnected therewith to define a sealed intermediate chamber between said heat intake and rejection chambers, said first and second partitions and said intermediate chamber being spaced away from at least one of said side walls in order to define said opening for providing said fluid communication between said heat intake and rejection chambers.

Claim 28

A cooling device according to claim 25, further including a second thermally conductive liquid therein, said second thermally conductive liquid having an evaporation temperature higher than that of said first thermally conductive liquid, said second thermally conductive liquid tending to stabilize the temperature of said first thermally conductive liquid within a predetermined range during operation of said cooling device.

Claim 29

A cooling device according to claim 26, wherein said second partition is disposed between said first wick portion and said first partition, said second partition having at least a portion there of sloped in a generally downward direction generally toward at least one of said side walls.

Claim 30

A two-phase cooling device for transferring heat from an item to be cooled, said cooling device comprising: a sealed enclosure having a generally hollow interior defined at least in part by first and second thermally conductive walls spaced apart from one another and by side walls interconnecting said first and second thermally conductive walls, said first thermally conductive wall being adapted for interconnection with the item to be cooled in a thermally conductive relationship therewith; at least one partition extending through said interior of said enclosure to at least partially divide said interior into a heat intake chamber and a heat rejection chamber, at least a portion of said partition is spaced apart from at least one of said side walls in order to provide for fluid communication between said heat intake and rejection chambers, said partition having at least one partition opening extending therethrough for providing additional fluid communication between said heat intake and rejection chamber; a wick structure disposed within said interior of said enclosure, said wick structure having a first wick portion disposed within said heat intake chamber and extending along at least a portion of said first thermally conductive wall in direct contact therewith for thermal conductivity therebetween, and a plurality of second wick portions protruding transversely from said wick portion, said second wick portions extending through both said heat intake chamber and said partition and extending into said heat rejection chamber, said second wick portions having a free end disposed generally adjacent said second thermally conductive wall in said heat rejection chamber; said first wick portion having a number of generally hollow recesses in an opposite side thereof from said first thermally conductive wall, at least one of said generally hollow recesses being disposed between each adjacent spaced-apart pair of said second wick portions, said hollow recess opening into said heat intake chamber and having a second hollow recess therein in order to define a stepped recess configuration; said partition having one of said partition openings between each of said adjacent space-apart pair of said second wick portions; said second wick portions further being spaced apart from said side walls and each having a wick opening extending therethrough at a location between said first wick portion and said partition for providing fluid communication between opposite sides of each of said second wick portions within said heat intake chamber; and a thermally conductive liquid disposed within said heat rejection chamber at a level above said free ends of said second wick portions, said liquid being capable of being transported through said second wick portions and into said first wick portion wherein said liquid is evaporated by heat from the item to be cooled and condensed on the surfaces defined by said hollow recesses in first wick portion and by said partition and on the surface of said liquid, the resistance to the flow of said evaporated liquid through said first wick portion being greater than the resistance to the flow of said evaporated liquid through said hollow recess.

Claim 31

A two-phase cooling device for transferring heat from an item to be cooled, said cooling device comprising: a sealed enclosure having a generally hollow interior defined at least in part by first and second thermally conductive walls spaced apart from one another and by side walls interconnecting said first and second thermally conductive walls, said first thermally conductive wall being adapted for interconnection with the item to be cooled in a thermally conductive relationship therewith; at least one partition extending through said interior of said enclosure to at least partially divide said interior into a heat intake chamber and a heat rejection chamber, at least a portion of said partition is spaced apart from at least one of said side walls in order to provide for fluid communication between said heat intake and rejection chambers, said partition having at least one partition opening extending therethrough for providing additional fluid communication between said heat intake and rejection chamber; a wick structure disposed within said interior of said enclosure, said wick structure having a first wick portion disposed within said heat intake chamber and extending along at least a portion of said first thermally conductive wall in direct contact therewith for thermal conductivity therebetween, and a plurality of second wick portions protruding transversely from said wick portion, said second wick portions extending through both said heat intake chamber and said partition and extending into said heat rejection chamber, said second wick portions having a free end disposed generally adjacent said second thermally conductive wall in said heat rejection chamber; said first wick portion having a number of generally hollow recesses in an opposite side thereof from said first thermally conductive wall, at least one of said generally hollow recesses being disposed between each adjacent spaced-apart pair of said second wick portions, said hollow recess opening into said heat intake chamber and having a second hollow recess therein in order to define a stepped recess configuration; said partition having one of said partition openings between each of said adjacent space-apart pair of said second wick portions; said second wick portions further being spaced apart from said side walls and each having a wick opening extending therethrough at a location between said first wick portion and said partition for providing fluid communication between opposite sides of each of said second wick portions within said heat intake chamber; and a thermally conductive liquid disposed within said heat rejection chamber at a level above said free ends of said second wick portions, said liquid being capable of being transported through said second wick portions and into said first wick portion wherein said liquid is evaporated by heat from the item to be cooled and condensed on the surfaces defined by said hollow recesses in first wick portion and by said partition and on the surface of said liquid, the resistance to the flow of said evaporated liquid through said first wick portion being greater than the resistance to the flow of said evaporated liquid through said hollow recess.

Claim 32

A cooling device according to claim 28, wherein said second thermally conductive wall includes at least one heat transfer fin protruding therefrom into said heat rejection chamber.

Claim 33

A cooling device to claim 29, wherein said second thermally conductive wall is adapted for interconnection with a heat sink in a thermally conductive relationship therewith, said heat sink being at a temperature lower than that of said item to be cooled.

Claim 34

A cooling device according to claim 30, wherein said first wick portion is composed of a different material than that of said second wick portion.

Claim 35

A cooling device according to claim 31, wherein the material of said first wick portion has a lower thermal conductivity than that of the material of said wick portion.

Claim 36

A cooling device according to claim 1, further including a second partition at least partially spaced apart from said first partition and sealingly interconnected therewith to define a sealed intermediate chamber between said heat intake and rejection chambers, and first and second partitions and said intermediate chamber being spaced away from at least one of said side walls in order to define said opening for providing said fluid communication between said heat intake and rejection chambers.

Claim 37

A cooling device according to claim 33, further including a second thermally conductive liquid therein, said second thermally conductive liquid having an evaporation temperature higher than that of said first thermally conductive liquid, said second thermally conductive liquid tending to stabilize the temperature of said first thermally conductive liquid within a predetermined temperature range during operation of said cooling device.

Claim 38

A cooling device according to claim 12, wherein said second partition is disposed between said first wick portion and said first partition, said second partition having at least a portion thereof sloped in a generally downward direction generally toward at least one of said side walls.

Claim 39

A cooling device according to claim 13, wherein said wick openings in said second wick portions is disposed between said first wick portion and said second partition.