Semiconductor integrated circuit device

Claim 1

A semicondcutor integrated circuit device, comprising: a circuit frame; a plurality of carrier modules arranged and held on the same area in said circuit frame so as to be adjacent to one another, each of said carrier modules including a plurality of rectangular integrated circuit chips which are close to one another in a row on the same plane, each of said rectangular integrated circuit chips having a chip surface which is parallel to said plane, and a plurality of internal terminals arranged along a peripheral edge portion of the chip surface, the internal terminal being used for inputting and outputting data to and from said integrated circuit chip; an electrical insulating layer which covers the entire chip surface, except for the internal terminals; a plurality of conductor leads each of which is connected at one end to a corresponding inernal terminal of said plurality of internal terminals, said conductor leads extending along the insulating layer from the internal terminals towards a central portion of the chip surface, each of said conductor leads having a connecting terminal at its other end, said connecting terminal having an area wider than that of the corresponding internal terminal, said connecting terminals being distributed over the entire insulating layer, expect for those regions where the internal terminals are located; first connecting means for electrically connecting said coonnecting terminals in each of said carrier modules to module terminals of the carrier module and distributing the module terminals over a connecting surface which is parallel to said plane and exposed to the outside; and second connecting means for electrically connecting the module terminals of the respective carrier modules to one another and/or to another electrical device.