Reinforced carrier with embedded rigid insert

Claim 2

A rigid carrier for retaining a multiplicity of thin wafers in closely spaced but continuously separated confronting relation to each other and in a stack-like arrangement to accommodate liquid and gaseous spray processing and the many high and low temperature processing steps of the wafers in the production of circuit chips from the wafers, comprising a plurality of plastic structural components adjacent each other and affixed together and arranged to define an integral one-piece rigid container to embrace and confine the wafers, said structural components being widely spaced from each other to permit more open space for access by liquid and gaseous sprays to the wafers confined, certain of said structural components having a multiplicity of teeth formed integrally therewith and projecting inwardly of the certain components to support and space the wafers, adjacent teeth of a said structural component being spaced the width of one of said wafers, and a rigid insert completely embedded in one of said structural components and stiffening the component, said insert being formed of a material which is highly resistant to the influences of temperature in maintaining its shape and rigidity to minimize flexing or deformation of the structural components and the carrier.

Claim 3

A carrier for a multiplicity of thin wafers according to claim 1, wherein said structural components include end components and elongate side components affixed to each other, the side components traversing the edges of the wafers in the stack-like arrangement, and the end components confronting the faces of the wafers, said insert being embedded in one of the side components.

Claim 4

A carrier for a multiplicity of thin wafers according to claim 2, and an insert also being embedded in one of the end components.

Claim 5

A carrier for a multiplicity of thin wafers according to claim 2, wherein the elongate plastic side components are substantially tubular, the rigid insert being rod-like and being confined within one of the tubular plastic side components.

Claim 6

A carrier for a multiplicity of thin wafers according to claim 2, and a plurality of side components and inserts wherein one of the inserts being embedded in each of the side components.

Claim 7

A carrier for a multiplicity of thin wafers according to claim 1, wherein said structural components include end components and elongate side components affixed to each other, the side components traversing the edges of the wafers in the stack-like arrangement, and the end components confronting the faces of the wafers, said insert being embedded in one of the end components.

Claim 8

A carrier for a multiplicity of thin wafers according to claim 6, and at least two end components and a plurality of said inserts wherein one of the inserts being embedded in each of the end components.

Claim 9

A carrier for a multiplicity of thin wafers according to claim 6, wherein one of the plastic end components is generally panel shaped and includes an interior chamber, the rigid insert being in said chamber and in close fitting relation with the plastic end component.

Claim 10

A carrier for a multiplicity of thin wafers according to claim 1, wherein said structural components include end components and elongate side components affixed to each other, one of end components incorporating a plastic molded panel, the side components including elongate rails affixed to the plastic molded panel.

Claim 11

A carrier for a multiplicity of thin wafers according to claim 9, and one of said rails having a rigid rod-shaped insert embedded therein, the insert rod having one end confronting said plastic molded panel.

Claim 12

A carrier for a multiplicity of thin wafers according to claim 10, wherein the end of said rod shaped insert being in a spaced relation with the plastic molded panel.

Claim 13

A carrier for a multiplicity of thin wafers according to claim 10, wherein the end of the rod shaped insert bearing against the plastic molded panel.

Claim 14

A carrier for a multiplicity of thin wafers according to claim 9, wherein said plastic molded panel of the end component of the carrier having a panel shaped rigid insert embedded and completely encased in said plastic molded panel.

Claim 15

A carrier for a multiplicity of thin wafers according to claim 1, wherein said insert is formed of a material selected from a group of materials including quartz, ceramics, glass, and metals resistant to corrosion including stainless steel.

Claim 16

A rigid carrier for retaining a multiplicity of thin wafers in closely spaced but continuously separated confronting relation to each other and in a stack-like arrangement to accommodate liquid and gaseous spray processing and the many high and low temperature processing steps of the wafers in the production of circuit chips from the wafers, comprising a plurality of plastic structural components adjacent each other and affixed together and arranged to define an integral one-piece rigid container to embrace and confine the wafers, said structural components being widely spaced from each other to permit more open space for access by liquid and gaseous sprays to the wafers confined, wherein said structural components include end components and elongate side components affixed to each other, the side components traversing the edges of the wafers in the stack-like arrangement, said side components having a multiplicity of teeth formed integrally therewith and projecting inwardly of the side components to support and space the wafers, adjacent teeth of a said side component being spaced the width of one of said wafers, and the end components confronting the faces of the wafers, and a rigid insert completely embedded in one of said structural components and stiffening the component, said insert being formed of a material which is highly resistant to the influences of temperature in maintaining its shape and rigidity to minimize flexing or deformation of the structural components and the carrier.

Claim 17

A rigid carrier for retaining a multiplicity of thin wafers in closely spaced but continuously separated confronting relation to each other and in a stack-like arrangement to accommodate liquid and gaseous spray processing and the many high and low temperature processing steps of the wafers in the production of circuit chips from the wafers, comprising a plurality of plastic structural components adjacent each other and affixed together and arranged to define an integral one-piece rigid container to embrace and confine the wafers, said structural components being widely spaced from each other to permit more open space for access by liquid and gaseous sprays to the wafers confined, wherein said structural components include end components and elongate side components affixed to each other, the side components traversing the edges of the wafers in the stack-like arrangement, said side components having a multiplicity of teeth formed integrally therewith and projecting inwardly of the side components to support and space the wafers, adjacent teeth of a said side component being spaced the width of one of said wafers, and the end components confronting the faces of the wafers, and a rigid insert completely embedded in one of said structural components and stiffening the component, said insert being formed of a material which is highly resistant to the influences of temperature in maintaining its shape and rigidity to minimize flexing or deformation of the structural components and the carrier.

Claim 18

A rigid carrier for retaining a multiplicity of thin wafers in closely spaced but continuously separated confronting relation to each other and in a stack-like arrangement to accommodate liquid and gaseous spray processing and the many high and low temperature processing steps of the wafers in the production of circuit chips from the wafers, comprising a plurality of plastic structural components adjacent each other and affixed together and arranged to define an integral one-piece rigid container to embrace and confine the wafers, said structural components being widely spaced from each other to permit more open space for access by liquid and gaseous sprays to the wafers confined, wherein said structural components include end components and elongate side components affixed to each other, the side components traversing the edges of the wafers in the stack-like arrangement, said side components each being substantially tubular and having a multiplicity of teeth formed integrally therewith projecting inwardly of the side components to support and space the wafers, adjacent teeth of a said side component being spaced the width of one of said wafers, and the end components each being generally panel shaped and including an interior chamber and the end components confronting the faces of the wafers and being affixed to the side components, and a rigid insert completely embedded in one of said structural components and stiffening the component, said insert being formed of a material which is highly resistant to the influences of temperature in maintaining its shape and rigidity to minimize flexing or deformation of the structural components and the carrier.

Claim 19

A rigid carrier for retaining a multiplicity of thin wafers in closely spaced but continuously separated confronting relation to each other and in a stack-like arrangement to accommodate liquid and gaseous spray processing and the many high and low temperature processing steps of the wafers in the production of circuit chips from the wafers, comprising a plurality of plastic structural components adjacent each other and affixed together and arranged to define an integral one-piece rigid container to embrace and confine the wafers, said structural components being widely spaced from each other to permit more open space for access by liquid and gaseous sprays to the wafers confined, wherein said structural components include end components and elongate side components affixed to each other, the side components traversing the edges of the wafers in the stack-like arrangement, said side components each being substantially tubular and having a multiplicity of teeth formed integrally therewith projecting inwardly of the side components to support and space the wafers, adjacent teeth of a said side component being spaced the width of one of said wafers, and the end components each being generally panel shaped and including an interior chamber and the end components confronting the faces of the wafers and being affixed to the side components, and a rigid insert completely embedded in one of said structural components and stiffening the component, said insert being formed of a material which is highly resistant to the influences of temperature in maintaining its shape and rigidity to minimize flexing or deformation of the structural components and the carrier.