US4868635A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame for integrated circuit
Assignee: Texas Instruments Inc
•
Filing: 1988-01-13
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Granted: 1989-09-19
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Expires: 2008-01-13
Abstract
Abstract An integrated circuit lead frame is configured so that it may be die stamped to cut lead frame leads to customize it for a particular semiconductor device bar size. Lead frame leads are cut at a specified distance from the lead frame bar pad so that a semiconductor device bar which is larger than the bar pad may be mounted on the bar pad and cut segments of lead frame leads that are attached to the bar pad.
Inventors
- 👤 Raymond A. Frechette
- 👤 Eugenijus Uzpurvis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 07:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
102 words
A lead frame structure for mounting semiconductor devices comprising: a lead frame support structure; a semiconductor bar pad forming a mounting surface for a semiconductor device; a plurality of leads connected between said lead frame support structure and said semiconductor bar pad, and integral therewith, and arrayed along at least two sides of the semiconductor bar pad; a die cut separating said plurality of leads into two parts, one part adjacent to and attached to the semiconductor bar pad, such that the size of the bar pad mounting surface is enlarged by the plurality of lead parts attached to the bar pad.
Claim 2
Dependent Claim
102 words
A lead frame structure for mounting semiconductor devices comprising: a lead frame support structure; a semiconductor bar pad forming a mounting surface for a semiconductor device; a plurality of leads connected between said lead frame support structure and said semiconductor bar pad, and integral therewith, and arrayed along at least two sides of the semiconductor bar pad; a die cut separating said plurality of leads into two parts, one part adjacent to and attached to the semiconductor bar pad, such that the size of the bar pad mounting surface is enlarged by the plurality of lead parts attached to the bar pad.
Claim 3
Dependent Claim
24 words
The lead frame structure according to claim 1, wherein said die cut leaves lead frame lead segments extending radially from the semiconductor bar pad.
Claim 4
Dependent Claim
33 words
The lead frame structure according to claim 2, in combination with a semiconductor device, the semiconductor device being mounted on the semiconductor bar pad and extending out over said radially extending lead segments.
Claim 5
Dependent Claim
23 words
The lead frame structure according to claim 1, including scored tie bars connecting the semiconductor bar pad to the lead frame support structure.
Claim 6
Dependent Claim
19 words
The lead frame according to claim 1, wherein lead frame leads extend to two sides of the lead frame.
Claim 7
Dependent Claim
19 words
The lead frame according to claim 1, wherein lead frame leads extend to four sides of the lead frame.
Claim 8
Dependent Claim
30 words
The lead frame structure according to claim 1, wherein lead frame leads extend essentially radially from the semiconductor bar pad, but extend to only two sides of the lead frame.
Claim 9
Dependent Claim
29 words
The lead frame structure according to claim 1, wherein lead frame leads extend essentially radially from the semiconductor bar pad, and extend to four sides of the lead frame.
Claim 10
Dependent Claim
112 words
A lead frame structure for mounting semiconductor devices comprising: a lead frame support structure; a semiconductor bar pad forming a mounting surface for a semiconductor device; a plurality of leads connected between said lead frame support structure and said semiconductor bar pad, and integral therewith, and arrayed along at least two sides of the semiconductor bar pad; a die cut separating said plurality of leads into two parts on two sides of said bar pad, one part adjacent to and attached to the semiconductor bar pad, such that the size of the bar pad mounting surface is enlarged on two sides by the plurality of lead parts attached to the bar pad.
Claim 11
Dependent Claim
112 words
A lead frame structure for mounting semiconductor devices comprising: a lead frame support structure; a semiconductor bar pad forming a mounting surface for a semiconductor device; a plurality of leads connected between said lead frame support structure and said semiconductor bar pad, and integral therewith, and arrayed along at least two sides of the semiconductor bar pad; a die cut separating said plurality of leads into two parts on two sides of said bar pad, one part adjacent to and attached to the semiconductor bar pad, such that the size of the bar pad mounting surface is enlarged on two sides by the plurality of lead parts attached to the bar pad.
Claim 12
Dependent Claim
27 words
The lead frame structure according to claim 9, wherein said lead frame segment lengths depending upon the dimension of the a semiconductor device to be mounted thereupon.
Claim 13
Dependent Claim
40 words
The semiconductor lead frame structure according to claim 9, wherein the lead frame leads extend from four sides of the semiconductor bar pad are separated into two segments, one segment attached to the bar pad enlarging the semiconductor mounting area.
Claim 14
Dependent Claim
95 words
A lead frame structure for mounting semiconductor devices comprising: a lead frame support structure; a semiconductor bar pad forming a mounting surface for a semiconductor device; a plurality of leads connected between said lead frame support structure and said semiconductor bar pad, and integral therewith, and arrayed along at least two sides of the semiconductor bar pad; said lead being in two segments, a first segment adjacent to and connected to the bar pad enlarging the mounting surface of the bar pad, and a second segment of the lead being attached to the lead frame.
Claim 15
Dependent Claim
95 words
A lead frame structure for mounting semiconductor devices comprising: a lead frame support structure; a semiconductor bar pad forming a mounting surface for a semiconductor device; a plurality of leads connected between said lead frame support structure and said semiconductor bar pad, and integral therewith, and arrayed along at least two sides of the semiconductor bar pad; said lead being in two segments, a first segment adjacent to and connected to the bar pad enlarging the mounting surface of the bar pad, and a second segment of the lead being attached to the lead frame.
Claim 16
Dependent Claim
31 words
The lead frame structure according to claim 12, wherein the cut lead frame lead segments attached to the bar pad extend out essentially radially and present an enlarged semiconductor mounting area.
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JPS55113356A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-09-18 | 1993-03-20 | 1993-09-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-09-18 | 1997-03-20 | 1997-09-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-09-18 | 2001-03-20 | 2001-09-19 | $7700.00 | Window Closed / Lapsed |