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US4864383A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of fabrication of a chip carrier package, a flush-contact chip carrier package and an application to cards containing components

Assignee: EUROTECNIQUE ZI
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Filing: 1986-10-02
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Granted: 1989-09-05
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Expires: 2006-10-02
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Abstract

Abstract A micromodule or chip carrier package for chip containing components has an insulating support base for carrying a series of flush-mounted contact areas. A semiconductor circuit or chip is placed on one of the contact areas and the chip is connected to the other contact areas by means of wires. A hollow case is mounted over the assembly and has a bore for receiving a drop of resin which has the function of protecting the semiconductor circuit or chip.

Inventors

  • 👤 Jean P. Gloton
  • 👤 Philippe Peres

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 03:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 141 words
A chip carrying package for use in a portable chip carrying card of the kind which can be removably inserted in a card reading apparatus, said package comprising an insulating base support having an upper surface and a lower surface, conductive leads deposited on the upper surface of the base support, openings provided in said base support for exposing a portion of at least one of said conductive leads and making said exposed portion accessible from the lower surface of the support for direct electrical contact with contact elements of a card reading apparatus, a semiconductor chip mounted on the upper surface of the support and electrically connected through electrical connections to said conductive leads, a hollow case placed on the upper surface of the support surrounding said chip and said electrical connections, and a protective resin filling said hollow case.
Claim 2
Dependent Claim 141 words
A chip carrying package for use in a portable chip carrying card of the kind which can be removably inserted in a card reading apparatus, said package comprising an insulating base support having an upper surface and a lower surface, conductive leads deposited on the upper surface of the base support, openings provided in said base support for exposing a portion of at least one of said conductive leads and making said exposed portion accessible from the lower surface of the support for direct electrical contact with contact elements of a card reading apparatus, a semiconductor chip mounted on the upper surface of the support and electrically connected through electrical connections to said conductive leads, a hollow case placed on the upper surface of the support surrounding said chip and said electrical connections, and a protective resin filling said hollow case.

References Cited (Backward Citations)

US4056681A Cited
US4138691A Cited
US4323914A Cited
US4532419A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-09-04 1993-03-06 1993-09-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-09-04 1997-03-06 1997-09-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-09-04 2001-03-06 2001-09-05 $7700.00 Window Closed / Lapsed

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