US4859268A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of using electrically conductive composition
Assignee: International Business Machines Corp
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Filing: 1988-05-27
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Granted: 1989-08-22
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Expires: 2008-05-27
Abstract
Abstract An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electrically conductive bond between a supporting substrate and a semiconductor.
Inventors
- 👤 Charles A. Joseph
- 👤 James R. Petrozello
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 20:56
CPC Classifications
C; C04; C04B; C04B26/00; C04B26/02; C04B26/10; C04B26/14; H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31515; Y10T428/31518; Y10T428/31522
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
158 words
A method of bonding a semiconductor to a substrate which comprises: (A) applying to at least one of said semiconductor and said substrate a composition containing: (1) about 15% to 65% by weight of a photosensitive epoxy polymer component; (2) about 1% to about 15% by weight of a plasticizer reactive with said epoxy polymer component; and (3) about 25 to about 80% by weight of electrically conductive particles having electrically conductive outer surfaces selected from the group of platinum, palladium, gold or mixtures thereof, and being spherical in shape; wherein the above amounts of (1), (2) and (3) are based upon the total weight of (1), (2) and (3) and wherein said composition provides electrical conductivity between said semiconductor and said substrate; exposing said composition to ultraviolet light bringing together said substrate and said conductor with the said composition interposed between said semiconductor and said substrate; and permitting said composition to harden to thereby form said bonding.
Claim 2
Independent Claim
158 words
A method of bonding a semiconductor to a substrate which comprises: (A) applying to at least one of said semiconductor and said substrate a composition containing: (1) about 15% to 65% by weight of a photosensitive epoxy polymer component; (2) about 1% to about 15% by weight of a plasticizer reactive with said epoxy polymer component; and (3) about 25 to about 80% by weight of electrically conductive particles having electrically conductive outer surfaces selected from the group of platinum, palladium, gold or mixtures thereof, and being spherical in shape; wherein the above amounts of (1), (2) and (3) are based upon the total weight of (1), (2) and (3) and wherein said composition provides electrical conductivity between said semiconductor and said substrate; exposing said composition to ultraviolet light bringing together said substrate and said conductor with the said composition interposed between said semiconductor and said substrate; and permitting said composition to harden to thereby form said bonding.
Claim 3
Dependent Claim
25 words
The method of claim 1 wherein said epoxy polymer is a reaction product of an α, β ethylenically unsaturated carboxylic acid and epichlorohydrinbisphenol A epoxy.
Claim 4
Dependent Claim
18 words
The method of claim 1 wherein the plasticizer is a polyalkylene glycol, or polyoxyalkylene glycol, or mixtures thereof.
Claim 5
Dependent Claim
11 words
The method of claim 1 wherein said plasticizer is polyethylene glycol.
Claim 6
Dependent Claim
10 words
The method of claim 1 wherein said particles are hollow.
Claim 7
Dependent Claim
12 words
The method of claim 1 wherein said particles are hollow gold particles.
Claim 8
Dependent Claim
34 words
The method of claim 1 which contains about 35% to 45% by weight of (1), about 1% to about 10% by weight of (2), and about 35% to about 60% by weight of (3).
Claim 9
Dependent Claim
13 words
The method of claim 1 wherein said semiconductor is silicon or polycrystalline silicon.
Claim 10
Dependent Claim
12 words
The method of claim 8 wherein said substrate is a ceramic substrate.
Claim 11
Dependent Claim
12 words
The method of claim 1 wherein said substrate is a ceramic substrate.
Claim 12
Dependent Claim
17 words
The method of claim 1 which comprises applying said composition to both said semiconductor and said substrate.
Claim 13
Dependent Claim
34 words
The method of claim 11 wherein said composition is exposed to ultraviolet light of about 300 to about 400 millimicrons prior to bringing together said semiconductor and said substrate to partially polymerize said coating.
Claim 14
Dependent Claim
40 words
The method of claim 12 which further includes subjecting said composition to a second exposure with ultraviolet time of about 180 to about 250 millimicrons to cause said composition to flow, and then bringing together said semiconductor and said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-21 | 1993-02-20 | 1993-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-21 | 1997-02-20 | 1997-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-21 | 2001-02-20 | 2001-08-22 | $7700.00 | Window Closed / Lapsed |