US4857129A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of bonding thermoplastic material using radio frequency energy
Assignee: PLASTICS WELDING TECHNOLOGY Inc A CORP OF
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Filing: 1987-07-31
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Granted: 1989-08-15
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Expires: 2007-07-31
Abstract
Abstract Thermoplastic materials having a low dielectric loss tangent and loss index are bonded together using radio frequency energy by employing a polyvinyl chloride buffer above and below the materials being bonded while applying pressure and rf energy. The polyvinyl chloride is a highly plasticized polyvinyl chloride which has a bonding temperature lower than the bonding temperature of the material being bonded. In spite of the fact that the bonding temperature of the polyvinyl chloride is lower than the bonding temperature of the low loss material an effecitve bond is produced between the low loss material.
Inventors
- 👤 Richard K. Jensen
- 👤 Barbara Mandano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 16:36
CPC Classifications
B; B29; B29C; B29C66/00; B29C66/80; B29C66/83; B29C66/832; B29C66/8322; B29C65/00; B29C65/02; B29C65/04; B29C65/18; B29C65/72; B29C66/004; B29C66/0042; B29C66/0044; B29C66/70; B29C66/71; B29C66/73; B29C66/731; B29C66/7314; B29C66/73143; B29C66/739; B29C66/7392; B29C66/73921; B29C66/81; B29C66/812; B29C66/8122; B29C66/8126; B29C66/81262; B29C66/81263; B32; B32B; B32B37/00; B32B37/04; B32B37/06; B29C35/00; B29C35/02; B29C35/08; B29C66/82; B29C66/824; B29C66/8242; B29K; B29K2023/00; B29K2023/04; B29K2023/06; B29K2023/0608; B29K2023/0625; B29K2067/00
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
178 words
A method of bonding a first thermoplastic material having a first and second surface to a second adjacent material having a first and second surface said materials each having a dielectric loss factor less than about 0.1 at 27 MHz; the method comprising: positioning said first and second material so that their respective first surfaces overlie and contact each other; positioning plasticized polyvinyl chloride sheets each having a first surface above and below the first and second materials with one each of said first surfaces of said first and second polyvinyl chloride sheets in contact with one each of said second surfaces of said first and second thermoplastic materials, said first thermoplastic material having a minumum bonding temperature higher than a temperature at which said plasticized polyvinyl chloride flow; applying pressure from above and below said polyvinyl chloride thereby comprising said first and second materials together and applying rf energy at about 27 MHz to the polyvinyl chloride sheets and first and second materials to effectively soften and then bond said first and second materials to each other.
Claim 2
Independent Claim
178 words
A method of bonding a first thermoplastic material having a first and second surface to a second adjacent material having a first and second surface said materials each having a dielectric loss factor less than about 0.1 at 27 MHz; the method comprising: positioning said first and second material so that their respective first surfaces overlie and contact each other; positioning plasticized polyvinyl chloride sheets each having a first surface above and below the first and second materials with one each of said first surfaces of said first and second polyvinyl chloride sheets in contact with one each of said second surfaces of said first and second thermoplastic materials, said first thermoplastic material having a minumum bonding temperature higher than a temperature at which said plasticized polyvinyl chloride flow; applying pressure from above and below said polyvinyl chloride thereby comprising said first and second materials together and applying rf energy at about 27 MHz to the polyvinyl chloride sheets and first and second materials to effectively soften and then bond said first and second materials to each other.
Claim 3
Dependent Claim
15 words
The method claimed in claim 1 wherein said first and second thermoplastic materials are films.
Claim 4
Dependent Claim
17 words
The method claimed in claim 2 wherein said first and second materials are the same thermoplastic materials.
Claim 5
Dependent Claim
15 words
The method claimed in claim 1 wherein polyvinyl chloride has more than 50 phr plasticizer.
Claim 6
Dependent Claim
19 words
The method claimed in claim 1 wherein said polyvinyl chloride has a bonding temperature less than about 220° F.
Claim 7
Dependent Claim
14 words
The method claimed in claim 3 wherein said first thermoplastic material is polyvinyl fluoride.
Claim 8
Dependent Claim
15 words
The method claimed in claim 3 wherein said first thermoplastic material is high density polyethylene.
Claim 9
Dependent Claim
13 words
The method claimed in claim 3 wherein said first thermoplastic material is polypropylene.
Claim 10
Dependent Claim
15 words
The method claimed in claim 3 wherein said first thermoplastic material is spun bonded polyethylene.
Claim 11
Dependent Claim
12 words
The method claimed in claim 3 wherein said thermoplastic material is polyetheretherketone.
Claim 12
Independent Claim
219 words
A method of bonding a first surface of a first sheet of thermoplastic material to a first surface of a second adjacent sheet of thermoplastic material wherein said first surfaces are in contact with each other, said materials having the same chemical composition having a dielectric loss factor less than about 0.1 at about 27 MHz and a bonding temperature comprising: positioning a first sheet of double plasticized polyvinyl chloride above said first sheet of thermoplastic material with a first surface of said first polyvinyl chloride sheet in contact with a second surface of said first thermoplastic material and positioning a second sheet of double plasticized polyvinyl chloride below said second sheet of thermoplastic material with a first surface of said second sheet of polyvinyl chloride in contact with a second surface of said second thermoplastic material said polyvinyl chloride sheets having a bonding temperature lower than the bonding temperature of said thermoplastic materials; wherein said thermoplastic materials are selected from the group consisting of polyvinyl fluoride, polyetheretherketone and polymide; applying pressure against said polyvinyl chloride sheets thereby forcing said thermoplastic sheets together and applying rf energy to said polyvinyl chloride sheets and said first and second sheets to effectively soften and bond said first and second thermoplastic sheets wherein said rf energy is applied at about 27 MHz.
Claim 13
Independent Claim
219 words
A method of bonding a first surface of a first sheet of thermoplastic material to a first surface of a second adjacent sheet of thermoplastic material wherein said first surfaces are in contact with each other, said materials having the same chemical composition having a dielectric loss factor less than about 0.1 at about 27 MHz and a bonding temperature comprising: positioning a first sheet of double plasticized polyvinyl chloride above said first sheet of thermoplastic material with a first surface of said first polyvinyl chloride sheet in contact with a second surface of said first thermoplastic material and positioning a second sheet of double plasticized polyvinyl chloride below said second sheet of thermoplastic material with a first surface of said second sheet of polyvinyl chloride in contact with a second surface of said second thermoplastic material said polyvinyl chloride sheets having a bonding temperature lower than the bonding temperature of said thermoplastic materials; wherein said thermoplastic materials are selected from the group consisting of polyvinyl fluoride, polyetheretherketone and polymide; applying pressure against said polyvinyl chloride sheets thereby forcing said thermoplastic sheets together and applying rf energy to said polyvinyl chloride sheets and said first and second sheets to effectively soften and bond said first and second thermoplastic sheets wherein said rf energy is applied at about 27 MHz.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1992-08-14 | 1993-02-13 | 1993-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-14 | 1997-02-13 | 1997-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-14 | 2001-02-13 | 2001-08-15 | $7700.00 | Window Closed / Lapsed |