US4853491A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip carrier
Assignee: Olin Corp
•
Filing: 1985-09-27
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Granted: 1989-08-01
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Expires: 2005-09-27
Abstract
Abstract A chip carrier and a process of assembling a chip carrier are disclosed. The carrier used for mounting a chip comprises a copper or copper base alloy component having a thin refractory oxide layer on a surface thereof. The surface and the oxide layer have an indentation formed therein for receiving the chip. A metallic circuit pattern for electrical connection to the chip is bonded to the oxide layer and insulated from the copper or copper base alloy by the refractory oxide layer. A seal is provided for enclosing the chip to the indentation. Another embodiment of the invention includes a circuit board structure comprising a circuit board device having a first coefficient of thermal expansion. A chip carrier is provided having a second coefficient thermal expansion of substantially the same value as the first coefficient of thermal expansion. The chip carrier has electrical leads soldered to the circuit board whereby thermal cycling of the circuit board structure does not substantially stress the bond between the solder, leads and circuit board.
Inventors
- 👤 Sheldon H. Butt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:22
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
124 words
A leadless chip carrier adapted for mounting a chip, comprising: a copper base alloy substrate adapted to support the chip, said substrate having an indentation adapted to received said chip; a copper base alloy circuit foil adapted to be electrically connected to said chip; said circuit foil and said substrate having a desired coefficient of thermal expansion; a bonding component having a coefficient of thermal expansion of at least about 160×10 -7 in/in/°C. for bonding said circuit foil to said substrate, said coefficient of thermal expansion of said bonding component being closely matched to said desired coefficient of thermal expansion; and means bonded to said circuit foil for enclosing said indentation and forming an enclosure adapted to seal said chip within said chip carrier.
Claim 2
Dependent Claim
124 words
A leadless chip carrier adapted for mounting a chip, comprising: a copper base alloy substrate adapted to support the chip, said substrate having an indentation adapted to received said chip; a copper base alloy circuit foil adapted to be electrically connected to said chip; said circuit foil and said substrate having a desired coefficient of thermal expansion; a bonding component having a coefficient of thermal expansion of at least about 160×10 -7 in/in/°C. for bonding said circuit foil to said substrate, said coefficient of thermal expansion of said bonding component being closely matched to said desired coefficient of thermal expansion; and means bonded to said circuit foil for enclosing said indentation and forming an enclosure adapted to seal said chip within said chip carrier.
Claim 3
Dependent Claim
18 words
A leadless chip carrier as in claim 1 wherein said circuit foil has an electrical circuit etched therein.
Claim 4
Dependent Claim
22 words
A leadless chip carrier as in claim 2 comprising said bonding component being selected from the group consisting of glass and ceramics.
Claim 5
Dependent Claim
20 words
A leadless chip carrier as in claim 3 comprising said desired coefficient of thermal expansion being about 171×10 -7 in/in/°C.
Claim 6
Dependent Claim
46 words
A leadless chip carrier as in claim 3 wherein the copper base alloy of said copper base alloy substrate and said copper base alloy circuit foil comprises an effective amount of up to about 12% aluminum to form a refractory oxide and the balance essentially copper.
Claim 7
Dependent Claim
34 words
A chip carrier as in claim 5 wherein both said copper base alloy substrate and said circuit foil consist essentially of 2.5 to 3.1% aluminum, 1.5 to 2.1% silicon and the balance essentially copper.
Claim 8
Dependent Claim
24 words
A leadless chip carrier as in claim 4 wherein said substrate includes a high conductivity clad for increasing the thermal conductivity of said substrate.
Claim 9
Dependent Claim
39 words
A leadless chip carrier as in claim 4 wherein said copper base alloy substrate and said copper base alloy foil each have a refractory oxide layer on at least one surface for enhancing the bond to said bonding component.
Claim 10
Dependent Claim
19 words
A leadless chip carrier as in claim 8 wherein the refractory oxide layers include Al 2 O 3 .
References Cited (Backward Citations)
US3165672A
Cited
US3341369A
Cited
US3296099A
Cited
US3611046A
Cited
US3475227A
Cited
US3546363A
Cited
DE1907567A1
Cited
US3495023A
Cited
US3618203A
Cited
US3676748A
Cited
US3730779A
Cited
US3676292A
Cited
US3852148A
Cited
US3726987A
Cited
US3826627A
Cited
US3826629A
Cited
US3698964A
Cited
US3676569A
Cited
US3762039A
Cited
US3875478A
Cited
US3714370A
Cited
US3837895A
Cited
US3801728A
Cited
US3810754A
Cited
FR2269793A1
Cited
US4054938A
Cited
US4105861A
Cited
US4109054A
Cited
FR2381388A1
Cited
US4147889A
Cited
US4172272A
Cited
US4408256A
Cited
US4385202A
Cited
US4461924A
Cited
US4684818A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-31 | 1993-01-30 | 1993-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-31 | 1997-01-30 | 1997-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-31 | 2001-01-30 | 2001-08-01 | $7700.00 | Window Closed / Lapsed |