US4853349A
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Glass-ceramics suitable for dielectric substrates
Assignee: Corning Glass Works
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Filing: 1988-05-26
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Granted: 1989-08-01
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Expires: 2008-05-26
Abstract
Abstract This invention is directed to the preparation of two groups of glass-ceramic materials exhibiting properties rendering them especially suitable as substrates for integrated circuit packaging. The first group of materials contains gehlenite, anorthite, and akermanite as the predominant crystal phases and consists essentially, in weight percent of 1-7.25% MgO, 22-40% CaO, 18-36% Al 2 O 3 , and 29-42% SiO 2 . The second group of materials contains gehlenite, anorthite, and hardystoneite as the predominant crystal phases and consists essentially, in weight percent, of 2-13% ZnO, 22-37.5% CaO, 18-34% Al 2 O 3 , and 28-42% SiO 2 .
Inventors
- 👤 Francis W. Martin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 13:35
CPC Classifications
C; C03; C03C; C03C10/00; C03C10/0036; C03C10/0045; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
88 words
A glass-ceramic body exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and akermanite as the predominate crystal phases, said body having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially, expressed in terms of weight percent on the oxide basis, of about 1-7.25% MgO, 22-40% CaO, 18-36% Al 2 O 3 , and 29-42% SiO 2 .
Claim 2
Dependent Claim
88 words
A glass-ceramic body exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and akermanite as the predominate crystal phases, said body having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially, expressed in terms of weight percent on the oxide basis, of about 1-7.25% MgO, 22-40% CaO, 18-36% Al 2 O 3 , and 29-42% SiO 2 .
Claim 3
Dependent Claim
18 words
A glass-ceramic body according to claim 1 wherein anorthite is present in an amount between 5-90% by volume.
Claim 4
Dependent Claim
88 words
A glass-ceramic body exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and hardystoneite as the predominant crystal phases, said body having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially expressed in terms of weight percent on the oxide basis, of about 2-13% ZnO, 22-37.5% CaO, 18-34% Al 2 O 3 , and 28-42% SiO 2 .
Claim 5
Dependent Claim
88 words
A glass-ceramic body exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and hardystoneite as the predominant crystal phases, said body having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially expressed in terms of weight percent on the oxide basis, of about 2-13% ZnO, 22-37.5% CaO, 18-34% Al 2 O 3 , and 28-42% SiO 2 .
Claim 6
Dependent Claim
20 words
A glass ceramic body according to claim 3 wherein anorthite is present in an amount between about 5-90% by volume.
Claim 7
Dependent Claim
95 words
A substrate for integrated circuit packaging comprising a glass-ceramic material exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and akermanite as the predominant crystal phases, said material having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially, expressed in terms of weight percent on the oxide basis, of about 1-7.25% MgO, 22-40% CaO, 18-36% Al 2 O 3 , and 29-42% SiO 2 .
Claim 8
Dependent Claim
95 words
A substrate for integrated circuit packaging comprising a glass-ceramic material exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and akermanite as the predominant crystal phases, said material having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially, expressed in terms of weight percent on the oxide basis, of about 1-7.25% MgO, 22-40% CaO, 18-36% Al 2 O 3 , and 29-42% SiO 2 .
Claim 9
Dependent Claim
95 words
A substrate for integrated circuit packaging comprising a glass-ceramic material exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and hardystoneite as the predominant crystal phases, said material having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially, expressed in terms of weight percent on the oxide basis, of about 2-13% AnO, 22-37.5% CaO, 18-34% Al 2 O 3 , and 28-42% SiO 2 .
Claim 10
Dependent Claim
95 words
A substrate for integrated circuit packaging comprising a glass-ceramic material exhibiting a dielectric constant less than that of Al 2 O 3 , a linear coefficient of thermal expansion (25°-800° C.) between about 50-90×10 -7 /°C., and containing gehlenite, anorthite, and hardystoneite as the predominant crystal phases, said material having a composition essentially free from Li 2 O, Na 2 O, and K 2 O and consisting essentially, expressed in terms of weight percent on the oxide basis, of about 2-13% AnO, 22-37.5% CaO, 18-34% Al 2 O 3 , and 28-42% SiO 2 .
References Cited (Backward Citations)
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