US4838089A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor pressure sensor
Assignee: Denso Corp
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Filing: 1987-05-06
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Granted: 1989-06-13
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Expires: 2007-05-06
Abstract
Abstract The semiconductor pressure sensor embodying the present invention comprises a housing. A sensor board is located in this housing. A pressure-sensing chip, which is formed of a semiconductor and capable of measuring the pressure of a pressure medium, is mounted on the sensor board. Another semiconductor chip, which operates in cooperation with the pressure-sensing chip, is also mounted on the sensor board. A shielding member is located in the housing. This shielding member encloses the pressure-sensing chip in such a manner that the pressure-sensing chip is isolated from the semiconductor chip, and defines a storage chamber which is airtight from the other regions in the housing and adapted to store the pressure-sensing chip. The interior of the housing, except for the storage chamber, is filled with filler, so as to protect the semiconductor chip.
Inventors
- 👤 Hiroshi Okada
- 👤 Yukihiro Kato
- 👤 Osamu Ina
- 👤 Kazuhisa Ikeda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:06
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/14; G01L19/148; G01L19/0007; G01L19/0038; G01L19/0061; G01L19/0084; G01L19/141; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
169 words
A semiconductor pressure sensor for measuring a pressure of a pressure medium, comprising: a housing; a board located in the housing and having a circuit face on which a wiring pattern in formed; a pressure-sensing chip formed of a semiconductor and assembled on the circuit face of the board, the pressure-sensing chip being adapted to measure the pressure of the pressure medium; at least one semiconductor chip assembled on the circuit face of the board and operating in cooperation with the pressure-sensing chip; a shielding member which is located in the housing in such a manner as to isolate the pressure-sensing chip from the semiconductor chip and to define a storage chamber for the pressure-sensing chip in the housing, together with the housing and the board; means, provided in the housing, for guiding a pressure medium to be measured into the storage chamber; and a filler which fills at least the interior of the housing outside the storage chamber such that the semiconductor chip is embedded in the filler.
Claim 2
Dependent Claim
169 words
A semiconductor pressure sensor for measuring a pressure of a pressure medium, comprising: a housing; a board located in the housing and having a circuit face on which a wiring pattern in formed; a pressure-sensing chip formed of a semiconductor and assembled on the circuit face of the board, the pressure-sensing chip being adapted to measure the pressure of the pressure medium; at least one semiconductor chip assembled on the circuit face of the board and operating in cooperation with the pressure-sensing chip; a shielding member which is located in the housing in such a manner as to isolate the pressure-sensing chip from the semiconductor chip and to define a storage chamber for the pressure-sensing chip in the housing, together with the housing and the board; means, provided in the housing, for guiding a pressure medium to be measured into the storage chamber; and a filler which fills at least the interior of the housing outside the storage chamber such that the semiconductor chip is embedded in the filler.
Claim 3
Dependent Claim
46 words
A semiconductor pressure sensor according to claim 1; wherein the shielding member is formed of an elastic material which is secured to the board in an airtight manner and which seals the storage chamber in an airtight manner by contacting an inner surface of the housing.
Claim 4
Dependent Claim
20 words
A semiconductor pressure sensor according to claim 1, wherein the shielding member has a shape that encloses the pressure-sensing chip.
Claim 5
Dependent Claim
55 words
A semiconductor pressure sensor according to claim 1, wherein the shielding member includes: a frame member which encloses the pressure-sensing chip and is secured to the board in an airtight manner, and a sealing member for partitioning the storage chamber by providing a seal between the frame member and the inner surface of the housing.
Claim 6
Dependent Claim
71 words
A semiconductor pressure sensor according to claim 1, wherein the shielding member includes: a shielding element which encloses the pressure-sensing chip and is secured to the board in an airtight manner and which defines a certain gap with the inner surface of the housing, and a filler which partitions the storage chamber in an airtight manner by filling the gap between the shielding element and the inner surface of the housing.
Claim 7
Dependent Claim
17 words
A semiconductor pressure sensor according to claim 1, wherein the housing is formed of a transparent material.
Claim 8
Dependent Claim
21 words
A semiconductor pressure sensor according to claim 1, wherein the housing has a finely roughened surface where it contacts the filler.
Claim 9
Dependent Claim
64 words
A semiconductor pressure sensor according to claim 1, further comprising a plurality of connecting legs, arranged in the same plane as the board, for picking up an electrical signal from the pressure-sensing chip and leading it to the outside of the sensor, the connecting legs being electrically connected, at one end, to the board, and, at the other end, to a printed circuit board.
Claim 10
Dependent Claim
25 words
A semiconductor pressure sensor according to claim 1, wherein the guiding means includes a hole formed in the housing and communicating with the storage chamber.
Claim 11
Dependent Claim
30 words
A semiconductor pressure sensor according to claim 1, wherein the hole is formed in such a manner that an extension of its center axis is shifted from the pressure-sensing chip.
Claim 12
Dependent Claim
26 words
A semiconductor pressure sensor according to claim 1, wherein the filler also fills the storage chamber such that the pressure-sensing chip is embedded in the filler.
Claim 13
Dependent Claim
47 words
A semiconductor pressure sensor according to claim 1, further comprising a second filler which fills the storage chamber such that the pressure-sensing chip is embedded in the second filler, and wherein the material of the second filler differs from that of the filler embedding said semiconductor chip.
Claim 14
Dependent Claim
29 words
A semiconductor pressure sensor according to claim 1, wherein the shielding member includes a straight plate which partitions the housing into the storage chamber and a second storage chamber.
References Cited (Backward Citations)
JPS5744691A
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US4295117A
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JPS5766328A
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US4413527A
Cited
JPS5998339A
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JPS60149938A
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JPS60171429A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-12 | 1992-12-12 | 1993-06-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-12 | 1996-12-12 | 1997-06-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-12 | 2000-12-12 | 2001-06-13 | $7700.00 | Window Closed / Lapsed |