Solderless circuit connection for bowed circuit board

Claim 1

An improved solderless circuit connection of the type wherein (a) a resilient pressure applicator is compressed to apply a force against a flexible printed circuit to bias substantially parallel terminal portions of that printed circuit into respective electrical contact with substantially parallel terminal portions of a hardboard printed circuit and (b) said hardboard printed circuit is slightly bowed along a hardboard section transverse of its parallel terminal portions by said force of the pressure applicator, and wherein the improvement comprises: a non-conducting rigid longitudinal rib member secured to said hardboard printed circuit in a closely spaced relation, with said flexible printed circuit and said pressure applicator being positioned between said hardboard printed circuit and said rib member, and said rib member being arched lengthwise substantially in conformity with the bowing of said hardboard section of the hardboard printed circuit and disposed to compress said pressure applicator in cooperation with said hardboard printed circuit along a relatively narrow section of the pressure applicator transverse of the respective terminal portions of said flexible and hardboard printed circuits, whereby said rib member compensates for the bowing of said hardboard section in order to effect compression of said pressure applicator in a uniform manner adjacent the respective terminal portions of the flexible and hardboard printed circuits.