US4832251A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mounting semiconductor lasers providing improved lasing spot alignment
Assignee: General Electric Co
•
Filing: 1983-12-13
•
Granted: 1989-05-23
•
Expires: 2003-12-13
Abstract
Abstract An improved method of mounting electroluminescent semiconductor laser devices onto heatsinks, wherein easy subsequent location of the lasing spot of the laser is provided, is disclosed. The method comprises placing a reference mark on the front of the heatsink, wetting solder to the heatsink and allowing it to harden, contacting the laser device to the hardened solder, applying current to the laser device to cause light emission, aligning the lasing spot to the reference mark and bonding the laser device to the heatsink while maintaining such alignment.
Inventors
- 👤 Frank Z. Hawrylo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:12
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4219; G02B6/422; G02B6/4221; G02B6/4224; G02B6/4236; G02B6/4238; H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/0235; H01S5/02355; H01S5/0237
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
114 words
A method of mounting a semiconductor laser device to a heatsink comprises; (a) providing a reference mark on the heatsink corresponding to the desired location of a lasing spot; (b) placing the marked heatsink on a heating stage; (c) applying solder to the heatsink and wetting the solder to the heatsink by activating the heating stage to an appropriate temperature; (d) allowing the solder to solidify; (e) placing the laser device on the solidified solder; (f) applying current to the device sufficient to cause lasing; (g) aligning the lasing spot of the laser device with the reference mark on the heatsink; and, (h) bonding the laser device to the heatsink while maintaining the alignment.
Claim 2
Independent Claim
114 words
A method of mounting a semiconductor laser device to a heatsink comprises; (a) providing a reference mark on the heatsink corresponding to the desired location of a lasing spot; (b) placing the marked heatsink on a heating stage; (c) applying solder to the heatsink and wetting the solder to the heatsink by activating the heating stage to an appropriate temperature; (d) allowing the solder to solidify; (e) placing the laser device on the solidified solder; (f) applying current to the device sufficient to cause lasing; (g) aligning the lasing spot of the laser device with the reference mark on the heatsink; and, (h) bonding the laser device to the heatsink while maintaining the alignment.
Claim 3
Dependent Claim
33 words
The method of claim 1 wherein after the bonding of step (h), the alignment is rechecked and if misalignment is found, the solder is reliquified and steps (f), (g), and (h) are repeated.
Claim 4
Dependent Claim
35 words
The method of claim 1 wherein step (g) is accomplished through the use of magnification into a television camera and monitor, which camera is sensitive to the wavelength of light emitted by the laser device.
References Cited (Backward Citations)
US3479716A
Cited
US3696985A
Cited
US3938895A
Cited
US4184741A
Cited
US4223227A
Cited
US4237474A
Cited
GB2052140A
Cited
US4488304A
Cited
US4389557A
Cited
US4548466A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-22 | 1992-11-21 | 1993-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-22 | 1996-11-21 | 1997-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-22 | 2000-11-21 | 2001-05-23 | $7700.00 | Window Closed / Lapsed |