Solid state image sensing device and a method of manufacturing the same

Claim 1

A solid state image sensing device comprising: a semiconductor substrate (1) of a first conductivity type; photosignal detecting regions (70) formed in the surface of said semiconductor substrate (1) for detecting photosignals; charge transfer regions (30) of a second conductivity type formed in the surface of said semiconductor substrate (1) with intervals from said photosignal detecting regions (70) for transferring signal charges; gate electrodes (5) formed over said charge transfer regions (30) and over regions between said photosignal detecting regions (70) and said charge transfer regions (30) through an insulator film (9) for controlling reading of signal charges from said photosignal detecting regions (70) to said charge transfer regions (30); and control regions (80) of a first conductivity type and having a larger impurity concentration than that of said semiconductor substrate (1) formed in contact with said photosignal detecting regions (70) and with intervals from said charge transfer regions (30) so that said reading of said signal charges is performed by said gate electrodes (5).

Claim 4

A method of manufacturing a solid state image sensing device having a semiconductor substrate (1) of a first conductivity type, said method comprising: a first step of forming charge transfer regions (30) of a second conductivity type on the surface of said semiconductor substrate (1) of said first conductivity type for transferring signal charges; a second step of forming an insulator film (9) on the surface of said semiconductor substrate (1); a third step of forming gate electrodes (5) in regions of said semiconductor substrate (1) including said charge transfer regions (30) on said insulator film (9); a fourth step of ion-implanting impurities in regions of said semiconductor substrate (1) of said first conductivity type by utilizing said gate electrodes (5) as masks thereby to form impurity regions (8) of the first conductivity type having a larger impurity concentration than said semiconductor substrate (1) adapted to form control regions (80) in which reading of signal charges is performed by said gate electrodes (5); and a fifth step of performing ion implantation into said impurity regions (8) by employing said gate electrodes (5) as masks thereby to form highly concentrated impurity regions of said second conductivity type of form boundary photosignal detecting regions (70) for detecting photosignals.

Claim 5

A method of manufacturing a solid state image sensing device having a semiconductor substrate (1) of a first conductivity type, said method comprising: a first step of forming charge transfer regions (30) of a second conductivity type on the surface of said semiconductor substrate (1) of said first conductivity type for transferring signal charges; a second step of forming an insulator film (9) on the surface of said semiconductor substrate (1); a third step of forming gate electrodes (5) in regions of said semiconductor substrate (1) including said charge transfer regions (30) on said insulator film (9); a fourth step of ion-implanting impurities in regions of said semiconductor substrate (1) of said first conductivity type by utilizing said gate electrodes (5) as masks thereby to form impurity regions (8) of the first conductivity type having a larger impurity concentration than said semiconductor substrate (1) adapted to form control regions (80) in which reading of signal charges is performed by said gate electrodes (5); and a fifth step of performing ion implantation into said impurity regions (8) by employing said gate electrodes (5) as masks thereby to form highly concentrated impurity regions of said second conductivity type of form boundary photosignal detecting regions (70) for detecting photosignals.