US4829666A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for producing a carrier element for an IC-chip
Assignee: GAO Gesellschaft fuer Automation und Organisation mbH
•
Filing: 1984-07-20
•
Granted: 1989-05-16
•
Expires: 2004-07-20
Abstract
Abstract A carrier element suitable for production in large numbers, e.g. for incorporation in identification cards, having an integrated circuit and the connection leads and contacts necessary for the operation of the circuit. The carrier consists of a single or multilayer insulating material, e.g. a film, carrying the circuit contacted with the connection leads in punched out windows. To protect the circuit from mechanical stress the thickness of the film is greater than or at least equal to the thickness of the integrated circuit plus the thickness of the contacted connection leads.
Inventors
- 👤 Yahya Haghiri-Tehrani
- 👤 Joachim Hoppe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:45
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/07747; H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W70/699; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10S; Y10S283/00; Y10S283/904; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49128; Y10T29/4913; Y10T29/49146; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
168 words
A method for producing an integrated circuit chip carrier element suitable for incorporation in a card-like member, said method comprising the steps of: defining a carrier element in a sheet-like strip of insulating material and forming a window in the carrier element so defined; applying a conductive film to the material; forming connection leads out of the conductive film extending inwardly into the window; positioning a chip having integrated circuits in said window; connecting the integrated circuits to the connection leads; forming a cavity corresponding to said window in a sheet-like insulating material layer without conductive film; applying said layer to said strip with said window and cavity in registration, said strip and layer having predetermined thicknesses such that the combined thickness of the strip and layer is not less than the thickness of the chip plus the thickness of the conducting leads; filling the window and cavity with a potting compound to embed the chip; and separating the carrier element from the insulating material layer and strip.
Claim 2
Independent Claim
168 words
A method for producing an integrated circuit chip carrier element suitable for incorporation in a card-like member, said method comprising the steps of: defining a carrier element in a sheet-like strip of insulating material and forming a window in the carrier element so defined; applying a conductive film to the material; forming connection leads out of the conductive film extending inwardly into the window; positioning a chip having integrated circuits in said window; connecting the integrated circuits to the connection leads; forming a cavity corresponding to said window in a sheet-like insulating material layer without conductive film; applying said layer to said strip with said window and cavity in registration, said strip and layer having predetermined thicknesses such that the combined thickness of the strip and layer is not less than the thickness of the chip plus the thickness of the conducting leads; filling the window and cavity with a potting compound to embed the chip; and separating the carrier element from the insulating material layer and strip.
Claim 3
Dependent Claim
26 words
A method as in claim 1, characterized in that the carrier elements are punched out of the insulating material layer and strip with a circular shape.
Claim 4
Dependent Claim
33 words
The method according to claim 1 further defined as applying the conductive film between said strip and layer; and perforating one of the strip and layer to provide access to said connection leads.
References Cited (Backward Citations)
US3385426A
Cited
GB1197751A
Cited
US3417865A
Cited
GB1262511A
Cited
GB1240977A
Cited
GB1372392A
Cited
GB1372592A
Cited
US3858721A
Cited
US3838984A
Cited
DE2500180A1
Cited
DE2414297A1
Cited
US3984739A
Cited
GB1492015A
Cited
GB1511415A
Cited
US3994394A
Cited
US4216577A
Cited
US4222516A
Cited
US4034854A
Cited
US4142287A
Cited
US4210462A
Cited
FR2438339A1
Cited
US4417413A
Cited
US4460825A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-15 | 1992-11-14 | 1993-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-15 | 1996-11-14 | 1997-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-15 | 2000-11-14 | 2001-05-16 | $7700.00 | Window Closed / Lapsed |