Thermoelectric module optimized for low temperature difference

Claim 1

A thermoelectric heat pump module which comprises, (a) a plurality of thin, flat electric and heat conductive plates; (b) a plurality of flat, rectangular thermoelectric N and P semiconductor elements; (c) an electric and heat conductive bonding mechanism suitable for joining said electric and heat conductive plates to said N and P semiconductor elements so as to form a single laminated structure such that the top layer of said laminated structure is a first of said conductive plates joined by said bonding mechanism to one side of a first of said N (or P) thermoelectric elements, said first conductive plate having at least one edge extending outward from said laminated structure, said first N (or P) thermoelectric element being joined on its second side by said bonding mechanism to one side of a second of said conductive plates, said second conductive plate having at least one edge extending outward from said laminated structure, said outwardly extending edge of said second conductive plate being non adjacent to said outwardly extending edge of said first conductive plate, said second conductive plate being joined on its second side by said bonding mechanism to one side of a first of said P (or N) thermoelectric elements such that said P (or N) thermoelectric element is parallel to and aligned with all the other of said P and N thermoelectric elements, said first P (or N) thermoelectric element be joined by said bonding mechanism on its second side to one side of a third of said conductive plates such that said third conductive plate is parallel to and aligned with said first conductive plate, said laminated structure having as many additional layers as needed to achieve a desired operational voltage such that the sequence for all subsequent layers following the third of said heat conductive plates is an alternating series beginning with said N (or P) thermoelectric elements alternating with said P (or N) thermoelectric elements, said N and P thermoelectric elements being separated from each other by said conductive plates such that the fourth, sixth and all subsequent even numbered of said conductive plates are parallel to and aligned with the second of said conductive plates; and the fifth, seventh and all subsequent odd numbered of said conductive plates are aligned along a common axis with the first and third of said conductive plates, with the last layer of said laminated structure being one of said conductive plates, said thermoelectric module being energized by passing an electric current through said laminated structure in a path perpendicular to said laminations, said current entering at the first of said conductive plates and exiting at the last of said conductive plates.