US4818323A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a void free wafer via vacuum lamination
Assignee: NXP USA Inc
•
Filing: 1987-06-26
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Granted: 1989-04-04
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Expires: 2007-06-26
Abstract
Abstract A silicon wafer bonding technique is described utilizing low pressures and a dissolvable gas to substantially eliminate voids formed between the bonding surfaces of two wafers.
Inventors
- 👤 Frank S. d'Aragona
- 👤 Hang M. Liaw
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:47
CPC Classifications
H; H10; H10W; H10W90/00; B; B23; B23K; B23K20/00; B23K20/22; B23K20/233; H10P; H10P10/00; H10P10/12; H10P10/128; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; Y; Y10; Y10S; Y10S148/00; Y10S148/012
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
122 words
A method of bonding wafers and removing voids created therebetween comprising the steps of: providing a first wafer with a bonding surface; providing a second wafer with a bonding surface; assembling said bonding surfaces in a dissolvable gas environment under atmospheric pressure; reducing the pressure about said first and second wafers; heating said first and second wafers creating a bond therebetween defining a void therein, said void containing said dissolvable gas; increasing the pressure about said first and second wafers to approximately atmospheric pressure; heating said first and second wafers to a reaction temperature below a melting point of said first and second wafers; dissolving said dissolvable gas contained in said void into said first and second wafers; and eliminating said void.
Claim 2
Independent Claim
122 words
A method of bonding wafers and removing voids created therebetween comprising the steps of: providing a first wafer with a bonding surface; providing a second wafer with a bonding surface; assembling said bonding surfaces in a dissolvable gas environment under atmospheric pressure; reducing the pressure about said first and second wafers; heating said first and second wafers creating a bond therebetween defining a void therein, said void containing said dissolvable gas; increasing the pressure about said first and second wafers to approximately atmospheric pressure; heating said first and second wafers to a reaction temperature below a melting point of said first and second wafers; dissolving said dissolvable gas contained in said void into said first and second wafers; and eliminating said void.
Claim 3
Dependent Claim
37 words
The method of claim 1 wherein said first step of heating said first and second wafers comprises the step of gradually heating said first and second wafers from approximately 350 degrees centigrade to approximately 800 degrees centigrade.
Claim 4
Dependent Claim
25 words
The method of claim 2 further comprising the step of heating said first and second wafers at approximately 800 degrees centigrade for approximately one hour.
Claim 5
Dependent Claim
19 words
The method of claim 1 wherein said reaction temperature is a temperature of at least approximately 1000 degrees centigrade.
Claim 6
Independent Claim
128 words
A method of bonding wafers and removing voids created therebetween comprising the steps of: providing a first wafer with a bonding surface; providing a second wafer with a bonding surface; assembling said bonding surfaces in a dissolvable gas environment at atmospheric pressure forming assembled wafers; reducing the pressure about said assembled wafers to approximately 0.01 torr; heating said assembled wafers from approximately 350 degrees centigrade to approximately 800 degrees centigrade thereby creating bonded wafers having a void therein, said void containing said dissolvable gas; increasing the pressure about said bonded wafers to approximately atmospheric pressure; heating said bonded wafers to a reaction temperature of at least approximately 1000 degrees centigrade; dissolving said dissolvable gas contained in said void into said first and second wafers; and eliminating said voids.
Claim 7
Independent Claim
128 words
A method of bonding wafers and removing voids created therebetween comprising the steps of: providing a first wafer with a bonding surface; providing a second wafer with a bonding surface; assembling said bonding surfaces in a dissolvable gas environment at atmospheric pressure forming assembled wafers; reducing the pressure about said assembled wafers to approximately 0.01 torr; heating said assembled wafers from approximately 350 degrees centigrade to approximately 800 degrees centigrade thereby creating bonded wafers having a void therein, said void containing said dissolvable gas; increasing the pressure about said bonded wafers to approximately atmospheric pressure; heating said bonded wafers to a reaction temperature of at least approximately 1000 degrees centigrade; dissolving said dissolvable gas contained in said void into said first and second wafers; and eliminating said voids.
Claim 8
Dependent Claim
131 words
Bonded silicon wafers constructed in accordance with the steps of: providing a first silicon wafer with a bonding surface; providing a second silicon wafer with a bonding surface; assembling said bonding surfaces in an oxygen environment at atmospheric pressure forming assembled silicon wafers; reducing the pressure about said assembled silicon wafers to approximately 0.01 torr; heating said assembled silicon wafers gradually from approximately 350 degrees centigrade to 800 degrees centigrade thereby created bonded silicon wafers having a void containing said oxygen; increasing the pressure about said bonded silicon wafers to approximately atmospheric pressure; heating said bonded silicon wafers to at least approximately 1000 degrees centigrade; dissolving said oxygen contained in said void into said first and second silicon wafers; and collapsing said void due to a low pressure in said void.
Claim 9
Dependent Claim
131 words
Bonded silicon wafers constructed in accordance with the steps of: providing a first silicon wafer with a bonding surface; providing a second silicon wafer with a bonding surface; assembling said bonding surfaces in an oxygen environment at atmospheric pressure forming assembled silicon wafers; reducing the pressure about said assembled silicon wafers to approximately 0.01 torr; heating said assembled silicon wafers gradually from approximately 350 degrees centigrade to 800 degrees centigrade thereby created bonded silicon wafers having a void containing said oxygen; increasing the pressure about said bonded silicon wafers to approximately atmospheric pressure; heating said bonded silicon wafers to at least approximately 1000 degrees centigrade; dissolving said oxygen contained in said void into said first and second silicon wafers; and collapsing said void due to a low pressure in said void.
Claim 10
Dependent Claim
25 words
The method of claim 1 wherein said step of eliminating said void results from collapsing said void due to a low pressure in said void.
Claim 11
Dependent Claim
13 words
The method of claim 1 wherein said first and second wafers are silicon.
Claim 12
Dependent Claim
11 words
The method of claim 1 wherein said dissolvable gas is oxygen.
Claim 13
Dependent Claim
25 words
The method of claim 5 wherein said step of eliminating said void results from collapsing said void due to a low pressure in said void.
Claim 14
Dependent Claim
13 words
The method of claim 5 wherein said first and second wafers are silicon.
Claim 15
Dependent Claim
11 words
The method of claim 5 wherein said dissolvable gas is oxygen.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-03 | 1992-10-03 | 1993-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-03 | 1996-10-03 | 1997-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-03 | 2000-10-03 | 2001-04-04 | $7700.00 | Window Closed / Lapsed |