US4817280A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing printed circuit boards
Assignee: OKEY PRINTED WIRING Co Ltd
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Filing: 1986-06-09
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Granted: 1989-04-04
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Expires: 2006-06-09
Abstract
Abstract The present invention relates to a method of manufacturing printed circuit boards. The method of manufacturing printed circuit boards under the present invention is to provide holes on a metal plate, to attach a prepreg to the metal plate, and to fill the prepreg into the holes by heat-pressing the metal plate to which the prepreg is attached. Thereafter, lead wire holes are provided at the centers of prepreg filled the holes, and a resin plate having at least one circuit layer and through holes is glued to the metal plate. Alternately, a resin plate having at least one circuit layer and lead wire holes, or a resin plate having at least one circuit layer, through holes and lead wire holes are glued to the metal plate on the side where the prepreg is attached.
Inventors
- 👤 Risuke Ozaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 02:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0058; H05K3/0061; H05K3/44; H05K3/445; H05K1/00; H05K1/02; H05K1/0296; H05K1/0298; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2203/00; H05K2203/06; H05K2203/066; H05K3/38; H05K3/386; H05K3/40; H05K3/42; H05K3/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
90 words
A method of manufacturing printed circuit boards comprising the steps of: (a) providing holes on a metal plate; (b) attaching a prepreg to said metal plate; (c) filling said prepreg into said holes by heat-pressing said metal plate to which said prepreg is attached; (d) providing lead wire holes at the centers of the prepreg filled holes; and (e) gluing a resin plate having at least one circuit layer, and having either through holes or lead wire holes, to the side of said metal plate where said prepreg is attached.
Claim 2
Independent Claim
90 words
A method of manufacturing printed circuit boards comprising the steps of: (a) providing holes on a metal plate; (b) attaching a prepreg to said metal plate; (c) filling said prepreg into said holes by heat-pressing said metal plate to which said prepreg is attached; (d) providing lead wire holes at the centers of the prepreg filled holes; and (e) gluing a resin plate having at least one circuit layer, and having either through holes or lead wire holes, to the side of said metal plate where said prepreg is attached.
Claim 3
Dependent Claim
89 words
The method of claim 1, further including the steps of: (a) attaching an adhesive sheet and a release paper to said prepreg; (b) forming lead wire holes at the centers of the prepreg filled holes; (c) processing metal boards from said metal plate by shaping their outer configurations; (d) detaching said release paper from said metal board; and (e) gluing said metal board to a resin board which is provided with at least one circuit layer and either of through holes or lead wire holes with said adhesive sheet.
Claim 4
Dependent Claim
73 words
The method of claim 1, further including the steps of: (a) attaching an adhesive sheet and a release paper to said prepreg; (b) forming lead wire holes at the centers of the prepreg filled holes; (c) detaching said release paper from said metal plate; and (d) gluing said metal plate to a resin board material having at least one circuit layer and either through holes or lead wire holes with said adhesive sheet.
Claim 5
Dependent Claim
52 words
The method of claim 1, further including the steps of: (a) forming lead wire holes at the centers of the prepreg filled holes; and (b) gluing said metal plate to a resin board material having at least one circuit layer and either through holes or lead wire holes by a bonding sheet.
Claim 6
Dependent Claim
54 words
The method of claim 1, further including the steps of: (a) providing a roughening treatment on at least one side of said metal plate; (b) attaching said prepreg to the side of said metal plate where the roughening treatment is effected; and (c) heat pressing said metal plate to which said prepreg is attached.
Claim 7
Dependent Claim
25 words
The method of claim 5 in which said step of providing a roughening treatment occurs prior to said step of forming said lead wire holes.
Claim 8
Dependent Claim
24 words
The method of claim 5 in which said step of providing a roughening treatment occurs after said step of forming said lead wire holes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-03 | 1992-10-03 | 1993-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-03 | 1996-10-03 | 1997-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-03 | 2000-10-03 | 2001-04-04 | $7700.00 | Window Closed / Lapsed |