US4814295A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting of semiconductor chips on a plastic substrate
Assignee: Nortel Networks Corp
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Filing: 1986-11-26
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Granted: 1989-03-21
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Expires: 2006-11-26
Abstract
Abstract A semiconductor chip mounting is provided by molding a substrate of heat resistant synthetic resin, forming contact pads, which may be protrusions or recesses, on a surface of the substrate as it is molded. A circuit pattern extends to the contact pads which have a conductive surface. The chip is directly mounted on the substrate by soldering contact areas on the chip to the contact pads on the substrate, thus avoiding wire bonding.
Inventors
- 👤 Mahendra C. Mehta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H05K1/00; H05K1/02; H05K1/0284; H05K1/11; H05K1/119; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09045; H05K2201/09118; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10727; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W74/00; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/53; Y10T29/5313; Y10T29/53174
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
123 words
A method of mounting a semiconductor chip, comprising: molding a substrate of heat resistant synthetic resin and forming a plurality of contact pads for each of a pair of surfaces; forming a conductive layer on each contact pad on one of said surfaces; forming a circuit pattern on said one surface, said circuit pattern extending to said contact pads on said one surface and connecting to said conductive layers; positioning a chip on said one surface, contact areas on said chip being in contact with said contact pads on said one surface; soldering said contact area on said contact pads on said one surface; and forming electrical connections between said contact pads on one surface and said contact pads on the other surface.
Claim 2
Independent Claim
123 words
A method of mounting a semiconductor chip, comprising: molding a substrate of heat resistant synthetic resin and forming a plurality of contact pads for each of a pair of surfaces; forming a conductive layer on each contact pad on one of said surfaces; forming a circuit pattern on said one surface, said circuit pattern extending to said contact pads on said one surface and connecting to said conductive layers; positioning a chip on said one surface, contact areas on said chip being in contact with said contact pads on said one surface; soldering said contact area on said contact pads on said one surface; and forming electrical connections between said contact pads on one surface and said contact pads on the other surface.
Claim 3
Dependent Claim
23 words
A method as claimed in claim 1, including molding protrusions on said other surface to form said contact pads on the other surface.
Claim 4
Dependent Claim
15 words
A method of claim 1, wherein said substrate is molded of transparent synthetic resin material.
Claim 5
Independent Claim
110 words
A method of mounting a semiconductor chip, comprising: molding a substrate of heat resistant synthetic resin with a plurality of contact pads thereon in the form of protrusions on each of a pair of surfaces; forming a conductive layer on each contact pad on one of said surfaces; forming a circuit pattern on said one surface, said circuit pattern extending to said contact pads on said one surface and connecting to said conductive layers; positioning a chip on said one surface, contact areas of said chip being in contact with said contact pads on said one surface; and soldering said contact areas on said contact pads of said one surface.
Claim 6
Independent Claim
110 words
A method of mounting a semiconductor chip, comprising: molding a substrate of heat resistant synthetic resin with a plurality of contact pads thereon in the form of protrusions on each of a pair of surfaces; forming a conductive layer on each contact pad on one of said surfaces; forming a circuit pattern on said one surface, said circuit pattern extending to said contact pads on said one surface and connecting to said conductive layers; positioning a chip on said one surface, contact areas of said chip being in contact with said contact pads on said one surface; and soldering said contact areas on said contact pads of said one surface.
Claim 7
Dependent Claim
15 words
A method of claim 4, wherein said substrate is molded of transparent synthetic resin material.
Claim 8
Independent Claim
112 words
A method of mounting a semiconductor chip, comprising: molding a substrate of heat resistant synthetic resin and a plurality of contact pads on each surface, the contact pads on one surface being in the form of recesses; forming a conductive layer on each contact pad on one of said surfaces; forming a circuit pattern on said one surface, said circuit pattern extending to said contact pads on said one surface and connecting to said conductive layers; positioning a chip on said one surface, contact areas of said chip being in contact with said contact pads on said one surface; and soldering said contact areas on said contact pads of said one surface.
Claim 9
Independent Claim
112 words
A method of mounting a semiconductor chip, comprising: molding a substrate of heat resistant synthetic resin and a plurality of contact pads on each surface, the contact pads on one surface being in the form of recesses; forming a conductive layer on each contact pad on one of said surfaces; forming a circuit pattern on said one surface, said circuit pattern extending to said contact pads on said one surface and connecting to said conductive layers; positioning a chip on said one surface, contact areas of said chip being in contact with said contact pads on said one surface; and soldering said contact areas on said contact pads of said one surface.
Claim 10
Dependent Claim
15 words
A method of claim 6, wherein said substrate is molded of transparent synthetic resin material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-20 | 1992-09-19 | 1993-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-20 | 1996-09-19 | 1997-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-20 | 2000-09-19 | 2001-03-21 | $7700.00 | Window Closed / Lapsed |