Endoscope tip

Claim 2

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light from said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member, near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side and proximal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to the solid state imaging device chip.

Claim 3

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light from said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member, near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to the solid state imaging device chip.

Claim 4

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light from said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member, near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to the solid state imaging device chip.

Claim 5

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light of said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the proximal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to the solid state imaging device chip.

Claim 6

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light of said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the proximal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to the solid state imaging device chip.

Claim 7

An endoscope tip according to any of claims 1, 2 or 3 wherein said solid state imaging device chip has whichever is wider of a main optical black row and horizontal shift register provided on the distal side or proximal side in said lengthwise axial direction.

Claim 8

An endoscope tip according to any of claims 1, 2 or 3 wherein said solid state imaging device chip is die-bonded as deviated in a forward position of said base member.

Claim 9

An endoscope tip according to claim 2 or 3 wherein said solid state imaging device chip is die-bonded as deviated in a position toward a rear end of said base member.

Claim 10

An endoscope tip according to claim 5 wherein said base member has a peripheral IC chip fitted on a rear end side adjacent to said solid state imaging device chip.

Claim 11

An endoscope tip according to claim 5 wherein said base member is fitted with a peripheral IC chip on a surface on a side opposite a surface on which said solid state imaging device chip is fitted.

Claim 12

An endoscope tip according to claim 5 wherein said signal cables connect flat lands of said base member on a rear end side.

Claim 13

An endoscope tip according to claim 9 wherein said flat lands are provided in two rows in a direction intersecting at right angles with the lengthwise axial direction.

Claim 14

An endoscope tip according to claim 6 wherein said base member is fitted with a peripheral IC chip on a front side adjacent to said solid state imaging device chip.

Claim 15

An endoscope tip according to claim 6 wherein a connector, receiver, to be removably connected with a signal cable side connector is provided at the rear end of said base member.

Claim 16

An endoscope tip according to claim 7 wherein a flexible printed circuit plate is fitted on the rear end side of said base member adjacent to said solid state imaging device chip.

Claim 17

An endoscope tip according to claim 13 wherein said base member is formed of a metal plate.

Claim 18

An endoscope tip according to claim 14 wherein the bonding pads on said solid state imaging device chip are connected with said peripheral IC circuit and flexible printed circuit plate by wire bonding.

Claim 19

An endoscope tip according to any of claims 1, 2 or 3 wherein said solid state imaging device chip and said electronic part are electrically connected with each other by wire bonding.

Claim 20

An endoscope tip according to any of claims 1 or 3 wherein said solid state imaging device chip and said electronic part are electrically connected with each other by face bonding.

Claim 21

An endoscope tip according to any of claims 1, 2 or 3 wherein said electronic part is fitted to a back surface side of said base member.

Claim 22

An endoscope tip according to any of claims 1, 2 or 3 wherein a width of the base member fitted with said electronic part is substantially equal to or is smaller than a width of said solid state imaging device chip.

Claim 23

An endoscope tip according to any of claims 1, 2 or 3 wherein said solid state imaging device chip is thinly covered with a resin.

Claim 24

An endoscope tip according to any of claims 1, 2 or 3 wherein the width of each of said optical device and a cover glass is the same as or slightly larger than a width of said solid state imaging device chip.

Claim 25

An endoscope tip according to claims 1, 2 or 3, wherein said signal cables are connected in two columns on said base member, said columns being formed parallel to a side of the solid state imaging device chip which is in a vertical direction with the lengthwise axial direction of the elongated insertable part.

Claim 26

An endoscope tip according to claims 1, 2, or 3, wherein a width of the solid state imaging device chip in a vertical direction with respect to the lengthwise axial direction of the elongated insertable part and a width of the base member are either substantially equal or the width of the base member is slightly larger than the width of the solid state imaging device chip.

Claim 27

An endoscope tip according to claims 1, 2 or 3, wherein the light receiving surface of the solid state imaging device chip is fitted with a covered glass.

Claim 28

An endoscope tip according to claim 24, wherein a width of the optical device is the same as a width of the covered glass.

Claim 29

An endoscope tip according to claim 24, wherein edges of a distal side and proximal side of the optical device and the covered glass correspond.

Claim 30

An endoscope tip according to claim 24, wherein the edges of a distal side of said optical device and said covered glass correspond.

Claim 31

An endoscope tip according to claim 24, wherein the edges of a proximal side of said optical device and said covered glass correspond.

Claim 32

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be vertical with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; a solid state imaging device chip having a light receiving surface arranged to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side and proximal side with respect to the lengthwise axial direction of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to said solid state imaging device chip.

Claim 33

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be vertical with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; a solid state imaging device chip having a light receiving surface arranged to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side and proximal side with respect to the lengthwise axial direction of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to said solid state imaging device chip.

Claim 34

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be vertical with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; a solid state imaging device chip having a light receiving surface arranged to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side with respect to the lengthwise axial direction of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to said solid state imaging device chip.

Claim 35

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be vertical with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; a solid state imaging device chip having a light receiving surface arranged to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the distal side with respect to the lengthwise axial direction of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to said solid state imaging device chip.

Claim 36

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be vertical with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; a solid state imaging device chip having a light receiving surface arranged to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the proximal side with respect to the lengthwise axial direction of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to said solid state imaging device chip.

Claim 37

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be vertical with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; a solid state imaging device chip having a light receiving surface arranged to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the proximal side with respect to the lengthwise axial direction of said elongated insertable part, said bonding pads to electrically connect at least one of said base member and said electronic part to said solid state imaging device chip.

Claim 38

An endoscope tip according to claims 29, 30, or 31, wherein a covered glass is fitted to the light receiving surface of the solid state imaging device chip.

Claim 39

An endoscope tip according to claims 29, 30, or 31, wherein an optical black is provided on both a proximal side and a distal side of said solid state imaging device chip and said optical device is provided so that an image of the endoscope is an erect image.

Claim 40

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light of said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the proximal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect said electronic part to the solid state imaging device chip; wherein said electronic part is provided on a proximal side of said optical device, said electronic part being electrically connected with said solid state imaging device chip by wire bonding which is sealed by a resin, and the width of said electronic part being equal or smaller than a width of the solid state imaging device chip.

Claim 41

An endoscope tip comprising: an image forming objective optical system arranged in a rigid tip member of an elongated insertable part so that an optical axis of the image forming objective optical system may be parallel with a lengthwise axial direction of said insertable part; an illuminating optical system being provided on a distal side of said elongated insertable part parallelly with said image forming objective optical system; an optical device being arranged on the optical axis of said image forming objective optical system, said optical device deflecting incident light at right angles; a solid state imaging device chip having a light receiving surface arranged opposed to an exit direction of the incident light of said optical device and to be substantially parallel with the lengthwise axial direction of said elongated insertable part; a base member connecting with said solid state imaging device chip; an electronic part being provided on said base member near said solid state imaging device chip; signal cables connecting with a proximal side of said base member; and bonding pads being provided on said solid state imaging device chip only on the proximal side with respect to the direction parallel with the lengthwise axis of said elongated insertable part, said bonding pads to electrically connect said electronic part to the solid state imaging device chip; wherein said electronic part is provided on a proximal side of said optical device, said electronic part being electrically connected with said solid state imaging device chip by wire bonding which is sealed by a resin, and the width of said electronic part being equal or smaller than a width of the solid state imaging device chip.