Low temperature sintered ceramic capacitor having a high resistivity and bending strength, and method of manufacture

Claim 2

A low temperature sintered solid dielectric capacitor comprising a dielectric ceramic body and at least two electrodes in contact therewith, the dielectric ceramic body consisting essentially of: (a) 100 parts by weight of a major ingredient expressed by the formula, (Ba.sub.1-v-w Me.sub.v Mg.sub.w O).sub.k (Zr.sub.1-x-y Ti.sub.x Si.sub.y)O.sub.2, where Me is at least either of strontium and calcium; v is a numeral in the range of 0.005 to 0.980 inclusive; w is a numeral in the range of 0.001 to 0.050 inclusive; x is a numeral in the range of 0.00 to 0.50 inclusive; y is a numeral in the range of 0.005 to 0.100 inclusive; and k is a numeral in the range of 0.80 to 1.25 inclusive; and (b) from 0.2 to 10.0 parts by weight of an additive mixture of boric oxide, silicon dioxide and at least one metal oxide selected from the group consisting of barium oxide, magnesium oxide, zinc oxide, strontium oxide and calcium oxide, the relative proportions of boric oxide, silicon dioxide and at least one selected metal oxide constituting the additive mixture being in that region of the ternary diagram of FIG. 3 attached hereto which is bounded by lines sequentially connecting: the point A where the additive mixture consists of one mole percent boric oxide, 80 mole percent silicon dioxide, and 19 mole percent metal oxide; the point B where the additive mixture consists of one mole percent boric oxide, 39 mole percent silicon dioxide, and 60 mole percent metal oxide; the point C where the additive mixture consists of 29 mole percent boric oxide, one mole percent silicon dioxide, and 70 mole percent metal oxide; the point D where the additive mixture consists of 90 mole percent boric oxide, one mole percent silicon dioxide, and nine mole percent metal oxide; the point E where the additive mixture consists of 90 mole percent boric oxide, nine mole percent silicon dioxide, and one mole percent metal oxide; and the point F where the additive mixture consists of 19 mole percent boric oxide, 80 mole percent silicon dioxide, and one mole percent metal oxide.

Claim 3

A low temperature sintered solid dielectric capacitor as set forth in claim 1, wherein the electrodes are buried in the dielectric ceramic body.

Claim 4

A low temperature sinitered solid dielectric capacitor as set forth in claim 1, wherein the electrodes are of a base metal.

Claim 5

A low temperature sintered solid dielectric capacitor as set forth in claim 3, wherein the base metal is nickel.

Claim 6

A process for the manufacture of a low temperature sintered solid dielectric capacitor, which process comprises: (a) providing a mixture of: 100 parts by weight of a major ingredient, in finely divided form, that is expressed by the formula, (Ba.sub.1-v-w Me.sub.v Mg.sub.w O).sub.k (Zr.sub.1-x-y Ti.sub.x Si.sub.y)0.sub.2, where Me is at least either of strontium and calcium; v is a numeral in the range of 0.005 to 0.980 inclusive; w is a numeral in the range of 0.001 to 0.050 inclusive; x is a numeral in the range of 0.00 to 0.50 inclusive; y is a numeral in the range of 0.005 to 0.100 inclusive; and k is a numeral in the range of 0.80 to 1.25 inclusive; and from 0.2 to 10.0 parts by weight of an additive mixture, in finely divided form, of boric oxide, silicon dioxide and at least one metal oxide selected from the group consisting of barium oxide, magnesium oxide, zinc oxide, strontium oxide and calcium oxide, the relative proportions of boric oxide, silicon dioxide and at least one selected metal oxide constituting the additive mixture being in that region of the ternary diagram of FIG. 3 attached hereto which is bounded by lines sequentially connecting: the point A where the additive mixture consists of one mole percent boric oxide, 80 mole percent silicon dioxide, and 19 mole percent metal oxide; the point B where the additive mixture consists of one mole percent boric oxide, 39 mole percent silicon dioxide, and 60 mole percent metal oxide; the point C where the additive mixture consists of 29 mole percent boric oxide, one mole percent silicon dioxide, and 70 mole percent metal oxide; the point D where the additive mixture consists of 90 mole percent boric oxide, one mole percent silicon dioxide, and nine mole percent metal oxide; the point E where the additive mixture consists of 90 mole percent boric oxide, nine mole percent silicon dioxide, and one mole percent metal oxide; and the point F where the additive mixture consists of 19 mole percent boric oxide, 80 mole percent silicon dioxide, and one mole percent metal oxide; (b) molding the mixture into desired shape and size, the molding having at least two electrode portions of an electroconductive material; (c) cosintering the molding and the electrode portions to maturity in a nonoxidative atmosphere; and (d) reheating the cosintered molding and electrode portions in an oxidative atmosphere.

Claim 7

A process for the manufacture of a low temperature sintered solid dielectric capacitor, which process comprises: (a) providing a mixture of: 100 parts by weight of a major ingredient, in finely divided form, that is expressed by the formula, (Ba.sub.1-v-w Me.sub.v Mg.sub.w O).sub.k (Zr.sub.1-x-y Ti.sub.x Si.sub.y)0.sub.2, where Me is at least either of strontium and calcium; v is a numeral in the range of 0.005 to 0.980 inclusive; w is a numeral in the range of 0.001 to 0.050 inclusive; x is a numeral in the range of 0.00 to 0.50 inclusive; y is a numeral in the range of 0.005 to 0.100 inclusive; and k is a numeral in the range of 0.80 to 1.25 inclusive; and from 0.2 to 10.0 parts by weight of an additive mixture, in finely divided form, of boric oxide, silicon dioxide and at least one metal oxide selected from the group consisting of barium oxide, magnesium oxide, zinc oxide, strontium oxide and calcium oxide, the relative proportions of boric oxide, silicon dioxide and at least one selected metal oxide constituting the additive mixture being in that region of the ternary diagram of FIG. 3 attached hereto which is bounded by lines sequentially connecting: the point A where the additive mixture consists of one mole percent boric oxide, 80 mole percent silicon dioxide, and 19 mole percent metal oxide; the point B where the additive mixture consists of one mole percent boric oxide, 39 mole percent silicon dioxide, and 60 mole percent metal oxide; the point C where the additive mixture consists of 29 mole percent boric oxide, one mole percent silicon dioxide, and 70 mole percent metal oxide; the point D where the additive mixture consists of 90 mole percent boric oxide, one mole percent silicon dioxide, and nine mole percent metal oxide; the point E where the additive mixture consists of 90 mole percent boric oxide, nine mole percent silicon dioxide, and one mole percent metal oxide; and the point F where the additive mixture consists of 19 mole percent boric oxide, 80 mole percent silicon dioxide, and one mole percent metal oxide; (b) molding the mixture into desired shape and size, the molding having at least two electrode portions of an electroconductive material; (c) cosintering the molding and the electrode portions to maturity in a nonoxidative atmosphere; and (d) reheating the cosintered molding and electrode portions in an oxidative atmosphere.

Claim 8

A process for the manufacture of a low temperature sintered solid dielectric capacitor as set forth in claim 5, wherein the electrode portions are formed on the molding by coating the same with an electroconductive paste composed principally of a base metal.

Claim 9

A process for the manufacture of a low temperature sintered solid dielectric capacitor as set forth in claim 6, wherein the base metal is nickel.

Claim 10

A process for the manufacture of a low temperature sintered solid dielectric capacitor as set forth in claim 5, wherein the molding and the electrode portions are cosintered to maturity in a temperature range of 1050° to 1200° C.

Claim 11

A process for the manufacture of a low temperature sintered solid dielectric capacitor as set forth in claim 5, wherein the cosintered molding and electrode portions are reheated in a temperature range of 500° to 1000° C.