Patent US3373268A successfully refreshed from Google Patents.
Patent US2191198A successfully refreshed from Google Patents.
US4807019A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cavity-up-cavity-down multichip integrated circuit package
Assignee: Unisys Corp
•
Filing: 1988-06-06
•
Granted: 1989-02-21
•
Expires: 2008-06-06
Abstract
Abstract A multichip integrated circuit package comprises a thin planar body which has top and bottom major surfaces. Conductors, for carrying electrical signals, are integrated into the body and include input/output terminals on one portion of the bottom surface. Downward-facing cavities for holding respective high power integrated circuit chips extend from another portion of the bottom surface into the body, and upward-facing cavities for holding respective low power integrated circuits extend from the top surface into the body. Small thermal resistance for the high power chips is achieved, and footprint is simultaneously minimized by locating the upward-facing cavities over the terminals.
Inventors
- 👤 Jerry I. Tustaniwskyj
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:19
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
249 words
A cavity-up-cavity-down integrated circuit package, comprising: top and bottom thin planar members; each of said thin planar members having an upward-facing major surface and a downward-facing major surface, and having at least one aperture which penetrates both of its major surfaces; said downward-facing major surface of said top planar member being permanently joined via a single material and a single interface to said upward-facing major surface of said bottom planar member; each aperture in said top planar member being located such that it is blocked by said upward-facing major surface of said bottom planar member, and each aperture in said bottom planar member being located such that it is blocked by said downward-facing surface of said top planar member; a low power integrated circuit chip on said upward-facing surface fo said bottom member within each aperture of said top member, and a high power integrated circuit chip on said downward-facing surface of said top member within each aperture of said bottom member; and conductors, integrated into said bottom member but not said top member, for carrying electrical signals from said downward-facing surface of said bottom member to all of said chips; whereby each high power chip has a thermal conduction path which goes directly through said thin top planar member; each low power chip has a thermal conduction path which goes from said bottom planar member through said single interface to said top planar member; and every chip has short signal paths that go through just said bottom member.
Claim 2
Dependent Claim
249 words
A cavity-up-cavity-down integrated circuit package, comprising: top and bottom thin planar members; each of said thin planar members having an upward-facing major surface and a downward-facing major surface, and having at least one aperture which penetrates both of its major surfaces; said downward-facing major surface of said top planar member being permanently joined via a single material and a single interface to said upward-facing major surface of said bottom planar member; each aperture in said top planar member being located such that it is blocked by said upward-facing major surface of said bottom planar member, and each aperture in said bottom planar member being located such that it is blocked by said downward-facing surface of said top planar member; a low power integrated circuit chip on said upward-facing surface fo said bottom member within each aperture of said top member, and a high power integrated circuit chip on said downward-facing surface of said top member within each aperture of said bottom member; and conductors, integrated into said bottom member but not said top member, for carrying electrical signals from said downward-facing surface of said bottom member to all of said chips; whereby each high power chip has a thermal conduction path which goes directly through said thin top planar member; each low power chip has a thermal conduction path which goes from said bottom planar member through said single interface to said top planar member; and every chip has short signal paths that go through just said bottom member.
Claim 3
Dependent Claim
36 words
An integrated circuit package according to claim 1 wherein said downward-facing surface of said top planar member is directly joined to said upward-facing surface of said bottom planar member by either an epoxy or a braze.
Claim 4
Dependent Claim
26 words
An integrated circuit package according to claim 2 wherein said top planar member and said bottom planar member have respective perimeters that coincide with one another.
Claim 5
Dependent Claim
38 words
An integrated circuit package according to claim 3 wherein said bottom planar member has just one aperture, and wherein input/output terminals are located on said downward-facing surface of said bottom member as an array around said one aperture.
Claim 6
Dependent Claim
25 words
An integrated circuit package according to claim 4 wherein said top planar member has multiple apertures which overlie and are aligned with said input/output terminals.
Claim 7
Dependent Claim
32 words
An integrated circuit package according to claim 5 wherein said high power integrated circuit chip dissipates at least two watts, and each low power integrated circuit chip dissipates less than two watts.
Claim 8
Dependent Claim
29 words
An integrated circuit package according to claim 6 wherein said top planar member is made of a material having a substantially higher thermal conductivity than said bottom planar member.
Claim 9
Dependent Claim
26 words
An integrated circuit package according to claim 1 wherein said top planar member and said bottom planar member have respective perimeters that coincide with one another.
Claim 10
Dependent Claim
35 words
An integrated circuit package according to claim 1 wherein said bottom planar member has just one aperture, and wherein input/output terminals are located on said bottom planar member in an array around said one aperture.
Claim 11
Dependent Claim
33 words
An integrated circuit package according to claim 1 wherein said top planar member has multiple apertures, and wherein input/output terminals are located on said top planar member in alignment with said multiple apertures.
Claim 12
Dependent Claim
32 words
An integrated circuit package according to claim 1 wherein each high power integrated circuit chip dissipates at least two watt, and each low power integrated circuit chip dissipates less than two watts.
Claim 13
Dependent Claim
29 words
An integrated circuit package according to claim 1 wherein said top planar member is made of a material having a substantially higher thermal conductivity than said bottom planar member.
Claim 14
Dependent Claim
144 words
A cavity-up-cavity-down integrated circuit package, comprising: a thin planar body, which is integrated as one indivisible unit, having a top major surface and a bottom major surface; a downward-facing cavity which extends from said bottom surface to just partway through said body; an upward-facing cavity which extends from said top surface to just partway through said body; a low power integrated circuit chip in said upward-facing cavity, and a high power integrated circuit chip in said downward-facing cavity; and conductors, integrated into said body, for carrying electrical signals to all of said chips; whereby said high power chip in said downward-facing cavity has a thermal conduction path which goes directly through said body to said top surface, and said low power chip on said upward-facing cavity has a thermal conduction path which goes through said body around said upward-facing cavity to said top surface.
Claim 15
Dependent Claim
144 words
A cavity-up-cavity-down integrated circuit package, comprising: a thin planar body, which is integrated as one indivisible unit, having a top major surface and a bottom major surface; a downward-facing cavity which extends from said bottom surface to just partway through said body; an upward-facing cavity which extends from said top surface to just partway through said body; a low power integrated circuit chip in said upward-facing cavity, and a high power integrated circuit chip in said downward-facing cavity; and conductors, integrated into said body, for carrying electrical signals to all of said chips; whereby said high power chip in said downward-facing cavity has a thermal conduction path which goes directly through said body to said top surface, and said low power chip on said upward-facing cavity has a thermal conduction path which goes through said body around said upward-facing cavity to said top surface.
Claim 16
Dependent Claim
17 words
An integrated circuit package according to claim 13 wherein said body consists of cofired layers of ceramic.
Claim 17
Dependent Claim
33 words
An integrated circuit package according to claim 13 wherein said bottom surface has just one cavity, and wherein input/output terminals are located on said bottom surface as an array around said one cavity.
Claim 18
Dependent Claim
24 words
An integrated circuit package according to claim 15 wherein said top surface has multiple cavities which overlie and are aligned with said input/output terminals.
Claim 19
Dependent Claim
32 words
An integrated circuit package according to claim 16 wherein said high power integrated circuit chip dissipates at least two watts, and said low power integrated circuit chip dissipates less than two watts.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-21 | 1992-08-22 | 1993-02-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-21 | 1996-08-22 | 1997-02-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-21 | 2000-08-22 | 2001-02-21 | $7700.00 | Window Closed / Lapsed |