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US4806386A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for forming deposited film

Assignee: Canon Inc
•
Filing: 1987-04-02
•
Granted: 1989-02-21
•
Expires: 2007-04-02
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Abstract

Abstract An apparatus for forming a deposited film comprises a chamber, which can be brought into a reduced pressure, for forming a deposited film on a substrate by introducing a starting gas into said chamber and decomposing or polymerizing said gas, the apparatus is provided with both a means for decomposing or polymerizing said gas by discharging and a means for decomposing or polymerizing said gas by heat.

Inventors

  • 👤 Shunichi Ishihara

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 08:42
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/54; G; G03; G03G; G03G5/00; G03G5/02; G03G5/04; G03G5/08; G03G5/082; G03G5/08214

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 101 words
A method for forming a multi-layer structure deposited film having a plurality of layers on a substrate, which comprises forming at least one layer (A) of said multi-layer structure deposited film including silicon and carbon atoms by decomposition or polymerization of a first starting gas by heat, said first starting gas containing (CH 3 ) 3 Si 2 H 3 , and forming a layer (B) of said multi-layer structure deposited film including silicon atoms by decomposition or polymerization of a second starting gas by discharge energy, said second starting gas being the same or different from said first starting gas.
Claim 2
Independent Claim 101 words
A method for forming a multi-layer structure deposited film having a plurality of layers on a substrate, which comprises forming at least one layer (A) of said multi-layer structure deposited film including silicon and carbon atoms by decomposition or polymerization of a first starting gas by heat, said first starting gas containing (CH 3 ) 3 Si 2 H 3 , and forming a layer (B) of said multi-layer structure deposited film including silicon atoms by decomposition or polymerization of a second starting gas by discharge energy, said second starting gas being the same or different from said first starting gas.
Claim 3
Dependent Claim 20 words
The method according to claim 1 wherein the first starting gas comprises SiH 4 and B 2 H 6 .
Claim 4
Dependent Claim 13 words
The method according to claim 1 wherein the first starting gas contains Ar.
Claim 5
Dependent Claim 19 words
The method according to claim 1 wherein the first starting gas is the same as the second starting gas.
Claim 6
Dependent Claim 17 words
The method according to claim 1 wherein a second layer formed by discharging is an a-SiC layer.
Claim 7
Dependent Claim 21 words
The method according to claim 1 wherein the second starting gas is (CH 3 ) 3 Si 2 H 3 .
Claim 8
Dependent Claim 18 words
The method according to claim 1 wherein the second starting gas comprises SiH 4 and CH 4 .
Claim 9
Dependent Claim 18 words
The method according to claim 1 wherein the second starting gas comprises SiH 4 and CH 4 .
Claim 10
Dependent Claim 13 words
The method according to claim 1 wherein the second starting gas contains Ar.

References Cited (Backward Citations)

US4401689A Cited
US4532196A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-02-21 1992-08-22 1993-02-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-02-21 1996-08-22 1997-02-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-02-21 2000-08-22 2001-02-21 $7700.00 Window Closed / Lapsed

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