US4804410A
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Palladium-base electroless plating solution
Assignee: Ishihara Chemical Co Ltd
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Filing: 1987-02-21
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Granted: 1989-02-14
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Expires: 2007-02-21
Abstract
Abstract PCT No. PCT/JP87/00113 Sec. 371 Date Oct. 21, 1987 Sec. 102(e) Date Oct. 21, 1987 PCT Filed Feb. 21, 1987 PCT Pub. No. WO87/05338 PCT Pub. Date Sep. 11, 1987.The present invention provides a palladium-base electroless plating solution which is excellent in stability and which is capable of forming a satisfactory palladium-base deposit, the solution being an aqueous solution containing (a) a palladium compound, (b) at least one compound of ammonia and amine compounds, (c) an organic compound containing bivalent sulfur, and (d) at least one compound of hypophosphorous acid compounds and boron hydride compounds, and a palladium-base electroless plating solution containing a nickel compound in addition to said electroless plating solution.
Inventors
- 👤 Masaki Haga
- 👤 Kiyotaka Tsuji
- 👤 Hidemi Nawafune
- 👤 Shozo Mizumoto
- 👤 Ei Uchida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:53
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/42; C23C18/44; H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
93 words
A palladium-based electroless plating solution consisting essentially of an aqueous solution of effective components, wherein said effective components consist essentially of the following components in the following concentrations: (a) 0.0001 to 0.5 mole/l of a palladium compound, (b) 0.001 to 8 moles/l of at least one compound selected from the group consisting of ammonia and amine compounds, (c) 1 to 500 mg/l of an organic compound containing bivalent sulfur, and (d) 0.005 to 1 mole/l of at least one compound selected from the group consisting of hypophosphorous acid compounds and boron hydride compounds.
Claim 2
Dependent Claim
93 words
A palladium-based electroless plating solution consisting essentially of an aqueous solution of effective components, wherein said effective components consist essentially of the following components in the following concentrations: (a) 0.0001 to 0.5 mole/l of a palladium compound, (b) 0.001 to 8 moles/l of at least one compound selected from the group consisting of ammonia and amine compounds, (c) 1 to 500 mg/l of an organic compound containing bivalent sulfur, and (d) 0.005 to 1 mole/l of at least one compound selected from the group consisting of hypophosphorous acid compounds and boron hydride compounds.
Claim 3
Dependent Claim
21 words
A palladium-base electroless plating solution according to claim 1 wherein the amine compounds are monoamines, diamines polyamines, amino acids and imidazolines.
Claim 4
Dependent Claim
17 words
A palladium-base electroless plating solution according to claim 1 wherein the amine compounds are diamines and polyamines.
Claim 5
Dependent Claim
17 words
A palladium-base electroless plating solution according to claim 1 wherein the amine compounds are ethylenediamine and diethylenetriamine.
Claim 6
Dependent Claim
27 words
A palladium-base electroless plating solution according to claim 1 wherein the organic compound contaning bivalent sulfur is at least one compound of mercaptans, sulfides, disulfides, thiazoles, ##STR6##
Claim 7
Dependent Claim
25 words
A palladium-base electroless plating solution according to claim 1 wherein the organic compound containing bivalent sulfur is at least one compound of sulfides and disulfides.
Claim 8
Dependent Claim
21 words
A palladium-base electroless plating solution according to claim 1 which has a pH of about about 5 to about 10 .
Claim 9
Dependent Claim
102 words
A palladium-based electroless plating solution consisting essentially of an aqueous solution of effective components, wherein said effective components consist essentially of the following components in the following concentrations: (a) 0.0001 to 0.5 mole/l of a palladium compound, (b) 0.001 to 1 mole/l of a nickel compound, (c) 0.001 to 8 moles/l of at least one compound selected from the group consisting of ammonia and amine compounds, (d) 1 to 500 mg/l of an organic compound containing bivalent sulfur, and (e) 0.005 to 1 mole/l of at least one compound selected from the group consisting of hypophosphorous acid compounds and boron hydride compounds.
Claim 10
Dependent Claim
102 words
A palladium-based electroless plating solution consisting essentially of an aqueous solution of effective components, wherein said effective components consist essentially of the following components in the following concentrations: (a) 0.0001 to 0.5 mole/l of a palladium compound, (b) 0.001 to 1 mole/l of a nickel compound, (c) 0.001 to 8 moles/l of at least one compound selected from the group consisting of ammonia and amine compounds, (d) 1 to 500 mg/l of an organic compound containing bivalent sulfur, and (e) 0.005 to 1 mole/l of at least one compound selected from the group consisting of hypophosphorous acid compounds and boron hydride compounds.
Claim 11
Dependent Claim
21 words
A palladium-base electroless plating solution according to claim 8 wherein the amine compounds are monoamines, diamines, polyamines, aminio acids and imidazolines.
Claim 12
Dependent Claim
17 words
A palladium-base electroless plating solution according to claim 8 wherein the amine compounds are diamines and polyamines.
Claim 13
Dependent Claim
17 words
A palladium-base electroless plating solution according to claim 8 where the amine compounds are ethylenediamine and diethylenetriamine.
Claim 14
Dependent Claim
27 words
A palladium-base electroless plating solution according to claim 8 wherein the organic compound containing bivalent sulfur is at least one compound of mercaptans, sulfides, disulfides, thiazoles, ##STR7##
Claim 15
Dependent Claim
25 words
A palladium-base electroless plating solution according to claim 8 wherein the organic compound containing bivalent sulfur is at least one compound of sulfides and disulfides.
Claim 16
Dependent Claim
19 words
A palladium-base electroless plating solution according to claim 8 which has a pH of about 5 to about 11.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-14 | 1992-08-15 | 1993-02-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-14 | 1996-08-15 | 1997-02-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-14 | 2000-08-15 | 2001-02-14 | $7700.00 | Window Closed / Lapsed |