US4796560A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Automatic solder paste application to circuit boards
Assignee: Nortel Networks Ltd
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Filing: 1988-07-11
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Granted: 1989-01-10
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Expires: 2008-07-11
Abstract
Abstract Solder paste is automatically applied to circuit boards, in predetermined amounts at predetermined positions by providing a plurality of holes in a nylon, "Delrin," "Teflon" or other plastic-metal plate, the holes being in a predetermined pattern, filling solder paste into the holes which are facing in an upward direction pivoting the plate over the circuit board, and ejecting the solder paste onto a circuit board. Conveniently the solder paste is ejected by pins mounted on a further plate and reciprocated in the holes. The position of the pins in the holes during filling determines the amount of solder paste filled into the holes.
Inventors
- 👤 Jean P. Berger
- 👤 Evans H. Pridgen
- 👤 Alfred W. Owens
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:16
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H05K3/3485; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/0195; H05K2203/03; H05K2203/0338
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
75 words
Apparatus for the application of solder paste to a circuit board, comprising: (a) a perforated plate, the perforations in the plate being in a predetermined pattern facing in an upward direction; (b) means for filling solder paste downwardly into said perforations; (c) means for rotating said plate 180° to a location adjacent a circuit board wherein said perforations face downwardly; and (d) means for ejecting the solder paste from said perforations onto the circuit board.
Claim 2
Dependent Claim
75 words
Apparatus for the application of solder paste to a circuit board, comprising: (a) a perforated plate, the perforations in the plate being in a predetermined pattern facing in an upward direction; (b) means for filling solder paste downwardly into said perforations; (c) means for rotating said plate 180° to a location adjacent a circuit board wherein said perforations face downwardly; and (d) means for ejecting the solder paste from said perforations onto the circuit board.
Claim 3
Dependent Claim
26 words
Apparatus as claimed in claim 1, wherein said means for ejecting the solder paste comprises a pin mounted for axial reciprocation in each of said perforations.
Claim 4
Dependent Claim
52 words
Apparatus as claimed in claim 2, wherein said pin has a filling position with its outer end within the aperture and an ejecting position with its outer end extending beyond the surface of the plate, the pin being moveable from said filling position to said ejecting position to eject the solder paste.
Claim 5
Dependent Claim
12 words
Apparatus as claimed in claim 3, wherein said filling position is variable.
Claim 6
Dependent Claim
14 words
Apparatus as claimed in claim 1, wherein said plate includes a layer of plastic.
Claim 7
Dependent Claim
14 words
Apparatus as claimed in claim 1, wherein said plate includes a layer of polytetrafluoroethylene.
Claim 8
Dependent Claim
41 words
Apparatus as claimed in claim 1, wherein said means for filling said holes comprising a screen tray with means therein for forcing the solder paste through the screen and being mounted for reciprocation above the front face of said perforated plate.
Claim 9
Dependent Claim
21 words
Apparatus as claimed in claim 1, including a pattern of holes comprising a grid, said holes arranged in columns and rows.
Claim 10
Dependent Claim
31 words
Apparatus as claimed in claim 1, including pins mounted on a second plate and extending only into those holes in said perforated plate from which solder paste is to be ejected.
Claim 11
Dependent Claim
30 words
Apparatus as claimed in claim 1, wherein said holes positioned in said one plate in a pattern conforming to a desired pattern of solder paste dots on the circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-01-10 | 1992-07-11 | 1993-01-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-01-10 | 1996-07-11 | 1997-01-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-01-10 | 2000-07-11 | 2001-01-10 | $7700.00 | Window Closed / Lapsed |