US4795671A
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Para-phenylene sulfide block copolymers, process for the production of the same and use thereof
Assignee: Kureha Corp
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Filing: 1987-12-16
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Granted: 1989-01-03
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Expires: 2007-12-16
Abstract
Abstract A para-phenylene sulfide block copolymer consisting essentially of a recurring unit (A) ##STR1## and a recurring unit (B) ##STR2## said recurring units (A) being present in the form of a block of 20 to 5,000 units of (A) on the average in the molecular chain, the mol fraction of the recurring units (A) being in the range of 0.50 to 0.98, the block copolymer having a melt viscosity (η*) of 50 to 100,000 poise as determined at 310° C. at a shear rate of 200 sec -1 and having: (a) a glass transition temperature (Tg) of 20° to 80° C., (b) a crystalline melting point (Tm) of 250° to 285° C., and (c) a crystallization index (Ci) of 15 to 45, this value being that of the heat-treated, but not stretch-oriented copolymer, which block copolymer is preferably produced by a process comprising a first step of heating an aprotic polar organic solvent containing a dihaloaromatic compound consisting essentially of a m-dihalobenzene and an alkali metal sulfide to form a reaction liquid (e) containing a m-phenylene sulfide polymer consisting essentially of recurring units (B) ##STR3## and a second step of adding a p-dihalobenzene to the reaction liquid (E) and heating the mixture in the presence of an alkali metal sulfide an an aprotic polar organic solvent to form a block copolymer consisting essentially of the recurring units (B) and recurring units (A) ##STR4##
Inventors
- 👤 Zenya Shiiki
- 👤 Takayuki Katto
- 👤 Yo Iizuka
- 👤 Takao Iwasaki
- 👤 Toshitaka Kouyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 00:42
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/301; C; C08; C08G; C08G75/00; C08G75/02; C08G75/0204; C08G75/0231; C08G75/0245; C08G75/025; C08G75/0254; D; D01; D01F; D01F6/00; D01F6/58; D01F6/76; D01F6/765; D01F6/78; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0333; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24893; Y10T428/24909; Y10T428/24917; Y10T428/31504; Y10T428/31533
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
316 words
A printed circuit board comprising an insulating base board made of a composite of 50 to 95 vol. % of a polymer comprising mainly a phenylene sulfide block copolymer and 5 to 50 vol. % of a fibrous reinforcing material and a metal layer of a circuit pattern formed on the insulating base board, said block copolymer being produced by a process comprising a first step of heating an aprotic polar organic solvent containing a dihaloaromatic compound consisting essentially of a m-dihalobenzene and an alkali metal sulfide to form a reaction liquid (E) containing a m-phenylene sulfide polymer consisting essentially of recurring units (B) ##STR47## and a second step of adding a p-dihalobenzene to the reaction liquid (E) and heating the mixture in the presence of an alkali metal sulfide and an aprotic polar organic solvent to form a block copolymer consisting essentially of the recurring units (B) and recurring units (A) ##STR48## the reaction in the first step being carried out until the average degree of polymerization of at least 2 and in the range of ##EQU7## wherein X represents a mol fraction of the recurring units (A) in the resulting block copolymer which is in the range of 0.50 to 0.98 has been obtained; the reaction in the second step being carried out until the mol fraction (X) of the recurring units (A) in the resulting block copolymer has become 0.50 to 0.98; and the reactions in these steps being carried out so that the resulting p-phenylene sulfide block copolymer will have a melt viscosity (η*) measured under conditions of 310° C./200 sec -1 of 300 to 50,000 poise and have: (a) a glass transition temperature (Tg) of 20° to 80° C., (b) a crystalline melting point (Tm) of 200° to 350° C., and (c) a crystallization index (Ci) of 15 to 45, this value being that of the heat-treated, but not stretch-oriented copolymer.
Claim 2
Dependent Claim
316 words
A printed circuit board comprising an insulating base board made of a composite of 50 to 95 vol. % of a polymer comprising mainly a phenylene sulfide block copolymer and 5 to 50 vol. % of a fibrous reinforcing material and a metal layer of a circuit pattern formed on the insulating base board, said block copolymer being produced by a process comprising a first step of heating an aprotic polar organic solvent containing a dihaloaromatic compound consisting essentially of a m-dihalobenzene and an alkali metal sulfide to form a reaction liquid (E) containing a m-phenylene sulfide polymer consisting essentially of recurring units (B) ##STR47## and a second step of adding a p-dihalobenzene to the reaction liquid (E) and heating the mixture in the presence of an alkali metal sulfide and an aprotic polar organic solvent to form a block copolymer consisting essentially of the recurring units (B) and recurring units (A) ##STR48## the reaction in the first step being carried out until the average degree of polymerization of at least 2 and in the range of ##EQU7## wherein X represents a mol fraction of the recurring units (A) in the resulting block copolymer which is in the range of 0.50 to 0.98 has been obtained; the reaction in the second step being carried out until the mol fraction (X) of the recurring units (A) in the resulting block copolymer has become 0.50 to 0.98; and the reactions in these steps being carried out so that the resulting p-phenylene sulfide block copolymer will have a melt viscosity (η*) measured under conditions of 310° C./200 sec -1 of 300 to 50,000 poise and have: (a) a glass transition temperature (Tg) of 20° to 80° C., (b) a crystalline melting point (Tm) of 200° to 350° C., and (c) a crystallization index (Ci) of 15 to 45, this value being that of the heat-treated, but not stretch-oriented copolymer.
Claim 3
Dependent Claim
18 words
The printed circuit board according to claim 1 wherein the p-dihalobenzene is p-dichlorobenzene and the m-dihalobenzene is m-dichlorobenzene.
Claim 4
Dependent Claim
16 words
The printed circuit board according to claim 1 wherein the alkali metal sulfide is sodium sulfide.
Claim 5
Dependent Claim
17 words
The printed circuit board according to claim 1 wherein the aprotic polar solvent is an organic amide.
Claim 6
Dependent Claim
13 words
The printed circuit board according to claim 4 wherein the amide is N-methylpyrrolidone.
Claim 7
Dependent Claim
300 words
A printed circuit board comprising an insulating base board made of a composite of 50 to 95 vol. % of a polymer mainly comprising a phenylene sulfide block copolymer and 5 to 50 vol. % of a fibrous reinforcing material and a metal layer of a circuit pattern formed on the insulating base board, said block copolymer being produced by a process which comprises a first step of heating an aprotic polar organic solvent containing a p-dihalobenzene and an alkali metal sulfide to form a reaction liquid (C) containing a p-phenylene sulfide polymer of recurring units (A) ##STR49## and a second step of adding a dihaloaromatic compound consisting essentially of a m-dihalobenzene to the reaction liquid (C) and heating the mixture in the presence of an alkali metal sulfide and an aprotic polar organic solvent to form a block copolymer consisting essentially of a block consisting essentially of recurring units (A) and a block consisting essentially of recurring units (B) ##STR50## the reaction in the first step being carried out until the degree of polymerization of the recurring units (A) has become 20 to 5,000 of (A) on the average; the reaction in the second step being carried out until the mol fraction (X) of the recurring units (A) in the resulting block copolymer has become 0.50 to 0.98; and the reactions in these steps being carried out so that the resulting p-phenylene sulfide block copolymer will have a melt viscosity (η*) measured under conditions of 310° C./200 sec -1 of 300 to 50,000 poise and have: (a) a glass transition temperature (Tg) of 20° to 80° C., (b) a crystalline melting point (Tm) of 200° to 350° C., and (c) a crystallization index (Ci) of 15 to 45, this value being that of the heat-treated, but not stretch-oriented copolymer.
Claim 8
Dependent Claim
300 words
A printed circuit board comprising an insulating base board made of a composite of 50 to 95 vol. % of a polymer mainly comprising a phenylene sulfide block copolymer and 5 to 50 vol. % of a fibrous reinforcing material and a metal layer of a circuit pattern formed on the insulating base board, said block copolymer being produced by a process which comprises a first step of heating an aprotic polar organic solvent containing a p-dihalobenzene and an alkali metal sulfide to form a reaction liquid (C) containing a p-phenylene sulfide polymer of recurring units (A) ##STR49## and a second step of adding a dihaloaromatic compound consisting essentially of a m-dihalobenzene to the reaction liquid (C) and heating the mixture in the presence of an alkali metal sulfide and an aprotic polar organic solvent to form a block copolymer consisting essentially of a block consisting essentially of recurring units (A) and a block consisting essentially of recurring units (B) ##STR50## the reaction in the first step being carried out until the degree of polymerization of the recurring units (A) has become 20 to 5,000 of (A) on the average; the reaction in the second step being carried out until the mol fraction (X) of the recurring units (A) in the resulting block copolymer has become 0.50 to 0.98; and the reactions in these steps being carried out so that the resulting p-phenylene sulfide block copolymer will have a melt viscosity (η*) measured under conditions of 310° C./200 sec -1 of 300 to 50,000 poise and have: (a) a glass transition temperature (Tg) of 20° to 80° C., (b) a crystalline melting point (Tm) of 200° to 350° C., and (c) a crystallization index (Ci) of 15 to 45, this value being that of the heat-treated, but not stretch-oriented copolymer.
Claim 9
Dependent Claim
18 words
The printed circuit board according to claim 6 wherein the p-dihalobenzene is p-dichlorobenzene and the m-dihalobenzene is m-dichlorobenzene.
Claim 10
Dependent Claim
16 words
The printed circuit board according to claim 6 wherein the alkali metal sulfide is sodium sulfide.
Claim 11
Dependent Claim
17 words
The printed circuit board according to claim 6 wherein the aprotic polar solvent is an organic amide.
References Cited (Backward Citations)
US4595623A
Cited
US4568603A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-01-03 | 1992-07-04 | 1993-01-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-01-03 | 1996-07-04 | 1997-01-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-01-03 | 2000-07-04 | 2001-01-03 | $7700.00 | Window Closed / Lapsed |