US4786965A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Eletronic endoscope with an imaging device having side bonding pads
Assignee: Olympus Corp
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Filing: 1987-08-10
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Granted: 1988-11-22
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Expires: 2007-08-10
Abstract
Abstract An electronic endoscope, equipped with an imaging apparatus having side bonding pads, is provided with a flexible insertable part which is formed to be small in diameter. Within a tip of the insertable part, a solid state imaging device is formed and a solid state imaging chip is provided with chip side bonding pads. The solid state imaging chip is secured to a base provided with base side bonding pads in groups. The chip side bonding pads and base side bonding pads are connected respectively with each other through bonding wires. The chip side bonding pads are provided on one side of the image area in a plurality of rows.
Inventors
- 👤 Hisao Yabe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 20:15
CPC Classifications
A; A61; A61B; A61B1/00; A61B1/04; A61B1/05; H; H04; H04N; H04N23/00; H04N23/50; H04N23/54; H04N23/555
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
155 words
An electronic endoscope comprising: an operating part; a flexible insertable part formed to have a diameter which is smaller than a diameter of the operating part; contents of said flexible insertable part including at least a light guide arranged over an entire length within said insertable part; a solid state imaging device provided within a tip of said insertable part, provided substantially at right angles with an axial direction of the insertable part and provided in a space enclosed with an inside diameter of the insertable part and said contents; a solid state imaging chip forming said solid state imaging device and having an image area and chip side bonding pads provided along one side of said image area; a base securing said solid state imaging chip; base side bonding pads provided in groups on said base; and bonding wires connecting said chip side bonding pads and base side bonding pads respectively with each other.
Claim 2
Dependent Claim
155 words
An electronic endoscope comprising: an operating part; a flexible insertable part formed to have a diameter which is smaller than a diameter of the operating part; contents of said flexible insertable part including at least a light guide arranged over an entire length within said insertable part; a solid state imaging device provided within a tip of said insertable part, provided substantially at right angles with an axial direction of the insertable part and provided in a space enclosed with an inside diameter of the insertable part and said contents; a solid state imaging chip forming said solid state imaging device and having an image area and chip side bonding pads provided along one side of said image area; a base securing said solid state imaging chip; base side bonding pads provided in groups on said base; and bonding wires connecting said chip side bonding pads and base side bonding pads respectively with each other.
Claim 3
Dependent Claim
18 words
An electronic endoscope according to claim 1 wherein said base side bonding pads are respectively of different heights.
Claim 4
Dependent Claim
18 words
An electronic endoscope according to claim 1 wherein said solid state imaging chip has a rectangular plate-like form.
Claim 5
Dependent Claim
29 words
An electronic endoscope according to claim 1 wherein said chip side bonding pads are arranged in a row along one of four sides of said solid state imaging chip.
Claim 6
Dependent Claim
24 words
An electronic endoscope according to claim 1 wherein said base has a protruded part on which said base side bonding pads can be arranged.
Claim 7
Dependent Claim
41 words
An electronic endoscope according to claim 1 wherein said base has on a front surface a low bonding pad part and high bonding pad part which are formed like steps and on which said base side bonding pads can be arranged.
Claim 8
Dependent Claim
25 words
An electronic endoscope according to claim 1 wherein each base side bonding pad is one end surface of each lead foot passing through said base.
Claim 9
Dependent Claim
27 words
An electronic endoscope according to claim 1 wherein said base side bonding pads are provided on a low bonding pad part and a high bonding pad part.
Claim 10
Dependent Claim
33 words
An electronic endoscope according to claim 6 wherein a thickness of said low bonding part is thinner than a thickness of a base including said solid state imaging chip secured to the base.
Claim 11
Dependent Claim
33 words
An electronic endoscope according to claim 6, wherein the thickness of said high bonding part is thicker than a thickness of a base including said solid state imaging chip secured to the base.
Claim 12
Dependent Claim
25 words
An electronic endoscope according to claim 7 wherein said base side bonding pads are arranged in a plurality of rows and at a high density.
Claim 13
Dependent Claim
30 words
An electronic endoscope according to claim 7 wherein each lead foot is formed to be thick on the base side bonding pad side and thin on the back surface side.
Claim 14
Dependent Claim
22 words
An electronic endoscope according to claim 7 wherein said lead feet are secured on the base back surface by a sealing resin.
Claim 15
Dependent Claim
31 words
An electronic endoscope according to claim 7 wherein said bonding wires connected to said base side bonding pads are made to three-dimensionally intersect respectively with each other without contacting each other.
Claim 16
Dependent Claim
27 words
An electronic endoscope according to claim 8 wherein said base side bonding pads are arranged in two rows along one side of said solid state imaging chip.
Claim 17
Dependent Claim
19 words
An electronic endoscope according to claim 15 wherein said base side bonding pads are arranged alternately with each other.
Claim 18
Dependent Claim
23 words
An electronic endoscope according to claim 15 wherein said bonding wires connected to said base side bonding pads are parallel with each other.
Claim 19
Dependent Claim
25 words
An electronic endoscope according to claim 1 wherein the base is chamfered in a corner part positioned on the insertable part tip inside diameter side.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-22 | 1992-05-23 | 1992-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-22 | 1996-05-23 | 1996-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-22 | 2000-05-23 | 2000-11-22 | $7700.00 | Window Closed / Lapsed |