US4783359A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic signal time dealy device and method of making the same
Assignee: Rogers Corp
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Filing: 1986-11-18
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Granted: 1988-11-08
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Expires: 2006-11-18
Abstract
Abstract A preferably low dielectric constant polymeric bonding layer is applied or bonded (i.e., laminated or coated) to at least one side of a preferably low dielectric constant polymeric delay line substrate. Preferably, the melting or softening point of the bonding film is lower than the melting or softening point of the substrate so that the application (e.g. lamination) step is carried out at a temperature which is above the softening point of the bonding film, but below the softening point of the substrate (thereby insuring the integrity of the delay line circuit). Thereafter, the delay line/bonding layer assembly is rolled up and head sealed so as to melt the bonding layer, thus heat sealing the delay line package. As the package heats up (in, for example, a tightly fitting die), the materials expand and provide sufficient pressure to bond the circuit together.
Inventors
- 👤 Cathy A. Fleischer
- 👤 Richard T. Traskos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:51
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0248; H01; H01P; H01P9/00; H05K1/024; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4635; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/015; H05K2201/0183; H05K2201/0195; H05K2201/05; H05K2201/051; H05K2201/09; H05K2201/09209; H05K2201/09218; H05K2201/09263; H05K2201/0929; H05K2201/09336; H05K3/38; H05K3/386; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/3154
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
162 words
An electronic signal time delay device for use in a circuit pattern comprising: coplanar flexible circuit means, said flexible circuit means including a nonconductive polymeric substrate having opposed surfaces, said substrate including electrically conductive material disposed on one of said opposed surfaces; said conductive material comprising a ground plane with a signal line therein, said signal line being separated from said ground plane via a gap on both sides of said signal line; a bonding layer disposed on at least one of said opposed surfaces, said bonding layer comprising a polymeric material having a softening temperature which is less than the softening tempurature of said polymeric substrate; said coplanar flexible circuit means and bonding layer having a longitudinal dimension and being rolled along said longitudinal dimension; and said bonded layer being heated above its softening temperature but below the softening temperature of said substrate wherein said bonding layer will flow to thereby seal and bond said rolled coplanar flexible circuit means together.
Claim 2
Dependent Claim
162 words
An electronic signal time delay device for use in a circuit pattern comprising: coplanar flexible circuit means, said flexible circuit means including a nonconductive polymeric substrate having opposed surfaces, said substrate including electrically conductive material disposed on one of said opposed surfaces; said conductive material comprising a ground plane with a signal line therein, said signal line being separated from said ground plane via a gap on both sides of said signal line; a bonding layer disposed on at least one of said opposed surfaces, said bonding layer comprising a polymeric material having a softening temperature which is less than the softening tempurature of said polymeric substrate; said coplanar flexible circuit means and bonding layer having a longitudinal dimension and being rolled along said longitudinal dimension; and said bonded layer being heated above its softening temperature but below the softening temperature of said substrate wherein said bonding layer will flow to thereby seal and bond said rolled coplanar flexible circuit means together.
Claim 3
Dependent Claim
15 words
The device of claim 1 wherein: said polymeric substrate is comprised of a thermoplastic material.
Claim 4
Dependent Claim
12 words
The device of claim 2 wherein: said thermoplastic substrate comprises a fluoropolymer.
Claim 5
Dependent Claim
35 words
The device of claim 3 wherein: said fluoropolymer is selected from the group comprising polytetrafluoroethylene, a copolymer having a tetrafluoroethylene backbone with a fully fluorinated alkoxy side chain and a copolymer of tetrafluoroethylene and hexafluoropropylene.
Claim 6
Dependent Claim
22 words
The device of claim 2 wherein: said thermoplastic substrate has a melting temperature of between about 260° C. to about 330° C.
Claim 7
Dependent Claim
20 words
The device of claim 2 wherein: said thermoplastic substrate has a dielectric constant of between about 2 to about 2.9.
Claim 8
Dependent Claim
16 words
The device of claim 1 wherein: said polymeric bonding layer is comprised of a thermoplastic material.
Claim 9
Dependent Claim
13 words
The device of claim 7 wherein: said thermoplastic bonding layer comprises a fluoropolymer.
Claim 10
Dependent Claim
33 words
The device of claim 8 wherein: said fluoropolymer is selected from the group comprising ethylene tetrafluoroethylene, fluorinated ethylene-propylene copolymer and a copolymer having a tetrafluoroethylene backbone with a full fluorinated alkoxy side chain.
Claim 11
Dependent Claim
22 words
The device of claim 7 wherein: said bonding layer has a softening temperature of between about 220° C. to about 320° C.
Claim 12
Dependent Claim
20 words
The device of claim 7 wherein: said bonding layer has a dielectric constant of between about 2.0 to about 2.9.
Claim 13
Dependent Claim
23 words
The device of claim 1 wherein: the dielectric constant of the bonding layer is substantially matched with the dielectrc constant of the substrate.
Claim 14
Dependent Claim
29 words
The device of claim 1 wherein: said substrate is comprised of a material having a high permeability; and said bonding layer is comprised of a material having high permeability.
Claim 15
Dependent Claim
11 words
The device of claim 8 wherein: said fluoropolymer is microglass reinforced.
Claim 16
Dependent Claim
11 words
The device of claim 3 wherein: said fluoropolymer is glass reinforced.
References Cited (Backward Citations)
US4303959A
Cited
US4376927A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-11-08 | 1992-05-09 | 1992-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-11-08 | 1996-05-09 | 1996-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-11-08 | 2000-05-09 | 2000-11-08 | $7700.00 | Window Closed / Lapsed |