US4771159A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of soldering leadless component carriers or the like
Assignee: General Dynamics Government Systems Corp
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Filing: 1987-05-27
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Granted: 1988-09-13
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Expires: 2007-05-27
Abstract
Abstract A method of soldering leadless component carriers or the like to printed circuit boards uses a solder paste containing copper spheres in addition to particulate solder and flux. The solder is melted and the copper spheres are embedded in the resulting solder matrix, offsetting the carrier from the printed circuit board.
Inventors
- 👤 Daniel J. O'Leary
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 00:35
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/20; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; B23K35/025; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/3465; H05K3/3485; B23K2101/00; B23K2101/36; B23K2101/42; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2201/10613; H05K2201/10621; H05K2201/10727; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
84 words
A method of soldering leadless component carriers to a printed circuit board comprising the steps of: (a) providing a solder paste including particulate solder, flux, and solder plated copper powder; (b) applying said solder paste to said printed circuit board; (c) mounting a leadless component carrier to said printed circuit board; and (d) heating said solder paste until the particulate solder melts and flows; thereby soldering said leadless component carrier to said printed circuit board, said copper powder remaining in the resulting solder matrix.
Claim 2
Independent Claim
84 words
A method of soldering leadless component carriers to a printed circuit board comprising the steps of: (a) providing a solder paste including particulate solder, flux, and solder plated copper powder; (b) applying said solder paste to said printed circuit board; (c) mounting a leadless component carrier to said printed circuit board; and (d) heating said solder paste until the particulate solder melts and flows; thereby soldering said leadless component carrier to said printed circuit board, said copper powder remaining in the resulting solder matrix.
Claim 3
Dependent Claim
25 words
The method of claim 1 wherein said copper powder is in the form of copper spheres in the range of 60 mesh to 180 mesh.
References Cited (Backward Citations)
JPS4411507Y1
Cited
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-09-13 | 1992-03-14 | 1992-09-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-09-13 | 1996-03-14 | 1996-09-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-09-13 | 2000-03-14 | 2000-09-13 | $7700.00 | Window Closed / Lapsed |