Process for activating substrate surfaces for electroless metallization

Claim 1

A process for the activation of substate surfaces for the purpose of currentless metallization, consisting essentially of the steps in which the surface to be metallized is treated with an activator compound homogeneously distributed in a solvent, the solvent is removed and the activator compound adhering to the surface to be metallized is reduced by use of a reducing agent contained in the metallization bath wherein the treating of the substrate surface with activator compound and solvent removal are effected at 0° to 80° C. and the activator compound is a palladium dichloride complex which exhibits at least one ligand containing a group with C--C or C--N double or triple bond or a group capable of chelate formation selected from OH, SH, CO, CS, or COOH for binding the metal therein and at least one ligand containing a carboxylic acid group, carboxylic acid halide group, carboxylic acid anhydride group, carboxylic acid ester group, carboamide group, carbonimide group, aldehyde group, ketone group, ether group, sulphoamide group, sulphonic acid group, sulphonate group, sulphonic acid halide group, sulphonic acid ester group, halogen-containing heterocyclic group, activated double bond, amino group, hydroxyl group, isocyanate group, olefin group, acetylene group, mercapto group or epoxide group for fixing the activator compound to the substrate surface.