Abstract A process for laser welding a cover and a casing, each made of aluminum or an aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in sides of the casing, thereby providing holes through which input/output and source terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer on the surface of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and, welding the cover and the casing together by pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight, and sealing the cover and the casing hermetically.
A process for laser welding a cover and a casing with said walls, each made of one of aluminum and aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in the side walls of the casing; plating a nickel layer on the surface of the casing; inserting input/output and source terminals through the holes bored in the side walls of the casing; soldering the input/output and source terminals within the holes bored in the side walls of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and welding the cover and the casing together by a pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight and sealing the cover and the casing hermetically.
Claim 2
Dependent Claim
144 words
A process for laser welding a cover and a casing with said walls, each made of one of aluminum and aluminum-based alloy, via a nickel layer plated thereon, thereby forming a package for electronic devices, the process comprising the steps of: boring holes in the side walls of the casing; plating a nickel layer on the surface of the casing; inserting input/output and source terminals through the holes bored in the side walls of the casing; soldering the input/output and source terminals within the holes bored in the side walls of the casing; mounting electronic devices in the casing and forming necessary connections between the devices and the terminals; and welding the cover and the casing together by a pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight and sealing the cover and the casing hermetically.
Claim 3
Dependent Claim
18 words
A process according to claim 1, wherein the thickness of the nickel layer is 2.5 to 10 μm.