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US4756796A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of producing wafer

Assignee: Mitsubishi Materials Silicon Corp
•
Filing: 1986-10-10
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Granted: 1988-07-12
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Expires: 2006-10-10
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Abstract

Abstract There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by the first flat surface and a cut surface subjected to the cutting; and processing the cut surface of the slice to form a second flat surface, using the first flat surface as a reference surface, thereby providing the wafer.

Inventors

  • 👤 Yuichi Saitou

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 09:25
CPC Classifications
C; C30; C30B; C30B33/00; B; B28; B28D; B28D1/00; B28D1/003; B28D5/00; B28D5/0058; B28D5/0082; B28D5/0094; C30B25/00; C30B25/02; C30B25/18; Y; Y10; Y10S; Y10S438/00; Y10S438/959

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 155 words
A method for producing two or more wafers from an elongated stock whose length is many times greater than the thickness of each wafer, comprising the steps of: (a) providing an elongated stock having an end face with a warped surface due to a prior wafer slicing operation; (b) milling said one end face to remove stock material and to reduce the warp of the surface to form a flat end surface on said stock; (c) cutting transversely through said elongated stock adjacent said one end surface by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by said first flat surface and a cut surface created by said cutting step; (d) milling said cut surface of said slice to form a second flat surface, using said first flat surface as a reference surface to align said second flat surface, thereby providing the wafer with two flat surfaces.
Claim 2
Independent Claim 155 words
A method for producing two or more wafers from an elongated stock whose length is many times greater than the thickness of each wafer, comprising the steps of: (a) providing an elongated stock having an end face with a warped surface due to a prior wafer slicing operation; (b) milling said one end face to remove stock material and to reduce the warp of the surface to form a flat end surface on said stock; (c) cutting transversely through said elongated stock adjacent said one end surface by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by said first flat surface and a cut surface created by said cutting step; (d) milling said cut surface of said slice to form a second flat surface, using said first flat surface as a reference surface to align said second flat surface, thereby providing the wafer with two flat surfaces.
Claim 3
Dependent Claim 26 words
A method according to claim 1, in which the wafer is subjected to stress-relieving annealing to improve the flatness of said first and second flat surface.
Claim 4
Dependent Claim 30 words
A method according to claim 1 wherein the step (b) of milling the end face of the stock comprises mechanically abrading said surface to remove stock and flatten said surface.
Claim 5
Dependent Claim 30 words
A method according to claim 1 wherein the step (b) of milling the end face of the stock comprises mechanically grinding said surface to remove stock and flatten said surface.
Claim 6
Dependent Claim 30 words
A method according to claim 1 wherein the step (b) of milling the end face of the stock comprises mechanically cutting said surface to remove stock and flatten said surface.

References Cited (Backward Citations)

US2886026A Cited
US4084354A Cited
US4276114A Cited
US4228578A Cited
US4261781A Cited
US4465550A Cited
US4554717A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-07-12 1992-01-11 1992-07-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-07-12 1996-01-11 1996-07-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-07-12 2000-01-11 2000-07-12 $7700.00 Window Closed / Lapsed

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